JP2008210883A5 - - Google Patents

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Publication number
JP2008210883A5
JP2008210883A5 JP2007044426A JP2007044426A JP2008210883A5 JP 2008210883 A5 JP2008210883 A5 JP 2008210883A5 JP 2007044426 A JP2007044426 A JP 2007044426A JP 2007044426 A JP2007044426 A JP 2007044426A JP 2008210883 A5 JP2008210883 A5 JP 2008210883A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2007044426A
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Japanese (ja)
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JP2008210883A (en
JP4868591B2 (en
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Priority to JP2007044426A priority Critical patent/JP4868591B2/en
Priority claimed from JP2007044426A external-priority patent/JP4868591B2/en
Publication of JP2008210883A publication Critical patent/JP2008210883A/en
Publication of JP2008210883A5 publication Critical patent/JP2008210883A5/ja
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Publication of JP4868591B2 publication Critical patent/JP4868591B2/en
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JP2007044426A 2007-02-23 2007-02-23 Method and apparatus for attaching tape to substrate Active JP4868591B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007044426A JP4868591B2 (en) 2007-02-23 2007-02-23 Method and apparatus for attaching tape to substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007044426A JP4868591B2 (en) 2007-02-23 2007-02-23 Method and apparatus for attaching tape to substrate

Publications (3)

Publication Number Publication Date
JP2008210883A JP2008210883A (en) 2008-09-11
JP2008210883A5 true JP2008210883A5 (en) 2010-04-08
JP4868591B2 JP4868591B2 (en) 2012-02-01

Family

ID=39786957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007044426A Active JP4868591B2 (en) 2007-02-23 2007-02-23 Method and apparatus for attaching tape to substrate

Country Status (1)

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JP (1) JP4868591B2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5324317B2 (en) * 2009-05-22 2013-10-23 日東電工株式会社 Protective tape application method and protective tape application device
JP5406003B2 (en) * 2009-12-21 2014-02-05 株式会社ディスコ Tape sticking device
JP5475481B2 (en) * 2010-01-21 2014-04-16 リンテック株式会社 Sheet sticking device and sheet sticking method
KR101031559B1 (en) 2010-10-15 2011-04-27 이은준 Apparatus and method for cutting tape
JP5814216B2 (en) * 2012-11-22 2015-11-17 蟹江プロパン株式会社 Laminated sheet peeling device
JP5814215B2 (en) * 2012-11-22 2015-11-17 蟹江プロパン株式会社 Laminated sheet peeling apparatus and laminated sheet peeling method
JP2015012138A (en) * 2013-06-28 2015-01-19 リンテック株式会社 Sheet sticking device and sticking method
JP6577915B2 (en) * 2015-07-07 2019-09-18 芝浦メカトロニクス株式会社 Adhesive tape sticking device
JP7049822B2 (en) * 2017-12-18 2022-04-07 株式会社ディスコ Tape sticking device
CN110518292B (en) * 2019-09-27 2024-05-24 广东利元亨智能装备股份有限公司 Rubberizing equipment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384949A (en) * 1989-08-29 1991-04-10 Nitto Denko Corp Pasting of adhesive tape on wafer
JPH07196989A (en) * 1993-12-31 1995-08-01 Kanegafuchi Chem Ind Co Ltd Method for peeling cover tape and apparatus for peeling
JP2000191203A (en) * 1998-12-25 2000-07-11 Sharp Corp Film separating method and device
JP2002184809A (en) * 2000-12-18 2002-06-28 Matsushita Electric Ind Co Ltd Tape-affixing method and device
JP4899242B2 (en) * 2001-01-05 2012-03-21 大日本印刷株式会社 Separate film peeling device
JP4271056B2 (en) * 2004-02-19 2009-06-03 株式会社タカトリ Method and apparatus for attaching tape to substrate
JP4503448B2 (en) * 2005-01-26 2010-07-14 富士機械製造株式会社 Buffer material tape supply device and electronic component crimping device used for electronic component crimping device
JP4441450B2 (en) * 2005-07-07 2010-03-31 リンテック株式会社 Sheet sticking device and sticking method

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