TWI406604B - A circuit connection material, a connection structure of a circuit component, and a connection method of a circuit component - Google Patents

A circuit connection material, a connection structure of a circuit component, and a connection method of a circuit component Download PDF

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Publication number
TWI406604B
TWI406604B TW95127814A TW95127814A TWI406604B TW I406604 B TWI406604 B TW I406604B TW 95127814 A TW95127814 A TW 95127814A TW 95127814 A TW95127814 A TW 95127814A TW I406604 B TWI406604 B TW I406604B
Authority
TW
Taiwan
Prior art keywords
circuit
connecting material
resin
group
substrate
Prior art date
Application number
TW95127814A
Other languages
English (en)
Chinese (zh)
Other versions
TW200808138A (en
Inventor
Motohiro Arifuku
Nichiomi Mochizuki
Takashi Nakazawa
Kouji Kobayashi
Tohru Fujinawa
Takashi Tatsuzawa
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200808138A publication Critical patent/TW200808138A/zh
Application granted granted Critical
Publication of TWI406604B publication Critical patent/TWI406604B/zh

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  • Adhesives Or Adhesive Processes (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW95127814A 2005-05-10 2006-07-28 A circuit connection material, a connection structure of a circuit component, and a connection method of a circuit component TWI406604B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005137627A JP4844003B2 (ja) 2005-05-10 2005-05-10 回路接続材料、回路部材の接続構造及び回路部材の接続方法。

Publications (2)

Publication Number Publication Date
TW200808138A TW200808138A (en) 2008-02-01
TWI406604B true TWI406604B (zh) 2013-08-21

Family

ID=37539414

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95127814A TWI406604B (zh) 2005-05-10 2006-07-28 A circuit connection material, a connection structure of a circuit component, and a connection method of a circuit component

Country Status (2)

Country Link
JP (1) JP4844003B2 (enExample)
TW (1) TWI406604B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE540426T1 (de) * 2006-07-21 2012-01-15 Hitachi Chemical Co Ltd Material zur verbindung von leiterplatten, stromkreisverbindungsstruktur und verfahren zur verbindung des leiterplattenelements
JP5338051B2 (ja) * 2007-01-23 2013-11-13 日立化成株式会社 接着剤組成物、回路接続構造体及び半導体装置
JP2008255312A (ja) * 2007-03-14 2008-10-23 Hitachi Chem Co Ltd 接着剤組成物
JP5023901B2 (ja) * 2007-05-23 2012-09-12 日立化成工業株式会社 接着剤組成物、回路接続構造体及び半導体装置
JP2009108226A (ja) * 2007-10-31 2009-05-21 Yokohama Rubber Co Ltd:The 硬化性樹脂組成物
JP5163056B2 (ja) * 2007-10-31 2013-03-13 横浜ゴム株式会社 硬化性樹脂組成物
JP5176139B2 (ja) * 2008-05-12 2013-04-03 日立化成株式会社 回路接続材料及びそれを用いた回路部材の接続構造
JP2011032479A (ja) * 2010-09-09 2011-02-17 Hitachi Chem Co Ltd 回路接続材料、回路部材の接続構造及び回路部材の接続方法。
WO2015068611A1 (ja) * 2013-11-07 2015-05-14 東洋インキＳｃホールディングス株式会社 導電性接着剤、導電性接着シート、配線デバイス、および配線デバイスの製造方法
JP6474620B2 (ja) * 2015-01-22 2019-02-27 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法
US11421116B2 (en) * 2018-10-19 2022-08-23 Fujikura Kasei Co., Ltd. Electroconductive paste

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW480278B (en) * 1997-10-20 2002-03-21 Toyo Boseki Adhesive resin composition and adhesive film
TW200538526A (en) * 1999-08-25 2005-12-01 Hitachi Chemical Co Ltd Wiring-connecting material and wiring-connected board production process using the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147760A (ja) * 1984-08-16 1986-03-08 Shin Etsu Polymer Co Ltd 異方導電接着剤
JPH01135639A (ja) * 1987-11-24 1989-05-29 Nippon Sheet Glass Co Ltd ポリエステル積層物
JPH03110711A (ja) * 1989-09-22 1991-05-10 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
JPH0652715A (ja) * 1992-07-30 1994-02-25 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
JP3876993B2 (ja) * 1997-02-27 2007-02-07 セイコーエプソン株式会社 接着構造、液晶装置、及び電子機器
AU6520798A (en) * 1997-03-31 1998-10-22 Hitachi Chemical Company, Ltd. Circuit connecting material, and structure and method of connecting circuit terminal
JP2000239642A (ja) * 1999-02-23 2000-09-05 Toyobo Co Ltd 反応性ホットメルト接着剤組成物
JP2001055555A (ja) * 1999-08-19 2001-02-27 Dainippon Ink & Chem Inc ラミネート用接着剤組成物
JP2002111213A (ja) * 2000-09-26 2002-04-12 Nippon Mektron Ltd 任意層間接続用バイア・ホールを有する多層プリント基板およびその製造方法
JP4158080B2 (ja) * 2002-01-30 2008-10-01 東洋紡績株式会社 導電性ペースト
JP4235895B2 (ja) * 2002-04-18 2009-03-11 東洋紡績株式会社 昇華型感熱転写記録材用ポリエステルフィルムおよびその製造方法
JP4470091B2 (ja) * 2003-08-11 2010-06-02 東洋紡績株式会社 ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW480278B (en) * 1997-10-20 2002-03-21 Toyo Boseki Adhesive resin composition and adhesive film
TW200538526A (en) * 1999-08-25 2005-12-01 Hitachi Chemical Co Ltd Wiring-connecting material and wiring-connected board production process using the same

Also Published As

Publication number Publication date
JP2006318990A (ja) 2006-11-24
TW200808138A (en) 2008-02-01
JP4844003B2 (ja) 2011-12-21

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