JP4844003B2 - 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 - Google Patents

回路接続材料、回路部材の接続構造及び回路部材の接続方法。 Download PDF

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Publication number
JP4844003B2
JP4844003B2 JP2005137627A JP2005137627A JP4844003B2 JP 4844003 B2 JP4844003 B2 JP 4844003B2 JP 2005137627 A JP2005137627 A JP 2005137627A JP 2005137627 A JP2005137627 A JP 2005137627A JP 4844003 B2 JP4844003 B2 JP 4844003B2
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Japan
Prior art keywords
circuit
group
substrate
circuit member
electrode
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Expired - Lifetime
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JP2005137627A
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English (en)
Japanese (ja)
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JP2006318990A (ja
JP2006318990A5 (enExample
Inventor
征宏 有福
日臣 望月
孝 中澤
宏治 小林
貢 藤縄
貴 立澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2005137627A priority Critical patent/JP4844003B2/ja
Priority to TW95127814A priority patent/TWI406604B/zh
Publication of JP2006318990A publication Critical patent/JP2006318990A/ja
Publication of JP2006318990A5 publication Critical patent/JP2006318990A5/ja
Priority to US12/769,953 priority patent/US8558118B2/en
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Publication of JP4844003B2 publication Critical patent/JP4844003B2/ja
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Expired - Lifetime legal-status Critical Current

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  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2005137627A 2005-05-10 2005-05-10 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 Expired - Lifetime JP4844003B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005137627A JP4844003B2 (ja) 2005-05-10 2005-05-10 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
TW95127814A TWI406604B (zh) 2005-05-10 2006-07-28 A circuit connection material, a connection structure of a circuit component, and a connection method of a circuit component
US12/769,953 US8558118B2 (en) 2005-05-10 2010-04-29 Circuit connection material, circuit member connecting structure and method of connecting circuit member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005137627A JP4844003B2 (ja) 2005-05-10 2005-05-10 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Related Child Applications (3)

Application Number Title Priority Date Filing Date
JP2010015598A Division JP4900490B2 (ja) 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
JP2010015596A Division JP4844677B2 (ja) 2010-01-27 2010-01-27 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
JP2010202160A Division JP2011032479A (ja) 2010-09-09 2010-09-09 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Publications (3)

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JP2006318990A JP2006318990A (ja) 2006-11-24
JP2006318990A5 JP2006318990A5 (enExample) 2010-03-11
JP4844003B2 true JP4844003B2 (ja) 2011-12-21

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JP2005137627A Expired - Lifetime JP4844003B2 (ja) 2005-05-10 2005-05-10 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Country Status (2)

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JP (1) JP4844003B2 (enExample)
TW (1) TWI406604B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE540426T1 (de) * 2006-07-21 2012-01-15 Hitachi Chemical Co Ltd Material zur verbindung von leiterplatten, stromkreisverbindungsstruktur und verfahren zur verbindung des leiterplattenelements
JP5338051B2 (ja) * 2007-01-23 2013-11-13 日立化成株式会社 接着剤組成物、回路接続構造体及び半導体装置
JP2008255312A (ja) * 2007-03-14 2008-10-23 Hitachi Chem Co Ltd 接着剤組成物
JP5023901B2 (ja) * 2007-05-23 2012-09-12 日立化成工業株式会社 接着剤組成物、回路接続構造体及び半導体装置
JP2009108226A (ja) * 2007-10-31 2009-05-21 Yokohama Rubber Co Ltd:The 硬化性樹脂組成物
JP5163056B2 (ja) * 2007-10-31 2013-03-13 横浜ゴム株式会社 硬化性樹脂組成物
JP5176139B2 (ja) * 2008-05-12 2013-04-03 日立化成株式会社 回路接続材料及びそれを用いた回路部材の接続構造
JP2011032479A (ja) * 2010-09-09 2011-02-17 Hitachi Chem Co Ltd 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
WO2015068611A1 (ja) * 2013-11-07 2015-05-14 東洋インキScホールディングス株式会社 導電性接着剤、導電性接着シート、配線デバイス、および配線デバイスの製造方法
JP6474620B2 (ja) * 2015-01-22 2019-02-27 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法
US11421116B2 (en) * 2018-10-19 2022-08-23 Fujikura Kasei Co., Ltd. Electroconductive paste

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147760A (ja) * 1984-08-16 1986-03-08 Shin Etsu Polymer Co Ltd 異方導電接着剤
JPH01135639A (ja) * 1987-11-24 1989-05-29 Nippon Sheet Glass Co Ltd ポリエステル積層物
JPH03110711A (ja) * 1989-09-22 1991-05-10 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
JPH0652715A (ja) * 1992-07-30 1994-02-25 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
JP3876993B2 (ja) * 1997-02-27 2007-02-07 セイコーエプソン株式会社 接着構造、液晶装置、及び電子機器
AU6520798A (en) * 1997-03-31 1998-10-22 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
JP4423513B2 (ja) * 1997-10-20 2010-03-03 東洋紡績株式会社 接着用樹脂組成物及び接着用フィルム
JP2000239642A (ja) * 1999-02-23 2000-09-05 Toyobo Co Ltd 反応性ホットメルト接着剤組成物
JP2001055555A (ja) * 1999-08-19 2001-02-27 Dainippon Ink & Chem Inc ラミネート用接着剤組成物
US6762249B1 (en) * 1999-08-25 2004-07-13 Hitachi Chemical Company, Ltd. Wiring-connecting material and process for producing circuit board with the same
JP2002111213A (ja) * 2000-09-26 2002-04-12 Nippon Mektron Ltd 任意層間接続用バイア・ホールを有する多層プリント基板およびその製造方法
JP4158080B2 (ja) * 2002-01-30 2008-10-01 東洋紡績株式会社 導電性ペースト
JP4235895B2 (ja) * 2002-04-18 2009-03-11 東洋紡績株式会社 昇華型感熱転写記録材用ポリエステルフィルムおよびその製造方法
JP4470091B2 (ja) * 2003-08-11 2010-06-02 東洋紡績株式会社 ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板

Also Published As

Publication number Publication date
JP2006318990A (ja) 2006-11-24
TW200808138A (en) 2008-02-01
TWI406604B (zh) 2013-08-21

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