JP4868591B2 - Method and apparatus for attaching tape to substrate - Google Patents

Description

  The present invention relates to a method and apparatus for attaching a tape to a substrate, and more specifically, a substrate that does not leave residual stress in a tape attached to a substrate such as a thinned wafer and does not warp the substrate after being attached. The present invention relates to a method and an apparatus for applying a tape to a tape.

  In the semiconductor manufacturing process, various types of tape have been conventionally applied to the substrate. For example, a protective tape is applied to the pattern surface of the wafer on which the pattern is formed, and backside grinding is performed to thin the wafer. To be done. Recently, the thickness of wafers has been reduced due to the development of portable devices, and backside grinding has been performed to a thickness of about 50 μm. In addition, the diameter of the wafer is increased to improve the production efficiency, and many wafers having a diameter of 300 mm or more are handled.

  As described above, when the protective tape is applied to the wafer as the wafer becomes thinner and larger in diameter, if the residual stress remains at the time of application to the protective tape, the wafer is thinned by backside grinding of the wafer. The wafer may be warped, and if the warpage is remarkable, there is a problem that the wafer is damaged or a transport error due to a suction error or the like occurs.

  Moreover, in order to relieve the residual stress of the tape, it is necessary to pay attention to the tension at the time of supplying the tape or when the separator is peeled off when the tape is formed. Therefore, in the tape supply method, when a protective film (equivalent to protective tape) is attached to the surface of the semiconductor wafer, a tensile force opposite to the feeding direction of the protective film is applied, and the magnitude of the tensile force Is adjustable (see, for example, Patent Document 1).

Also, since the separator is formed on the adhesive surface of the protective tape to peel off the separator formed on the tape, if the separator is forcibly pulled and peeled, even if the separator is subjected to a release treatment, A tensile force is generated with respect to the protective tape due to the adhesive force of the protective tape, and a residual stress is generated in the protective tape. For this reason, a method is disclosed in which a peeling substrate (corresponding to a separator) is peeled for a predetermined length to be in a relaxed state, and a protective tape is attached to an adherend in a state where the peeling tension is relaxed (for example, Patent Documents). 2).
Japanese Patent No. 3759820 (Claim 1, FIG. 6) JP 2002-280338 A (FIG. 5, FIG. 6, FIG. 7, FIG. 8)

  By the way, although the method of the said patent document 1 is adjusting tension | tensile_strength at the time of affixing to a to-be-adhered body by giving tension | pulling in the reverse direction to the feed direction of a protective film, a to-be-adhered body and a protective film affix. It is necessary to increase the tension in order not to bond it before. That is, if the tension is weak, the protective film hangs down and sticks to the wafer, causing wrinkles and bubbles. Therefore, when the tension is increased, residual stress remains in the protective film, and thus there is a problem that the mechanism for controlling the strength of the tension becomes very complicated.

  Moreover, since the method of patent document 1 has applied the tension | tensile_strength so that a protective film may not droop when sticking a protective film with a sticking roller, there exists a problem that a residual stress generate | occur | produces in a protective film at the time of sticking.

  In the method of Patent Document 2, a separator having a predetermined length is sent out together with the protective tape in a tension-free state. However, after pulling out the predetermined length, it is necessary to wind up the separator. Since the separator is peeled off from the protective tape at an angle greater than the hugging angle, there is a problem that the peeling load becomes large and tension is applied to the protective tape.

  In addition, the protective tape and the separator are made of resin, etc., and due to their flexibility, elongation occurs due to pulling at the time of peeling, and the tensile force propagates to the protective tape and after the protective tape is attached to the wafer, the residual stress There is a problem that the wafer is warped or broken.

  This invention solves the above problems, and when applying the tape to the substrate, when the tape is supplied and the separator is peeled off from the tape, no residual stress is left by preventing the tape from being tensioned, It is an object of the present invention to provide a method and an apparatus for applying a tape to a substrate so that the thinned substrate is not warped or damaged after the tape is applied.

In order to solve the problems as described above, the invention of claim 1 is a method for applying a tape to a substrate in which a separator having a separator attached to one side is peeled off in the middle of a supply path and then attached to a substrate. The amount of tape supplied is controlled so that the tensioning arm is placed on the balance roller provided on the tension arm that swings according to the applied force, and the tension arm angle is read to maintain the tension arm at a predetermined angle. The balance roller is raised by forcibly driving the tension arm during tape application work so that the tension applied to the tape becomes almost zero, and in this state the tape is applied to the substrate and the tape the tension on the tape by controlling the tape feed amount according to the amount of change of the swing angle of the tension arm accompanying the sticking work A tape applying method on the substrate, characterized in that the sum.

  According to a second aspect of the present invention, in the first aspect of the present invention, the separation plate that is movable along the tape supply path is positioned so as to be in contact with the peeling portion of the tape and the separator, and the separator is formed into an acute angle shape of the separation plate. A configuration is adopted in which the separation plate is moved to follow the peeling portion while being folded back and peeled off from the tape at a substantially 180 ° direction.

  The invention of claim 3 employs a configuration in which the cooling air is blown to the tape before the separator peeling of the supply path in the invention of claim 1 or 2.

According to a fourth aspect of the present invention, there is provided a substrate having a long tape supply mechanism having a separator attached to one side, a peeling mechanism for peeling the separator in the tape supply path, and a sticking mechanism for attaching the tape to the substrate. in sticking apparatus tape to a pivotable tension arm having a balance roller for applying a tape in the middle of the supply provided, the said tension arm, raising the balance roller during tape application operation, substantially the tension on the tape An actuator that is forcibly driven to 0 is provided, and the tension arm is configured so that the swing angle changes according to the tension applied to the tape. and characterized in that so as to relieve tension on the tape by controlling the supply amount of tape in accordance with the variation of the dynamic angle That is the sticking apparatus of the tape to the substrate.

  According to a fifth aspect of the present invention, in the invention according to the fourth aspect of the invention, there is provided an acute-angled tip portion that contacts the peeling portion between the separator and the tape from which the peeling mechanism peels and turns the separator in a direction of about 180 °. A configuration is adopted in which a separation plate is provided that can freely move along the supply path of the tape following the movement of the peeling portion due to the peeling of the separator.

  The invention of claim 6 employs a configuration in which, in the invention of claim 4 or 5, a cooling device is provided for blowing cooling air to the tape before separation of the separator.

  This invention is configured as described above, and when supplying the tape to be affixed to the substrate, since the load is not applied to the tape by detecting and driving the angle of the tension arm, no tension is applied to the drawing of the tape, Since there is no residual stress left on the tape, no warping or breakage occurs on the substrate to which the tape is attached, and the tension arm absorbs the slack or tension of the tape, so that the tape is attached to the substrate even when it is free. For example, when the protective tape is attached to the wafer, there is no accident that the protective tape is attached to the wafer by its strong adhesive force.

In addition, the tension load is made almost zero by driving the tension arm so that the weight of the balance roller is almost zero at the time of pasting. Since no residual stress remains on the substrate, the substrate is not warped or damaged.

In addition, since the separator is peeled off while being folded back in the direction of about 180 ° by the separation plate, the holding angle by the peeling roller does not occur unlike when peeling using the peeling roller, and the separator is applied in the direction perpendicular to the tape. The separator can be peeled off with a low tension , no residual stress remains on the tape after application, and warping and breakage do not occur even for thin and large-sized substrates such as recent wafers.

  In addition, since the separator follows the protective tape when winding the separator and continuously winds the separator in the 180 ° direction, the peeling force applied in the vertical direction of the protective tape surface can be constantly reduced, and the protective tape No residual stress remains.

  In addition, since the tape is cooled and the separator is peeled in a state where the flexibility of the tape and the separator is reduced, excessive tension due to elongation is not transmitted to the tape, and no residual stress remains on the tape. No warpage or damage to thinned / larger substrates.

  1 and 2 show a method and apparatus for attaching a protective tape 2 to a wafer 1 as an example of a method and apparatus for attaching a tape to a substrate according to the present invention. FIG. 1 shows the overall structure of the apparatus. FIG. 2 is a plan view, a wafer storage cassette 4 storing wafers 1 before being bonded on the machine base 3 in upper and lower stages, an alignment unit 5 for aligning the supplied wafer 1, and the machine base 3 A tape attaching device for attaching the protective tape 2 to the wafer 1 after alignment between the two machine frames 6 and 6 erected on the machine, an attached wafer storage cassette 7 for storing the attached wafer 1 ', and the wafer An articulated robot 9 that sucks the wafer 1 or the stuck wafer 1 ′ with the suction hand 8 and sequentially transfers it from the storage cassette 4 to the alignment unit 5, the tape sticking device, and the stuck wafer storage cassette 7 is provided. It is.

  The alignment unit 5 includes a suction table 10 that can freely move up and down and a sensor 11 that uses an optical sensor or the like disposed on the outer periphery of the suction table 10. The picked-up wafer 1 is sucked and supported on the upper surface of the picked-up wafer 1, and then rotated to detect the notch 1a formed on the wafer 1 with the sensor 11 and position the wafer 1. Become.

  The tape applicator is as shown in FIG. 1 and FIG. 2 as viewed in the direction of arrows II-II. Of these, the tape supply mechanism for supplying the protective tape 2 to the wafer 1 includes machine frames 6 and 6. A protective tape 2 having a width wider than that of the wafer 1 is wound around a protective tape supply roll 12 positioned at the upper portion of the wafer 1 in a state where a separator 13 is adhered to one side of the adhesive tape. The protective tape 2 is supplied while the rotation is controlled by appropriate driving means such as a motor that does not.

  The protective tape 2 led out from the protective tape supply roll 12 is wound under a balance roller 15 provided at the swinging side end of a swingable tension arm 14 below the protective tape supply roll 12. Then, the tension arm 14 is wound around the shaft roller 16 of the shaft portion where the tension arm 14 swings, and then guided downward, and the separator 13 is separated from the protective tape 2 and folded back along the way. Has been led to.

  In the tape applicator, the separation mechanism for separating the separator 13 from the protective tape 2 is such that the separation plate 17 folds and separates the separator from the protective tape 2, and the separation plate 17 is moved downward. It is provided so as to be movable up and down between the guided protective tape 2 and the separator 13 folded upward.

  The separator 13 folded back upward is appropriately wound on a roller provided on the tension arm 18 after passing through a guide roller or the like, and then rotated by a suitable driving means such as a motor (not shown). The roll 19 is wound up.

  The protective tape 2 from which the separator 13 has been peeled is guided to the upper side of the suction table 20 that sucks and fixes the wafer 1 to the upper surface with the adhesive surface facing down, and the upper surface of the suction table 20 and the suction table 20 Passing between the upper sticking roller 21 and passing between the peeling roller 22 and the tape chuck 23 in which the protective tape 2 can be sandwiched between moving forward and backward with respect to the peeling roller 22 and appropriately arranged. The guide roller 24 is guided upward by a plurality of guide rollers 24, and is taken up by a protective tape take-up roll 25 that is rotated by appropriate controlled means such as a motor (not shown).

  The affixing roller 21 can be moved in a tape feeding direction perpendicular to the roller axis by an appropriate means (not shown), can reciprocate both ends of the suction table 20, and the peeling roller 22 and the tape chuck 23. Similarly, both ends of the suction table 20 can be reciprocated by appropriate means (not shown).

  Of the tape applicator, the adhering mechanism for adhering the tape to the wafer 1 will be described. The suction table is attached to the rail 28 extending in the vertical direction and fitted to a plurality of guides 27 provided on the fixed frame 26 on the machine base 3. 20 is fixed, and the rail 28 is moved up and down at the position of the guide 27 by the action of the lifting cylinder 29 provided on the machine base 3, and the suction table 20 is moved up and down accordingly.

  In addition, an outer peripheral table 30 is provided around the suction table 20, and the outer peripheral table 30 is subjected to a release treatment such as a fluororesin coating that peels off even if the adhesive surface of the protective tape 2 adheres to the upper surface. The outer peripheral table 30 is integrated with a guide 32 that is fixed to the suction table 20 and is fitted to a rail 31 that extends in the vertical direction. The outer peripheral table lifting cylinder 33 is fixed to the suction table 20 side. As a result of this action, the table can be moved up and down with respect to the suction table 20 along the rails 31. The top surface and the height can be aligned, and the step due to the thickness of the wafer 1 can be canceled when the protective tape 2 is applied to the wafer 1. So that the physical force is not applied.

  Above the suction table 20 is a tape cutter mechanism that cuts the protective tape 2 attached to the wafer 1 on the suction table 20, and this tape cutter mechanism extends in the vertical direction to the rear machine frame 6. A rail 34 provided, a guide 35 (see FIG. 1) fitted to the rail 34, a lifting cylinder 36 provided in the rear machine frame 6, and the lifting cylinder 36 act along the rail 34. The motor 37 is provided on a member that can move up and down together with the guide 35, and a cutter blade 38 that rotates so as to draw a circle along the outer shape of the wafer 1 by the rotation of the motor 37.

  In addition, with respect to the protective tape 2 before the separator 13 is peeled between the vicinity of the tension arm 14 and the sticking roller 21, the flexibility of the protective tape 2 and the separator 13 is suppressed, and the elongation at the time of feeding, peeling, and sticking is increased. In order to suppress the cooling air, a cooling device 40 for blowing the cooling air 39 having a temperature of about 10 ° C. is provided. The cooling air 39 is supplied through a compressed air supply pipe 41 and a valve 42 (see FIG. 1).

  The affixed wafer 1 'to which the protective tape 2 cut out in the shape of the wafer 1 by the tape affixing device described above is affixed is accommodated in the affixed wafer storage cassette 7 by the articulated robot 9, and the wafer shape is cut out. The remaining part of the protective tape 2 (waste tape residue 2 ') is taken up by the protective tape take-up roll 25 in the tape applying mechanism.

  Next, the details of the vicinity of the tension arm 14 will be described with reference to FIGS. 3 and 4. The pair of tension arms 14 are fixed to a tension arm fixing shaft 43 that is pivotally supported on the rear machine frame 6. As a result, the tension arm 14 swings about the arm fixing shaft 43, and the rotation shaft 44 is spanned between the ends of the pair of tension arms 14, 14 swinging. On the other hand, the balance roller 15 is pivotally supported. Further, between the pair of tension arms 14, 14 of the tension arm fixing shaft 43, the shaft roller 16 is rotatably supported with respect to the tension arm fixing shaft 43.

  One end of a connecting rod 45 is fixed to an extension of the tension arm fixing shaft 43 on the rear outside of the machine frame 6, and the other end of the connecting rod 45 is attached to the machine frame 6 through a rotating shaft 46. The connecting rod 45 is connected to the tip of the working shaft of the cylinder 47 via a shaft 48, and the connecting rod 45 rotates around the tension arm fixing shaft 43 in the clockwise direction in FIG. The tension arm 14 integrated through the tension arm fixing shaft 43 also rotates clockwise and swings upward.

  The support frame 49 protruding rearward from the front machine frame 6 is provided with a tape chuck 51 guided by the pair of guides 50 to advance and retreat to the shaft roller 16. Both guides 50, 50 of the support frame 49 are provided. The tape chuck 51 is moved forward by the extending action of the cylinder 52 provided between them, and the protective tape 2 can be sandwiched between the shaft roller 16 and fixed. The tape chuck 51 may use an appropriate elastic member such as silicone rubber so as not to damage the tape.

  The tension arm portion is configured as described above, and the protective tape 2 supplied from the protective tape supply roll 12 shown in FIGS. 1 and 2 is suspended from the balance roller 15 via the guide roller 53. The tension arm 14 is hung on the upper side of the shaft roller 16 and guided downward, and the tension applied to the protective tape 2 is minimized when the drawing speed is higher than the supply speed of the protective tape 2 by the rotation of the protective tape supply roll 12. Oscillates clockwise to absorb the tape tension and accelerate the tape supply. Conversely, if the withdrawal speed is slower than the supply speed of the protection tape 2 due to the rotation of the protection tape supply roll 12, the protection tape 2 is loosened. The tension arm 14 swings counterclockwise due to its own weight and absorbs the slack of the protective tape 2.

  Note that the angle of the connecting arm 45 or the tension arm 14 can be detected by an appropriate sensor (not shown), and the angle of the tension arm 14 is controlled by controlling the feeding speed of the protective tape supply roll 12 based on this angle information. Are controlled to be parallel positions.

  Next, the peeling mechanism using the separation plate 17 will be described with reference to FIG. 6 which is an enlarged front view of FIG. Between the two fixing frames 54, 54, a box body having both the top plate 55, the bottom plate 56, and the two fixing plates 57 that are open on both sides is fixed, and in the vicinity of each fixing plate 57 inside the box body. A shaft 58 extending in the vertical direction connecting the top plate 55 and the bottom plate 56 is provided. Each of the two shafts 58 is provided with a guide 59 that slides along the shaft and can be moved up and down. A separating plate 17 is provided so as to connect the guide 59, and the separating plate 17 can be moved up and down substantially along the two shafts 58. Usually, the separating plate 17 naturally falls to a lower position indicated by a two-dot chain line in FIG. It is supposed to be.

  A support plate 60 is provided at the lower part of both guides 59, and when the guide 59 is located in the vicinity of the top plate 55 together with the separation plate 17, a stopper provided at the shaft tip of the cylinder 61 fixed to one fixed plate 57. 62 enters the lower portion of the support plate 60 when the cylinder 61 is extended, and supports the support plate 60, thereby preventing the separation plate 17 from falling naturally and staying in this position. If it does, the stopper 62 will move to the arrow direction of FIG. 5, the support plate 60 will lose support, and the separation plate 17 will fall to the position shown with the dashed-two dotted line in FIG.5 and FIG.6. In order to mitigate the impact of the drop, a buffer member 63 is provided at a position where the bottom plate 56 comes into contact with the support plate 60 that has fallen, so as to mitigate the impact of the drop.

  The separation plate 17 has the structure as described above. When the stopper 62 is retracted by the reduction action of the cylinder 61, the separation tape 17 is peeled off from the protection tape 2 and guided to the affixing roller 21. A free fall is performed between the separator 13 guided upward by a group of guide rollers 64 pivotally supported at both ends by 57.

  Further, when the protective tape 2 is fixed and the separator 13 is not peeled off from the protective tape 2 by the winding operation, the tip of the lowermost end of the separation plate 17 has an acute corner shape, so that the separator 13 is protected. While coming into contact with the peeling portion peeled off from the tape 2 and folding the separator 13 in a direction of about 180 °, the separator 13 is lifted against the own weight following the movement (rise) of the peeling portion due to the peeling of the separator 13, and the stopper 62 Return to where you stayed.

  If the weight of the separation plate 17 is set to such a weight that the separator 13 can be folded back in the 180 ° direction when the separator 13 is wound up, almost no tension is applied to the protective tape 2.

At this time, the separator 13 is peeled off while being folded back in the direction of about 180 ° by the separation plate 17, so that the holding angle by the peeling roller does not occur as in the case of peeling using the peeling roller, and the protective tape 2 is not peeled off. Thus, almost no tension is applied in the vertical direction, no residual stress remains on the protective tape 2 after application, and the wafer 1 having a reduced thickness and a larger diameter does not warp or break.

  In addition, since the separator follows the protective tape when winding the separator and continuously winds the separator in the 180 ° direction, the peeling force applied in the vertical direction of the protective tape surface can be constantly reduced, and the protective tape No residual stress remains.

  FIG. 7 illustrates the movement of the balance roller 15. When the tension applied to the protective tape 2 is zero, the tension arm is kept parallel (FIG. 7 (a)).

  When the protective tape 2 is fed in the feeding direction, the tensile force of the protective tape 2 becomes strong, and when the pulling speed becomes faster than the supply speed from the protective tape supply roll 12, the tension is applied to the protective tape 2 being supplied. The tension arm 14 swings upward by its own weight so as to minimize the tape tension (FIG. 7B).

  At this time, as described above, the angle of the connecting rod 45 or the tension arm 14 is detected by an appropriate sensor (not shown), and based on this angle information, basically, such as a motor that rotates the protective tape supply roll 12 The mechanism is appropriately controlled so that the angle of the tension arm 14 is in a parallel position.

When the protective tape 2 is supplied, the protective tape 2 is supplied integrally with the separator 13 and the expansion of the protective tape 2 due to the tensile force is hardly affected by the action of the cooling air 39. For example, when the property is high, the weight of the balance roller 15 may be reduced by forcibly driving the tension arm 14.

  On the contrary, when the protective tape 2 supply speed from the protective tape supply roll 12 becomes faster than the pulling speed of the protective tape 2 and the entire protective tape 2 is loosened, the tension arm swings downward accordingly. Basically, an appropriate mechanism such as a motor that rotates the protective tape supply roll 12 is controlled to reduce the supply amount of the protective tape 2 and control the angle of the tension arm 14 to be in a parallel position (see FIG. 7 (c)).

  Further, when the protective tape 2 in the stopped state is slack, the balance roller 15 that holds the protective tape 2 at the tip of the tension arm 14 is naturally moved by its own weight while the protective tape supply roll 12 stops rotating. The slack of the protective tape 2 is absorbed by swinging downward.

  Next, a series of operations for attaching the protective tape to the wafer will be described with reference to FIGS.

  First, as shown in FIG. 8A, the protective tape 2 drawn from the protective tape supply roller 12 with the separator 13 attached is passed through the balance roller 15 and the shaft roller 16 provided on the tension arm 14. The leading end portion of the separating plate 17 that is guided to the lower portion is in the separating position between the protective tape 2 and the separator 13, and the separator 13 separated from the protective tape 2 passes through the tension arm 18 and winds up the separator. The protective tape 2 wound around the roll 19 and having the separator 13 peeled off keeps the horizontal direction with the adhesive surface facing down on the suction table 20 on which the wafer 1 is placed at the part of the sticking roller 21. ing.

  Further, in the vicinity of the upper tension arm 14, the protective tape 2 is sandwiched with the separator 13 by the shaft roller 16 and the tape chuck 51, and in the vicinity of the lower application roller 21, the protective tape 2 is sandwiched by the peeling roller 22 and the tape chuck 23. It is fixed.

  Next, as shown in FIG. 8 (b), the tape chuck 51 at the shaft roller 16 is released, and the solid line from the position indicated by the two-dot chain line in the state where the peeling roller 22 and the tape chuck 23 hold the protective tape 2 therebetween. Is moved to the left side of the suction table 20 by an appropriate means in the direction of the arrow shown in the figure, and the protective tape supply roll 12 is rotated by an appropriate drive means to feed out the protective tape 2 and the wafer sucked by the suction table 20 A protective tape 2 having an adhesive surface on the top is supplied.

  At this time, as described in the explanation of FIG. 7, the angle of the tension arm 14 or the like is read by a sensor, and the supply speed (supply amount) is adjusted from the protective tape supply roll 12 so that an excessive force is not applied to the protective tape 2. Furthermore, a cooling air 39 of about 10 ° C. is ejected from the cooling device 40 to the protective tape 2 in the middle of being pulled out so that the flexibility of the protective tape 2 being supplied is suppressed and elongation does not occur. Cool down.

  Further, the separator take-up roll 19 is rotated in the direction opposite to the take-up direction, so that the separation portion between the protective tape 2 and the separator 13 is sent as it is, and the separator 13 is in a slack state so as to draw an arc. It is sent following the protective tape 2.

  When the tape chuck 23 is moved to the left side of the suction table 20, the movement of the protective tape 2 is stopped, and as shown in FIG. The tape 2 and the separator 13 are moved from the two-dot chain line position to the solid line position in the figure, and the protective tape 2 is slackened. This slack is shown at the tip of the tension arm 14 where a constant load is applied by the weight of the balance roller 15. The protective tape 2 is absorbed as a result of the downward movement as shown in the figure, and the protective tape 2 is in a state shown by a solid line in FIG. There is nothing wrong.

Next, as shown in FIG. 9 (d), the suction table 20 is raised in the direction of the arrow so that the upper surface of the mounted wafer 1 reaches the position of the protective tape 2, and then the sticking roller 21 in the drawing. by moving the two-dot chain line position in solid line position in the direction of the arrow, the surface of the wafer 1, such pressing the protective tape 2 is al paste.

  In order to reduce as much as possible the tension applied to the protective tape 2 when the sticking roller 21 moves from the two-dot chain line position to the solid line position in the figure, the cylinder is set so that the weight of the balance roller 15 becomes almost zero immediately before the sticking starts. 47 (see FIG. 4) is stretched, and the upward swing of the tension arm 14 is read by a sensor, and the protective tape 2 is supplied.

  Next, as shown in FIG. 10E, after the cutter blade 38 is lowered to the position of the protective tape 2, the cutter blade 38 is moved along the outer diameter shape of the wafer 1 by the rotation of the motor 37. Then, only the protective tape 2 attached to the surface of the wafer 1 is cut off, and the stopper 62 is retracted by the reducing action of the cylinder 61 (see FIG. 5), so that the separation plate 17 has its own weight from the two-dot chain line position to the solid line position in the figure. To lower.

  Next, as shown in FIG. 10 (f), the cutter blade 38 after cutting the protective tape 2 is raised, the protective tape 2 is fixed by the tape chuck 51, and the separator take-up roll 19 is appropriately separated by a driving means. When the separator 13 is rotated in the winding direction, the separation point of the protective tape 2 and the separator 13 is the tip of the separation plate 17 and the separator 13 is folded back along the shape of the tip of the separation plate 17 at an acute angle. With the removal, the separation point rises, and the separation plate 17 also rises from the two-dot chain line position to the solid line position in the figure.

  At this time, the state of swinging of the tension arm 18 in a parallel state with a constant load is read by a sensor as appropriate, and the separator 13 is wound up while adjusting the rotation speed of the separator take-up roll 19 so that an excessive force is not applied. Go.

  When the separation point of the separation plate 17 and the protective tape 2 and the separator 13 is raised to the position shown in FIG. 11 (g), the rotation of the separator take-up roll 19 is stopped and the stopper 62 is advanced by the extending action of the cylinder 61. (See FIG. 5), the separation plate 17 is fixed, and the suction table 20 is lowered.

  Next, as shown in FIG. 11 (h), after releasing the tape chuck 23, the peeling roller 22 is moved between the upper side of the suction table 20 and the lower side of the protective tape 2 in the direction of the arrow in the drawing. The protective tape 2 (waste tape residue 2 ′) not attached to 1 is peeled off from the outer peripheral table 30.

  The scraped tape residue 2 ′ that has been peeled off is in the position of the two-dot chain line in the figure, and then the wafer 1 ′ with the protective tape 2 attached is removed from the suction table 20 and a new wafer 1 is placed on the suction table 20. Returning to the state of 8 (a), the protective tape 2 is subsequently applied.

  The method and apparatus for attaching a tape to a substrate according to the present embodiment has the above-described configuration, but the present invention is not limited to the above-described embodiment, and may be appropriately changed within the scope of the object of the present invention. Can be implemented. For example, the temperature of the cooling air by the cooling device is changed according to the characteristics of the tape, or the separation point of the separator with respect to the protective tape is read with a sensor or the like, and the separation plate is appropriately adapted to follow the movement of the read separation point. You may make it move with.

  Further, in this embodiment, the method and apparatus for attaching a protective tape to a wafer has been described as an example. However, the present invention is not limited to attaching a protective tape to a wafer, and various tapes for various substrates within the scope of the present invention. In particular, the substrate can be effectively applied to any substrate that is thinned and causes warpage due to residual stress of the tape after pasting.

It is a top view of this invention apparatus. It is an II-II direction arrow line view of FIG. It is a top view of a tension arm part. It is a partially expanded front view of a tension arm part. It is an enlarged front view of a separation plate part. It is a VI-VI direction arrow line view of FIG. (A) (b) (c) is explanatory drawing of a motion of a balance roller. (A) (b) is operation | movement explanatory drawing of this invention apparatus. (C) and (d) are operation explanatory views of the device of the present invention. (E) and (f) are operation explanatory views of the device of the present invention. (G) and (h) are operation explanatory views of the device of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wafer 1 'Sticked wafer 1a Notch 2 Protective tape 2' Discard tape 3 Machine stand 4 Wafer supply cassette 5 Alignment part 6 Machine frame 7 Sticked wafer storage cassette 8 Suction hand 9 Articulated robot 10 Suction table 11 Sensor 12 Protective tape Supply roll 13 Separator 14 Tension arm 15 Balance roller 16 Shaft roller 17 Separating plate 18 Tension arm 19 Separator take-up roll 20 Adsorption table 21 Adhesion roller 22 Peeling roller 23 Tape chuck 24 Guide roller 25 Protection tape take-up roll 26 Fixed frame 27 Guide 28 Rail 29 Lifting cylinder 30 Outer table 31 Rail 32 Guide 33 Outer table lifting cylinder 34 Rail 35 Guide 36 Lifting cylinder 37 Motor 38 Cutter blade 39 Cooling air 40 Cooling device 4 1 Compressed air supply pipe 42 Valve 43 Tension arm fixed shaft 44 Rotating shaft 45 Connecting rod 46 Rotating shaft 47 Cylinder 48 Axis 49 Support frame 50 Guide 51 Tape chuck 52 Cylinder 53 Guide roller 54 Fixed frame 55 Top plate 56 Bottom plate 57 Fixed plate 58 Shaft 59 Guide 60 Support plate 61 Cylinder 62 Stopper 63 Buffer member 64 Guide roller

Claims (6)

In the method of sticking the tape to the substrate, the tape with the separator attached on one side is peeled off in the middle of the supply path and then attached to the substrate. Put the tape in the middle of supply on the balance roller, read the tension arm angle, keep the tension arm at a specified angle, and control the tape supply amount, and balance the balance arm by forcibly driving the tension arm during tape application work The roller is raised so that the tension applied to the tape becomes almost zero. In this state, the tape is applied to the substrate, and the tape is changed according to the amount of change in the swing angle of the tension arm accompanying the tape application operation. A method for applying a tape to a substrate, wherein tension applied to the tape is relaxed by controlling a supply amount.   Positioning the separation plate movable along the tape supply path so as to be in contact with the peeling portion of the tape and the separator, the separator is folded back at about 180 ° direction at the acute end of the separation plate and peeled off from the tape. The method for attaching a tape to a substrate according to claim 1, wherein the separation plate is moved following the peeling portion.   The method of applying a tape to a substrate according to claim 1 or 2, wherein cooling air is blown onto the tape before the separator is peeled off from the supply path. In a tape sticking device to a substrate having a supply mechanism for a long tape with a separator attached to one side, a peeling mechanism for peeling the separator in a tape supply path, and a sticking mechanism for sticking the tape to the substrate the pivotable tension arm having a balance roller for applying a tape in the middle of the supply provided, the said tension arm, raising the balance roller during tape application work, forced driving to almost zero tension on the tape The tension arm is configured so that the swing angle changes according to the tension applied to the tape , and the tension arm swing angle according to the amount of change of the tension arm accompanying the tape application operation characterized in that so as to relieve tension on the tape by controlling the supply amount of tape Te tape to the substrate Sticking apparatus.   A tape supply path that follows the movement of the peeling portion due to the peeling of the separator, having an acute-angled tip portion that contacts the peeling portion of the separator and the tape to be peeled off by the peeling mechanism and turns the separator in a direction of approximately 180 °. The apparatus for applying a tape to a substrate according to claim 4, further comprising a separation plate that can freely move along the substrate.   The tape sticking device for a substrate according to claim 4 or 5, further comprising a cooling device for blowing cooling air to the tape before separation of the separator.

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