JP4828468B2 - Ledパッケージ - Google Patents
Ledパッケージ Download PDFInfo
- Publication number
- JP4828468B2 JP4828468B2 JP2007110409A JP2007110409A JP4828468B2 JP 4828468 B2 JP4828468 B2 JP 4828468B2 JP 2007110409 A JP2007110409 A JP 2007110409A JP 2007110409 A JP2007110409 A JP 2007110409A JP 4828468 B2 JP4828468 B2 JP 4828468B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- led chip
- chip
- package according
- led package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 13
- 239000003086 colorant Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims 3
- 238000004806 packaging method and process Methods 0.000 description 8
- 238000000605 extraction Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Description
101,201 パッケージ本体
110,120 マウント部
110a,110b,110c,120a,120b,120c,120d,120e 実装面
150a,150b,150c,160a,160b,160c,160d,160e LEDチップ
170,180 樹脂包装部
175 蛍光体
R 反射コップ
Claims (14)
- LEDチップを実装するためのマウント部を有するパッケージ本体と、
前記マウント部上に実装された複数のLEDチップと、
を含み、
前記マウント部の上面は非平面で、前記マウント部は上に膨らんだ断面構造を有し、前記複数のLEDチップのうちの何れか1つのLEDチップの、隣り合うLEDチップと近接するチップ側面から垂直に放出された光の光経路上に他のLEDチップが配置されず、前記何れか1つのLEDチップと前記隣り合うLEDチップとの間では近接するチップ側面が相異なる方向に向いており、
前記マウント部は前記複数のLEDチップのうちの何れか1つのLEDチップのチップ側面から垂直に放出された光の光経路上に位置しないことを特徴とするLEDパッケージ。 - 前記パッケージ本体は、上部に形成された反射コップを有し、前記マウント部は前記反射コップの底部上に配置されたことを特徴とする請求項1に記載のLEDパッケージ。
- 前記LEDチップは、相異なる色の光を出すLEDチップであることを特徴とする請求項1又は2に記載のLEDパッケージ。
- 前記LEDチップは、同一色の光を出すLEDチップであることを特徴とする請求項1又は2に記載のLEDパッケージ。
- 前記マウント部は、上に膨らんだ多角形の断面構造を有することを特徴とする請求項1〜4のいずれか一項に記載のLEDパッケージ。
- 前記マウント部の上面は相異なる3個の実装面からなっており、前記LEDチップは前記3個の実装面上に各々実装されたことを特徴とする請求項5に記載のLEDパッケージ。
- 前記マウント部の上面は相異なる5個の実装面からなっており、前記LEDチップは前記5個の実装面上に各々実装されたことを特徴とする請求項5に記載のLEDパッケージ。
- 前記LEDパッケージは、白色光を出力するLEDパッケージであることを特徴とする請求項1〜7のいずれか一項に記載のLEDパッケージ。
- 前記LEDチップは、赤色LEDチップ、緑色LEDチップ及び赤色LEDチップを含むことを特徴とする請求項8に記載のLEDパッケージ。
- 前記LEDチップを取り囲んで密封する樹脂包装部をさらに含み、
前記LEDチップは青色LEDチップで、前記樹脂包装部には黄色蛍光体が分散されていることを特徴とする請求項8に記載のLEDパッケージ。 - 前記LEDチップを取り囲んで密封する樹脂包装部をさらに含み、
前記LEDチップは青色LEDチップで、前記樹脂包装部には赤色及び緑色蛍光体が分散されていることを特徴とする請求項8に記載のLEDパッケージ。 - 前記LEDチップを取り囲んで密封する樹脂包装部をさらに含み、
前記LEDチップは紫外線LEDチップで、前記樹脂包装部には赤色、緑色及び青色蛍光体が分散されていることを特徴とする請求項8に記載のLEDパッケージ。 - 前記LEDチップ各々の長さは、チップの幅の10倍以上であることを特徴とする請求項1〜12のいずれか一項に記載のLEDパッケージ。
- 前記長さは5mm以上で、前記幅は500μm以下であることを特徴とする請求項13に記載のLEDパッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0036373 | 2006-04-21 | ||
KR1020060036373A KR100799864B1 (ko) | 2006-04-21 | 2006-04-21 | Led 패키지 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007294962A JP2007294962A (ja) | 2007-11-08 |
JP4828468B2 true JP4828468B2 (ja) | 2011-11-30 |
Family
ID=38618645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007110409A Active JP4828468B2 (ja) | 2006-04-21 | 2007-04-19 | Ledパッケージ |
Country Status (5)
Country | Link |
---|---|
US (1) | US8546834B2 (ja) |
JP (1) | JP4828468B2 (ja) |
KR (1) | KR100799864B1 (ja) |
CN (1) | CN101060116B (ja) |
TW (1) | TWI370566B (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101323401B1 (ko) * | 2006-12-29 | 2013-10-29 | 엘지디스플레이 주식회사 | 광원소자, 그 제조방법, 이를 구비한 백라이트 유닛 및액정표시장치 |
CN201066688Y (zh) * | 2007-05-11 | 2008-05-28 | 群康科技(深圳)有限公司 | 发光二极管及背光模组 |
CN102820410B (zh) * | 2008-01-28 | 2015-06-03 | 晶元光电股份有限公司 | 发光元件的封装结构 |
DE102008018353A1 (de) * | 2008-01-30 | 2009-08-06 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelelements |
JP2009272193A (ja) * | 2008-05-09 | 2009-11-19 | Funai Electric Co Ltd | バックライト装置及び液晶表示装置 |
CN101707197B (zh) * | 2009-09-23 | 2013-09-18 | 东莞市莱硕光电科技有限公司 | 全方位发光led器件 |
KR101081069B1 (ko) | 2009-12-21 | 2011-11-07 | 엘지이노텍 주식회사 | 발광소자 및 그를 이용한 라이트 유닛 |
KR101039881B1 (ko) * | 2009-12-21 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자 및 그를 이용한 라이트 유닛 |
US20120161170A1 (en) * | 2010-12-27 | 2012-06-28 | GE Lighting Solutions, LLC | Generation of radiation conducive to plant growth using a combination of leds and phosphors |
JP2012142410A (ja) * | 2010-12-28 | 2012-07-26 | Rohm Co Ltd | 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置 |
WO2013010389A1 (zh) | 2011-07-15 | 2013-01-24 | 中国科学院半导体研究所 | 发光二极管封装结构及其制造方法 |
US9228727B2 (en) | 2012-04-05 | 2016-01-05 | Michael W. May | Lighting assembly |
US8702265B2 (en) | 2012-04-05 | 2014-04-22 | Michael W. May | Non-curvilinear LED luminaries |
CN104157770B (zh) * | 2013-05-14 | 2017-01-25 | 展晶科技(深圳)有限公司 | 发光二极管模组 |
CN106461196B (zh) | 2014-04-18 | 2018-06-26 | 迈克尔·W·梅 | 发光组合件 |
DE202015103126U1 (de) * | 2015-06-15 | 2016-09-19 | Tridonic Jennersdorf Gmbh | LED-Modul |
US10267489B2 (en) * | 2015-12-22 | 2019-04-23 | Citizen Electronics Co., Ltd. | Light-emitting apparatus |
JP6827295B2 (ja) * | 2015-12-22 | 2021-02-10 | シチズン電子株式会社 | Led発光装置 |
MX2018008480A (es) | 2016-01-07 | 2018-11-09 | May Michael | Sistema conector para conjunto de iluminacion. |
US9739427B1 (en) | 2016-02-09 | 2017-08-22 | Michael W. May | Networked LED lighting system |
CN108160422B (zh) * | 2017-12-28 | 2019-01-29 | 旭宇光电(深圳)股份有限公司 | 大功率led透镜注胶方法 |
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-
2006
- 2006-04-21 KR KR1020060036373A patent/KR100799864B1/ko active IP Right Grant
-
2007
- 2007-04-12 US US11/783,788 patent/US8546834B2/en active Active
- 2007-04-17 TW TW096113426A patent/TWI370566B/zh active
- 2007-04-19 JP JP2007110409A patent/JP4828468B2/ja active Active
- 2007-04-20 CN CN2007100981799A patent/CN101060116B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TW200746476A (en) | 2007-12-16 |
US8546834B2 (en) | 2013-10-01 |
US20070246714A1 (en) | 2007-10-25 |
KR20070104145A (ko) | 2007-10-25 |
KR100799864B1 (ko) | 2008-01-31 |
JP2007294962A (ja) | 2007-11-08 |
CN101060116B (zh) | 2010-06-16 |
TWI370566B (en) | 2012-08-11 |
CN101060116A (zh) | 2007-10-24 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |