TWI343665B - - Google Patents

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Publication number
TWI343665B
TWI343665B TW096119303A TW96119303A TWI343665B TW I343665 B TWI343665 B TW I343665B TW 096119303 A TW096119303 A TW 096119303A TW 96119303 A TW96119303 A TW 96119303A TW I343665 B TWI343665 B TW I343665B
Authority
TW
Taiwan
Prior art keywords
frame
circuit board
assembly
electronic component
forming
Prior art date
Application number
TW096119303A
Other languages
English (en)
Chinese (zh)
Other versions
TW200814372A (en
Inventor
Nakahara Toshinori
Takigawa Keiko
Matsumoto Akihisa
Matsuoka Yoichi
Original Assignee
Sanyo Electric Co
Tokyo Sanyo Electric Co
Matsuoka Yoichi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co, Tokyo Sanyo Electric Co, Matsuoka Yoichi filed Critical Sanyo Electric Co
Publication of TW200814372A publication Critical patent/TW200814372A/zh
Application granted granted Critical
Publication of TWI343665B publication Critical patent/TWI343665B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Led Device Packages (AREA)
TW096119303A 2006-05-31 2007-05-30 Electronic component and method for manufacturing the same TW200814372A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006150903 2006-05-31

Publications (2)

Publication Number Publication Date
TW200814372A TW200814372A (en) 2008-03-16
TWI343665B true TWI343665B (https=) 2011-06-11

Family

ID=38778619

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096119303A TW200814372A (en) 2006-05-31 2007-05-30 Electronic component and method for manufacturing the same

Country Status (5)

Country Link
US (1) US20090154176A1 (https=)
EP (1) EP2023413A1 (https=)
JP (1) JP4841627B2 (https=)
TW (1) TW200814372A (https=)
WO (1) WO2007139098A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100796522B1 (ko) * 2006-09-05 2008-01-21 삼성전기주식회사 전자소자 내장형 인쇄회로기판의 제조방법
JP5064278B2 (ja) * 2008-03-25 2012-10-31 日東電工株式会社 光半導体素子封止用樹脂シートおよび光半導体装置
US8486761B2 (en) * 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
US8319247B2 (en) 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
CN102760824B (zh) * 2011-04-29 2016-06-08 展晶科技(深圳)有限公司 发光二极管封装结构
CN103794698B (zh) * 2012-10-31 2016-12-21 展晶科技(深圳)有限公司 发光二极管
CN110416394B (zh) * 2015-05-01 2022-09-23 日亚化学工业株式会社 发光模块

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3137823B2 (ja) 1994-02-25 2001-02-26 シャープ株式会社 チップ部品型ｌｅｄ及びその製造方法
JP3991624B2 (ja) * 2001-06-26 2007-10-17 日亜化学工業株式会社 表面実装型発光装置及びその製造方法
JP2005079329A (ja) * 2003-08-29 2005-03-24 Stanley Electric Co Ltd 表面実装型発光ダイオード
JP4325412B2 (ja) * 2004-01-21 2009-09-02 日亜化学工業株式会社 発光装置及び発光装置の製造方法
JP2006186297A (ja) * 2004-12-03 2006-07-13 Toshiba Corp 半導体発光装置及びその製造方法

Also Published As

Publication number Publication date
US20090154176A1 (en) 2009-06-18
WO2007139098A1 (ja) 2007-12-06
JPWO2007139098A1 (ja) 2009-10-08
JP4841627B2 (ja) 2011-12-21
TW200814372A (en) 2008-03-16
EP2023413A1 (en) 2009-02-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees