JP4873129B2 - 基板把持装置 - Google Patents

基板把持装置 Download PDF

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Publication number
JP4873129B2
JP4873129B2 JP2006039116A JP2006039116A JP4873129B2 JP 4873129 B2 JP4873129 B2 JP 4873129B2 JP 2006039116 A JP2006039116 A JP 2006039116A JP 2006039116 A JP2006039116 A JP 2006039116A JP 4873129 B2 JP4873129 B2 JP 4873129B2
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Japan
Prior art keywords
substrate
gripping
gripping means
rotation support
weight
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Expired - Fee Related
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JP2006039116A
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English (en)
Japanese (ja)
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JP2007220868A5 (cg-RX-API-DMAC7.html
JP2007220868A (ja
Inventor
信一 勝田
泰広 圓山
崇之 今中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
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Yaskawa Electric Corp
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Priority to JP2006039116A priority Critical patent/JP4873129B2/ja
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Publication of JP4873129B2 publication Critical patent/JP4873129B2/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2006039116A 2006-02-16 2006-02-16 基板把持装置 Expired - Fee Related JP4873129B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006039116A JP4873129B2 (ja) 2006-02-16 2006-02-16 基板把持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006039116A JP4873129B2 (ja) 2006-02-16 2006-02-16 基板把持装置

Publications (3)

Publication Number Publication Date
JP2007220868A JP2007220868A (ja) 2007-08-30
JP2007220868A5 JP2007220868A5 (cg-RX-API-DMAC7.html) 2009-01-29
JP4873129B2 true JP4873129B2 (ja) 2012-02-08

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ID=38497821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006039116A Expired - Fee Related JP4873129B2 (ja) 2006-02-16 2006-02-16 基板把持装置

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JP (1) JP4873129B2 (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9732416B1 (en) 2007-04-18 2017-08-15 Novellus Systems, Inc. Wafer chuck with aerodynamic design for turbulence reduction
JP4819010B2 (ja) 2007-09-04 2011-11-16 東京エレクトロン株式会社 処理装置、処理方法および記憶媒体
US8419964B2 (en) 2008-08-27 2013-04-16 Novellus Systems, Inc. Apparatus and method for edge bevel removal of copper from silicon wafers
US8172646B2 (en) * 2009-02-27 2012-05-08 Novellus Systems, Inc. Magnetically actuated chuck for edge bevel removal
KR101681897B1 (ko) * 2009-08-07 2016-12-05 어플라이드 머티어리얼스, 인코포레이티드 이중 온도 히터
JP2013045912A (ja) * 2011-08-25 2013-03-04 Tokyo Electron Ltd 搬送機構
JP2015105167A (ja) * 2013-11-29 2015-06-08 日本板硝子株式会社 ガラス板保持具及びガラス板搬送装置
CN105225995B (zh) * 2014-06-30 2018-03-09 北京北方华创微电子装备有限公司 晶片传输装置和工艺腔室
CN111199909B (zh) * 2018-11-19 2023-06-16 北京北方华创微电子装备有限公司 一种基座组件和半导体加工设备
JP2023083840A (ja) * 2021-12-06 2023-06-16 株式会社ディスコ 中心合わせ装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06155213A (ja) * 1992-11-19 1994-06-03 Hitachi Ltd 回転機構
JPH09232406A (ja) * 1996-02-26 1997-09-05 Sumitomo Sitix Corp ウェーハ移し換え治具
JPH1074816A (ja) * 1996-08-29 1998-03-17 Hitachi Techno Eng Co Ltd ウェファ搬送装置
JP2002368066A (ja) * 2001-06-06 2002-12-20 Tokyo Electron Ltd 処理装置

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Publication number Publication date
JP2007220868A (ja) 2007-08-30

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