JP5238618B2 - 半導体発光装置 - Google Patents
半導体発光装置Info
- Publication number
- JP5238618B2 JP5238618B2 JP2009141286A JP2009141286A JP5238618B2 JP 5238618 B2 JP5238618 B2 JP 5238618B2 JP 2009141286 A JP2009141286 A JP 2009141286A JP 2009141286 A JP2009141286 A JP 2009141286A JP 5238618 B2 JP5238618 B2 JP 5238618B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- recess
- hollow portion
- led chip
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 22
- 239000011347 resin Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 24
- 230000003287 optical effect Effects 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 description 22
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 9
- 239000000654 additive Substances 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 239000000945 filler Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
2 内側面
3 底面
4 LEDチップ
5 第一波長変換部材
6 第二波長変換部材
7 第二波長変換部材の上面
8 光透過性樹脂
11 第一凹部
12 内側面
13 下部開口部
14 第一中空部
15 内側面
16 波長変換部材
17 変角部
18 第二中空部
Claims (1)
- 凹部を設けた基材と、
前記凹部の開口部を底面とする中空部と、
前記凹部の底面に載設された少なくとも一つのLEDチップと、
前記凹部に充填された光透過性樹脂と、
前記光透過性樹脂上であって前記中空部に充填された波長変換部材とを有し、
前記中空部の下部開口部が前記凹部の開口部と同一であって、且つ前記中空部の内側面の光軸に対する角度が前記凹部の内側面の光軸に対する角度より大きく、
上記光透過性樹脂の表面は前記凹部の開口部で平面状となったものであること、を特徴とする半導体発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009141286A JP5238618B2 (ja) | 2009-06-12 | 2009-06-12 | 半導体発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009141286A JP5238618B2 (ja) | 2009-06-12 | 2009-06-12 | 半導体発光装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003328090A Division JP4366161B2 (ja) | 2003-09-19 | 2003-09-19 | 半導体発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009200534A JP2009200534A (ja) | 2009-09-03 |
JP5238618B2 true JP5238618B2 (ja) | 2013-07-17 |
Family
ID=41143627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009141286A Expired - Lifetime JP5238618B2 (ja) | 2009-06-12 | 2009-06-12 | 半導体発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5238618B2 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120206660A1 (en) * | 2009-12-01 | 2012-08-16 | Sharp Kabushiki Kaisha | Light source package, illumination device, display device, and television receiving device |
TW201145597A (en) * | 2010-01-28 | 2011-12-16 | Lg Innotek Co Ltd | Light emitting device package |
JP5595185B2 (ja) * | 2010-08-27 | 2014-09-24 | 三菱電機株式会社 | 発光装置および照明器具 |
KR101210066B1 (ko) | 2011-01-31 | 2012-12-07 | 엘지이노텍 주식회사 | 광 변환 부재 및 이를 포함하는 표시장치 |
KR20120107793A (ko) | 2011-03-22 | 2012-10-04 | 엘지이노텍 주식회사 | 표시장치 및 광 변환 부재 |
KR101251738B1 (ko) * | 2011-03-22 | 2013-04-05 | 엘지이노텍 주식회사 | 표시장치 |
KR101241511B1 (ko) * | 2011-03-22 | 2013-03-11 | 엘지이노텍 주식회사 | 광 변환 부재 및 이를 포함하는 표시장치 |
KR20130009020A (ko) | 2011-07-14 | 2013-01-23 | 엘지이노텍 주식회사 | 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법 |
KR101305696B1 (ko) | 2011-07-14 | 2013-09-09 | 엘지이노텍 주식회사 | 표시장치 및 광학 부재 |
KR101893494B1 (ko) | 2011-07-18 | 2018-08-30 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
KR101262520B1 (ko) | 2011-07-18 | 2013-05-08 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
KR101241549B1 (ko) | 2011-07-18 | 2013-03-11 | 엘지이노텍 주식회사 | 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법 |
KR101294415B1 (ko) | 2011-07-20 | 2013-08-08 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
KR101251815B1 (ko) | 2011-11-07 | 2013-04-09 | 엘지이노텍 주식회사 | 광학 시트 및 이를 포함하는 표시장치 |
KR102125450B1 (ko) | 2013-12-05 | 2020-06-22 | 엘지이노텍 주식회사 | 광변환부재 및 이를 포함하는 조명장치 |
JP6560045B2 (ja) * | 2015-07-29 | 2019-08-14 | 京セラ株式会社 | 発光装置 |
CN111640739B (zh) * | 2020-05-29 | 2022-03-25 | 青岛歌尔智能传感器有限公司 | 光学传感器封装结构和电子设备 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63178569A (ja) * | 1987-01-20 | 1988-07-22 | Toshiba Corp | 半導体発光装置 |
JP3065258B2 (ja) * | 1996-09-30 | 2000-07-17 | 日亜化学工業株式会社 | 発光装置及びそれを用いた表示装置 |
JP3065263B2 (ja) * | 1996-12-27 | 2000-07-17 | 日亜化学工業株式会社 | 発光装置及びそれを用いたled表示器 |
JP3486345B2 (ja) * | 1998-07-14 | 2004-01-13 | 東芝電子エンジニアリング株式会社 | 半導体発光装置 |
JP3604298B2 (ja) * | 1999-02-25 | 2004-12-22 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
JP3789747B2 (ja) * | 2000-11-15 | 2006-06-28 | 三洋電機株式会社 | 発光装置の製造方法 |
JP4061869B2 (ja) * | 2001-07-26 | 2008-03-19 | 松下電工株式会社 | 発光装置の製造方法 |
-
2009
- 2009-06-12 JP JP2009141286A patent/JP5238618B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2009200534A (ja) | 2009-09-03 |
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