JP4856931B2 - レーザ割断方法およびレーザ割断装置 - Google Patents

レーザ割断方法およびレーザ割断装置 Download PDF

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Publication number
JP4856931B2
JP4856931B2 JP2005327566A JP2005327566A JP4856931B2 JP 4856931 B2 JP4856931 B2 JP 4856931B2 JP 2005327566 A JP2005327566 A JP 2005327566A JP 2005327566 A JP2005327566 A JP 2005327566A JP 4856931 B2 JP4856931 B2 JP 4856931B2
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laser
cut
cleaving
optical system
processing region
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Japanese (ja)
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JP2006167804A5 (enrdf_load_stackoverflow
JP2006167804A (ja
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正行 西脇
潤一郎 井利
源次 稲田
定之 須釜
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Canon Inc
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Canon Inc
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JP2005327566A 2004-11-19 2005-11-11 レーザ割断方法およびレーザ割断装置 Expired - Fee Related JP4856931B2 (ja)

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JP2005327566A JP4856931B2 (ja) 2004-11-19 2005-11-11 レーザ割断方法およびレーザ割断装置

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JP2004335398 2004-11-19
JP2004335398 2004-11-19
JP2005327566A JP4856931B2 (ja) 2004-11-19 2005-11-11 レーザ割断方法およびレーザ割断装置

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JP2006167804A JP2006167804A (ja) 2006-06-29
JP2006167804A5 JP2006167804A5 (enrdf_load_stackoverflow) 2008-12-25
JP4856931B2 true JP4856931B2 (ja) 2012-01-18

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Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080028559A (ko) * 2006-09-27 2008-04-01 주식회사 이오테크닉스 폴리곤 미러를 이용한 대상물 다중 가공 방법
JP5154838B2 (ja) * 2007-05-31 2013-02-27 株式会社ディスコ レーザー加工装置
JP2010003817A (ja) * 2008-06-19 2010-01-07 Tokyo Seimitsu Co Ltd レーザーダイシング方法及びレーザーダイシング装置
CN102307699B (zh) * 2009-02-09 2015-07-15 浜松光子学株式会社 加工对象物的切断方法
JP5446631B2 (ja) 2009-09-10 2014-03-19 アイシン精機株式会社 レーザ加工方法及びレーザ加工装置
US8148239B2 (en) 2009-12-23 2012-04-03 Intel Corporation Offset field grid for efficient wafer layout
JP5479924B2 (ja) * 2010-01-27 2014-04-23 浜松ホトニクス株式会社 レーザ加工方法
JP5479925B2 (ja) 2010-01-27 2014-04-23 浜松ホトニクス株式会社 レーザ加工システム
EP2599579B1 (en) * 2010-07-26 2020-03-11 Hamamatsu Photonics K.K. Method for manufacturing semiconductor device
US8961806B2 (en) 2010-07-26 2015-02-24 Hamamatsu Photonics K.K. Laser processing method
WO2012014722A1 (ja) * 2010-07-26 2012-02-02 浜松ホトニクス株式会社 基板加工方法
EP2599576B1 (en) * 2010-07-26 2019-12-11 Hamamatsu Photonics K.K. Laser processing method
JP5574866B2 (ja) * 2010-07-26 2014-08-20 浜松ホトニクス株式会社 レーザ加工方法
WO2012014724A1 (ja) * 2010-07-26 2012-02-02 浜松ホトニクス株式会社 基板加工方法
JP5930811B2 (ja) * 2011-11-18 2016-06-08 浜松ホトニクス株式会社 レーザ加工方法及びレーザ加工装置
JP6059059B2 (ja) * 2013-03-28 2017-01-11 浜松ホトニクス株式会社 レーザ加工方法
JP5979091B2 (ja) * 2013-07-18 2016-08-24 株式会社デンソー レーザ加工装置
JP6401943B2 (ja) * 2014-06-18 2018-10-10 株式会社ディスコ レーザー加工装置
JP2018523291A (ja) * 2015-06-01 2018-08-16 エバナ テクノロジーズ ユーエービー 半導体加工対象物のスクライブ方法
WO2020090905A1 (ja) * 2018-10-30 2020-05-07 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
WO2020090894A1 (ja) * 2018-10-30 2020-05-07 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
CN113056346B (zh) 2018-10-30 2023-12-15 浜松光子学株式会社 激光加工装置及激光加工方法
JP7120904B2 (ja) * 2018-10-30 2022-08-17 浜松ホトニクス株式会社 レーザ加工装置及びレーザ加工方法
JP7625353B2 (ja) 2021-05-27 2025-02-03 株式会社ディスコ 単結晶シリコンウェーハ及びその分割方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0529693A (ja) * 1990-09-19 1993-02-05 Hitachi Ltd マルチパルスレーザ発生装置、及びその方法、並びにそのマルチパルスレーザを用いた加工方法
JP2848052B2 (ja) * 1991-09-02 1999-01-20 株式会社ニコン レーザ加工装置
WO2003008168A1 (fr) * 2001-07-16 2003-01-30 Mitsuboshi Diamond Industrial Co., Ltd. Dispositif de rainurage pour substrat constitue de matiere fragile
JP2004087663A (ja) * 2002-08-26 2004-03-18 Tokyo Seimitsu Co Ltd ダイシング装置及びチップ製造方法
JP2005138143A (ja) * 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置

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