CN106853558A - cold laser fine processing method and system - Google Patents
cold laser fine processing method and system Download PDFInfo
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- CN106853558A CN106853558A CN201510893548.8A CN201510893548A CN106853558A CN 106853558 A CN106853558 A CN 106853558A CN 201510893548 A CN201510893548 A CN 201510893548A CN 106853558 A CN106853558 A CN 106853558A
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Abstract
A kind of method of cold laser retrofit, it comprises the following steps：(1) laser processing technology parameter is set；(2) multi-shaft interlocked motion platform is according to the movement locus of above-mentioned process parameter control laser beam and the movement locus of workpiece；(3) multi-shaft interlocked motion platform controller sends trigger signal according to the locus of laser beam and the locus of workpiece, and the trigger signal can control the open and close of laser.Present invention also offers a kind of system of cold laser retrofit, it includes, generating laser, the processing platform for carrying workpiece, the laser flip flop for controlling laser beam and the multi-shaft interlocked motion platform of processing platform motion, the linkage controller for controlling multi-shaft interlocked motion platform and control generating laser opening and closing for producing laser, wherein, the linkage controller sends according to the locus of laser beam and the locus of workpiece and sends signal to the laser flip flop.
Description
Technical field
The present invention relates to laser machine, more particularly to cold laser fine processing method and system.
Background technology
Fuel factor is not produced without when cold laser, such as ultrashort pulse laser treatment fragile material, there is no heat affected area (HAZ), so as to not produce flash and thermal stress caused by fuel factor etc. when processing.Ultrashort pulse laser includes the picosecond laser of femto-second laser and pulse width less than 10 psecs, also referred to as ultrafast laser.Ultrashort pulse laser material is processed has two ways with treatment：Material modification and material ablation (ablation).Material modification is that refractive index changes after material local absorption cold laser, and retrofit is realized using mechanism such as two-photon polymerized and photochemical reactions.Material ablation (ablation) is that cold laser ablation target produces HTHP plasma.The time that plasma is formed is less than the time that incident pulse energy is transferred to periphery material, therefore will not cause thermal diffusion effect.
At present, typically utilize cold laser, especially ultra-short pulse laser, ablation (ablation) effect to material carries out Laser focus to material more.In material processing, ultrashort pulse causes the removal of material so as to realize the retrofit of material with the interaction of material, while absorbed using the Multi-photon Nonlinear in micro Process region and ionized can realize any material without heat transfer.
When being processed to material with laser, laser is generally constantly in "open" state, while by mobile laser beam and the space three-dimensional relative position of workpiece, so that workpiece is processed into the product for intentionally getting.But, because the locus movement of laser beam and workpiece is generally limited by motion platform, limitation including speed and acceleration, than the precise control of high speed micro-scale relatively difficult to achieve (such as micron dimension size), it is difficult to carry out retrofit.
The content of the invention
In order to overcome above mentioned problem, one aspect of the present invention to provide a kind of method of digitlization ablation " subtracting material inversely to print " Laser Processing, realize the precise control to cold laser retrofit.
According to an aspect of the invention, there is provided a kind of method of cold laser retrofit, it comprises the following steps：
(1) cold laser working process parameter is set according to the final products to be processed；
(2) multi-shaft interlocked motion platform is according to the movement locus of above-mentioned process parameter control laser beam and the movement locus of workpiece；With
(3) multi-shaft interlocked motion platform controller sends trigger signal according to the locus of laser beam and the locus of workpiece, and the trigger signal can control the open and close of laser.
The opening and closing that the method for the present invention passes through cold shock optical generator, instead of the minute movement of multi-shaft interlocked motion platform, it is achieved thereby that to the precise control of cold laser processing.Meanwhile, the method can also realize Three-dimension process of the cold laser to workpiece, even if multi-shaft interlocked motion platform does not have rotary shaft.In a preferred embodiment, in above-mentioned steps (3), the locus of the laser beam and the locus of workpiece are in prestoring or being preset in multi-shaft interlocked motion platform controller.That is, in cold shock light beam during being processed to workpiece, can close or open cold shock optical generator according to the default parameter of final processing request.When cold shock optical generator is opened, cold laser carries out material ablation (ablation) or material modification to workpiece, and when cold laser device is closed, material ablation (ablation) or material modification will not be carried out to workpiece.
In another preferred embodiment, in the step (3), the locus of the laser beam and the locus of workpiece are Real-time Feedbacks to multi-shaft interlocked motion platform controller.That is, in cold shock light beam during being processed to workpiece, multi-shaft interlocked motion platform controller sends the trigger signal of on or off according to the actually located locus of laser beam and workpiece.
The method of the present invention can be digitized laser ablation drilling to the material of arbitrary shape, including circular port, slotted eye, square opening, upright opening, positive bellmouth, reverse bellmouth, biconial hole, threaded hole etc..Part material can be any materials, including metal, nonmetallic, ceramic, semi-conducting material, fragile material (such as glass and sapphire) etc..
An alternative embodiment of the invention, there is provided the method for one kind digitlization ablation " subtracting material inversely to print " Laser Processing, multi-shaft interlocked motion platform reads laser processing technology parameter and controls the locus of laser beam and the locus of workpiece, the locus of laser beam and the locus of workpiece constantly feed back to multi-shaft interlocked motion platform controller, according to the requirement of laser processing technology parameter, multi-shaft interlocked motion platform controller sends the intelligent triggering laser of trigger signal.
According to another embodiment of the invention, laser sends the intelligent triggering of trigger signal and is in "open" state or "off" state according to the requirement of digitalized laser processing technology according to multi-shaft interlocked motion platform controller.The time domain trigger signal of laser and the locus of multi-shaft interlocked motion platform synchronously realize that the digitlization in multi-shaft interlocked three-dimensional laser retrofit is melted.The flexibility of Laser Processing is greatly improved.Three-dimensional " subtracting material inversely to print " is achieved.
The method according to the invention, realize that the laser digitizing of arbitrary shape melts by controlling the open and close of laser generator, i.e. laser digitizing is three-dimensional " subtracting material inversely to print ", so as to the ablation for reaching arbitrary shape drills, including circular port, slotted eye, square opening etc..The hole wall of arbitrary shape can also be processed into.Including upright opening, positive bellmouth, reverse bellmouth, biconial hole, threaded hole etc..This some holes can be used for the processing of engine nozzle.
Another aspect of the present invention, a kind of system for the above method is provided, it includes, generating laser, the processing platform for carrying workpiece, the laser flip flop for controlling laser beam and the multi-shaft interlocked motion platform of processing platform motion, the linkage controller for controlling multi-shaft interlocked motion platform and control generating laser opening and closing for producing laser, wherein, the linkage controller sends according to the locus of laser beam and the locus of workpiece and sends signal to the laser flip flop.
According to one embodiment of present invention, the system can also include a multi-shaft interlocked/laser pulse synchronization device, multi-shaft interlocked/laser pulse synchronization the device can make workpiece and laser pulse all the time be synchronous, ensure in specific time domain, when laser is opened, cold laser focuses on specific point, and the focus of cold laser will not deviate default action site because of the motion of laser beam or the motion of workpiece.So as to ensure accurate processing of the cold laser to workpiece.
According to one embodiment of present invention, multi-shaft interlocked platform is more than three axles or three axles.According to one embodiment of present invention, at least one axle of multi-shaft interlocked platform can be rotation.
Brief description of the drawings
Fig. 1 is existing Laser Processing schematic diagram and block diagram.
Fig. 2 is the block diagram of cold laser processing method of the present invention.
Fig. 3 is the schematic diagram of cold laser processing method of the present invention.
Fig. 4 is a kind of chamfering partial enlarged drawing of cold laser processing method processing of the invention.
Fig. 5 is the chamfering schematic diagram processed with a kind of cold laser processing method of the invention.
Fig. 6 is a kind of schematic diagram of cold laser processing method drilling of the invention.
Specific embodiment
In order that the present invention becomes apparent from understandable, only by way of example, with reference to following Figure, the description present invention applies example：
Fig. 1-a show the schematic diagram of existing laser processing technology.Wherein, 1 is laser beam；2 is Laser Processing path；3 is workpiece；4 is the workpiece after Laser Processing.In conventional multi-shaft interlocked three-dimensional laser retrofit, by the three-dimensional adjustment of the relative position of laser beam and workpiece, so as to form Laser Processing path 2.In whole process, laser beam is constantly in "open" state.Can " being cut away ", the workpiece 4 after formation Laser Processing by the workpiece part of laser action.Fig. 1-b show the block diagram being processed to workpiece by laser.Workpiece is carried and is fixed on platform, and laser transmitter projects laser is processed to workpiece, by the motion of laser beam and platform so as to realize the different processing requests to workpiece.The motion of laser beam and platform realizes that motion drive is controlled by motion controller by motion drive.
Fig. 2-a are the block diagrams of one embodiment of the invention.Multi-shaft interlocked motion platform reads laser processing technology parameter and controls the locus of laser beam and the locus of workpiece.The locus of laser beam and the locus of workpiece constantly feed back to multi-shaft interlocked motion platform controller.According to the requirement of laser processing technology parameter, multi-shaft interlocked motion platform controller sends the on and off of trigger signal intelligentized control method laser, so as to realize multi-shaft interlocked three-dimensional laser retrofit digitlization ablation " subtracting material inversely to print " of any materials.Fig. 2-b are the block diagrams of another embodiment of the present invention.Whether ultrafast laser occurs to be triggered by ultrashort pulse trigger, once after ultrafast laser generation, by multi-shaft interlocked/laser pulse synchronization device, laser beam and the locus of workpiece is set to make it, so that laser beam focus are on accurate position on workpiece.The motion of laser beam and workpiece is controlled by multi-shaft interlocked driver drives, multi-shaft interlocked driver by multi-shaft interlocked control device.
Fig. 3 is that the machining path 2 of laser beam 1 has preset, and laser can send the "open" state or "off" state of trigger signal intelligentized control method laser generator according to multi-shaft interlocked motion platform controller.The bold portion of machining path 2 represents that laser generator is in opening in figure, and laser is in running order；The dotted portion of machining path 2 represents that laser generator is closed, and laser is in off working state.The time domain trigger signal of laser generator and the locus of multi-shaft interlocked motion platform synchronously realize multi-shaft interlocked three-dimensional laser retrofit.Under laser work state, workpiece is melted by digitlization, and laser is closed down, and workpiece is unaffected, so as to form expected machined surface 5 on workpiece 4 after processing.
Fig. 4 show the laser digitizing ablation of arbitrary shape, i.e. laser digitizing three-dimensional " subtracting material inversely to print ".6 is the machined surface formed after workpiece melts through laser digitizing.The laser digitizing ablation of arbitrary shape, i.e. laser digitizing three-dimensional " subtracting material inversely to print " can realize the ablation chamfering of arbitrary shape, such as such as fragile material, glass and sapphire ablation chamfering.
Fig. 5-1 shows that the digitalized laser ablation chamfering of unilateral arbitrary shape, Fig. 5-2 show that the digitalized laser ablation chamfering of bilateral asymmetric arbitrary shape, Fig. 5-3 show and melt chamfering with the digitalized laser of bilateral symmetry arbitrary shape.
Fig. 6 shows that the digitalized laser for carrying out arbitrary shape using Laser focus method of the present invention melts drilling.The material of workpiece 3 can be any materials, including metal, nonmetallic, ceramic, fragile material (such as glass and sapphire) etc..1 is laser beam, 2 is the machining path of laser beam, and arrow is laser beam direction of advance.
Above-described embodiment is described merely by way of example.In the case of without departing from protection domain defined in the appended claims of the invention, there can be various variants.
Claims (9)
1. a kind of method of cold laser retrofit, it comprises the following steps：
(1) laser processing technology parameter is set；
(2) movement locus and processing of the multi-shaft interlocked motion platform according to above-mentioned process parameter control laser beam
The movement locus of part；With
(3) multi-shaft interlocked motion platform controller is according to the locus of laser beam and the space bit of workpiece
Put and send trigger signal, the trigger signal can control the open and close of laser.
2. method according to claim 1, wherein, in the step (3), the laser beam
Locus and the locus of workpiece be to be stored in advance in multi-shaft interlocked motion platform controller.
3. method according to claim 1, wherein, in the step (3), the laser beam
Locus and the locus of workpiece be Real-time Feedback to multi-shaft interlocked motion platform controller.
4. method according to claim 1, wherein, the workpiece is any materials.
5. method according to claim 4, wherein, the workpiece is fragile material.
6. the system of claim 1-5 methods describeds is used for, and it includes, the Laser emission for producing laser
Device, the processing platform for carrying workpiece, the multiaxis connection for controlling laser beam and processing platform motion
Dynamic motion platform, the linkage controller for controlling multi-shaft interlocked motion platform and control generating laser
The laser flip flop of opening and closing, wherein, locus and workpiece of the linkage controller according to laser beam
Locus send and send signal to the laser flip flop.
7. system according to claim 6, it still further comprises multi-shaft interlocked/laser pulse synchronization
Device, so that workpiece and laser pulse are synchronous all the time.
8. system according to claim 6, wherein, the multi-shaft interlocked platform is three axles or three axles
More than.
9. system according to claim 6, wherein, at least one axle of the multi-shaft interlocked platform
It can be rotation.
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| CN201510893548.8A CN106853558A (en) | 2015-12-08 | 2015-12-08 | cold laser fine processing method and system |
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| CN201510893548.8A CN106853558A (en) | 2015-12-08 | 2015-12-08 | cold laser fine processing method and system |
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Citations (5)
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| US20060191884A1 (en) * | 2005-01-21 | 2006-08-31 | Johnson Shepard D | High-speed, precise, laser-based material processing method and system |
| JP2011056521A (en) * | 2009-09-07 | 2011-03-24 | Sumitomo Heavy Ind Ltd | Laser beam machining apparatus, and method for determining machining condition |
| CN102310285A (en) * | 2011-07-27 | 2012-01-11 | 苏州德龙激光有限公司 | Laser processing device of silicon glass bonding slice and method thereof |
| CN103111760A (en) * | 2011-11-17 | 2013-05-22 | 深圳市大族激光科技股份有限公司 | Z-axis idle stroke copying control method and system and laser cutting machine |
| CN204747769U (en) * | 2015-05-27 | 2015-11-11 | 华中科技大学 | Laser on line measurement processes detection device |
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2015
- 2015-12-08 CN CN201510893548.8A patent/CN106853558A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060191884A1 (en) * | 2005-01-21 | 2006-08-31 | Johnson Shepard D | High-speed, precise, laser-based material processing method and system |
| JP2011056521A (en) * | 2009-09-07 | 2011-03-24 | Sumitomo Heavy Ind Ltd | Laser beam machining apparatus, and method for determining machining condition |
| CN102310285A (en) * | 2011-07-27 | 2012-01-11 | 苏州德龙激光有限公司 | Laser processing device of silicon glass bonding slice and method thereof |
| CN103111760A (en) * | 2011-11-17 | 2013-05-22 | 深圳市大族激光科技股份有限公司 | Z-axis idle stroke copying control method and system and laser cutting machine |
| CN204747769U (en) * | 2015-05-27 | 2015-11-11 | 华中科技大学 | Laser on line measurement processes detection device |
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Application publication date: 20170616 |