JP4868430B2 - リチャージ装置、インゴット引上げ装置、及びインゴット製造方法 - Google Patents
リチャージ装置、インゴット引上げ装置、及びインゴット製造方法 Download PDFInfo
- Publication number
- JP4868430B2 JP4868430B2 JP2003033055A JP2003033055A JP4868430B2 JP 4868430 B2 JP4868430 B2 JP 4868430B2 JP 2003033055 A JP2003033055 A JP 2003033055A JP 2003033055 A JP2003033055 A JP 2003033055A JP 4868430 B2 JP4868430 B2 JP 4868430B2
- Authority
- JP
- Japan
- Prior art keywords
- hopper
- shaft
- ingot
- hopper body
- quartz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 113
- 239000013078 crystal Substances 0.000 claims description 93
- 239000000463 material Substances 0.000 claims description 70
- 239000010453 quartz Substances 0.000 claims description 70
- 239000002994 raw material Substances 0.000 claims description 39
- 239000000725 suspension Substances 0.000 claims description 28
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 27
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910002804 graphite Inorganic materials 0.000 claims description 11
- 239000010439 graphite Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- 238000002834 transmittance Methods 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims 2
- 230000037431 insertion Effects 0.000 claims 2
- 229910021419 crystalline silicon Inorganic materials 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 41
- 229910052710 silicon Inorganic materials 0.000 description 41
- 239000010703 silicon Substances 0.000 description 41
- 238000000034 method Methods 0.000 description 17
- 239000000155 melt Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000011109 contamination Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910005540 GaP Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003033055A JP4868430B2 (ja) | 2003-02-12 | 2003-02-12 | リチャージ装置、インゴット引上げ装置、及びインゴット製造方法 |
TW93102361A TW200415266A (en) | 2003-02-12 | 2004-02-03 | Device for adding material, device for pulling up ingot, and method for producing ingot |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003033055A JP4868430B2 (ja) | 2003-02-12 | 2003-02-12 | リチャージ装置、インゴット引上げ装置、及びインゴット製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008188384A Division JP4966267B2 (ja) | 2008-07-22 | 2008-07-22 | リチャージ装置、原料供給装置、及びインゴット引上げ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004244236A JP2004244236A (ja) | 2004-09-02 |
JP4868430B2 true JP4868430B2 (ja) | 2012-02-01 |
Family
ID=33019154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003033055A Expired - Lifetime JP4868430B2 (ja) | 2003-02-12 | 2003-02-12 | リチャージ装置、インゴット引上げ装置、及びインゴット製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4868430B2 (enrdf_load_stackoverflow) |
TW (1) | TW200415266A (enrdf_load_stackoverflow) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4562139B2 (ja) * | 2006-02-01 | 2010-10-13 | コバレントマテリアル株式会社 | 単結晶引上装置及び原料シリコン充填方法 |
JP4563951B2 (ja) * | 2006-03-17 | 2010-10-20 | コバレントマテリアル株式会社 | 固形状原料のリチャージ装置 |
KR100800212B1 (ko) * | 2006-08-02 | 2008-02-01 | 주식회사 실트론 | 단결정 성장 장치에 고체 원료를 공급하는 장치 및 방법 |
JP4931122B2 (ja) * | 2006-09-29 | 2012-05-16 | Sumco Techxiv株式会社 | 原料供給装置及び原料供給方法 |
JP4901405B2 (ja) * | 2006-09-29 | 2012-03-21 | Sumco Techxiv株式会社 | 原料供給装置 |
JP4699975B2 (ja) * | 2006-09-29 | 2011-06-15 | Sumco Techxiv株式会社 | 原料供給装置及び原料供給方法 |
JP4817379B2 (ja) * | 2006-09-29 | 2011-11-16 | Sumco Techxiv株式会社 | 原料供給装置 |
JP4699976B2 (ja) * | 2006-09-29 | 2011-06-15 | Sumco Techxiv株式会社 | 原料供給装置 |
KR100935083B1 (ko) * | 2008-01-25 | 2009-12-31 | 주식회사 실트론 | 카본 오염을 방지할 수 있는 고체원료 공급장치 및 단결정 성장방법 |
JP5167942B2 (ja) * | 2008-05-15 | 2013-03-21 | 株式会社Sumco | シリコン単結晶の製造方法 |
DE112009001202T5 (de) | 2008-05-20 | 2011-06-22 | Shin-Etsu Handotai Co., Ltd. | Einkristallherstellungsvorrichtung |
CN103849927A (zh) * | 2012-11-30 | 2014-06-11 | 有研半导体材料股份有限公司 | 一种直拉法生长低电阻率单晶硅用掺杂装置及掺杂方法 |
KR101446718B1 (ko) * | 2013-01-25 | 2014-10-06 | 주식회사 엘지실트론 | 단결정 잉곳 제조 장치 |
JP6028128B1 (ja) * | 2015-03-25 | 2016-11-16 | 株式会社トクヤマ | 投入装置、塊状シリコン原料の供給方法、シリコン単結晶製造装置およびシリコン単結晶の製造方法 |
JP6471700B2 (ja) * | 2016-01-05 | 2019-02-20 | 株式会社Sumco | リチャージ装置を用いたシリコン原料の融解方法 |
CN110067019A (zh) * | 2019-06-03 | 2019-07-30 | 中国电子科技集团公司第二十六研究所 | 一种晶体生长连续自动加料装置及晶体连续生长系统 |
KR102474704B1 (ko) * | 2021-02-19 | 2022-12-07 | 에스케이실트론 주식회사 | 단결정 성장 장치 |
KR102775318B1 (ko) | 2024-04-09 | 2025-03-05 | 제이에이취엔지니어링주식회사 | 호퍼필터가 구성된 호퍼장치를 이용하여 반도체 단결정 성장장치에 실리콘을 충전하는 방법 |
-
2003
- 2003-02-12 JP JP2003033055A patent/JP4868430B2/ja not_active Expired - Lifetime
-
2004
- 2004-02-03 TW TW93102361A patent/TW200415266A/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI294471B (enrdf_load_stackoverflow) | 2008-03-11 |
JP2004244236A (ja) | 2004-09-02 |
TW200415266A (en) | 2004-08-16 |
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