JP4841627B2 - 電子部品及びその製造方法 - Google Patents

電子部品及びその製造方法 Download PDF

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Publication number
JP4841627B2
JP4841627B2 JP2008517940A JP2008517940A JP4841627B2 JP 4841627 B2 JP4841627 B2 JP 4841627B2 JP 2008517940 A JP2008517940 A JP 2008517940A JP 2008517940 A JP2008517940 A JP 2008517940A JP 4841627 B2 JP4841627 B2 JP 4841627B2
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JP
Japan
Prior art keywords
frame
circuit board
assembly
electronic component
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008517940A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2007139098A1 (ja
Inventor
洋一 松岡
利典 中原
惠子 瀧川
章寿 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2008517940A priority Critical patent/JP4841627B2/ja
Publication of JPWO2007139098A1 publication Critical patent/JPWO2007139098A1/ja
Application granted granted Critical
Publication of JP4841627B2 publication Critical patent/JP4841627B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
JP2008517940A 2006-05-31 2007-05-29 電子部品及びその製造方法 Expired - Fee Related JP4841627B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008517940A JP4841627B2 (ja) 2006-05-31 2007-05-29 電子部品及びその製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006150903 2006-05-31
JP2006150903 2006-05-31
JP2008517940A JP4841627B2 (ja) 2006-05-31 2007-05-29 電子部品及びその製造方法
PCT/JP2007/060884 WO2007139098A1 (ja) 2006-05-31 2007-05-29 電子部品及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2007139098A1 JPWO2007139098A1 (ja) 2009-10-08
JP4841627B2 true JP4841627B2 (ja) 2011-12-21

Family

ID=38778619

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008517940A Expired - Fee Related JP4841627B2 (ja) 2006-05-31 2007-05-29 電子部品及びその製造方法

Country Status (5)

Country Link
US (1) US20090154176A1 (https=)
EP (1) EP2023413A1 (https=)
JP (1) JP4841627B2 (https=)
TW (1) TW200814372A (https=)
WO (1) WO2007139098A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100796522B1 (ko) * 2006-09-05 2008-01-21 삼성전기주식회사 전자소자 내장형 인쇄회로기판의 제조방법
JP5064278B2 (ja) * 2008-03-25 2012-10-31 日東電工株式会社 光半導体素子封止用樹脂シートおよび光半導体装置
US8486761B2 (en) * 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
US8319247B2 (en) 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
CN102760824B (zh) * 2011-04-29 2016-06-08 展晶科技(深圳)有限公司 发光二极管封装结构
CN103794698B (zh) * 2012-10-31 2016-12-21 展晶科技(深圳)有限公司 发光二极管
CN110416394B (zh) * 2015-05-01 2022-09-23 日亚化学工业株式会社 发光模块

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3137823B2 (ja) 1994-02-25 2001-02-26 シャープ株式会社 チップ部品型ｌｅｄ及びその製造方法
JP3991624B2 (ja) * 2001-06-26 2007-10-17 日亜化学工業株式会社 表面実装型発光装置及びその製造方法
JP2005079329A (ja) * 2003-08-29 2005-03-24 Stanley Electric Co Ltd 表面実装型発光ダイオード
JP4325412B2 (ja) * 2004-01-21 2009-09-02 日亜化学工業株式会社 発光装置及び発光装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法

Also Published As

Publication number Publication date
US20090154176A1 (en) 2009-06-18
WO2007139098A1 (ja) 2007-12-06
JPWO2007139098A1 (ja) 2009-10-08
TWI343665B (https=) 2011-06-11
TW200814372A (en) 2008-03-16
EP2023413A1 (en) 2009-02-11

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