TWI370566B - Led package - Google Patents

Led package

Info

Publication number
TWI370566B
TWI370566B TW096113426A TW96113426A TWI370566B TW I370566 B TWI370566 B TW I370566B TW 096113426 A TW096113426 A TW 096113426A TW 96113426 A TW96113426 A TW 96113426A TW I370566 B TWI370566 B TW I370566B
Authority
TW
Taiwan
Prior art keywords
led package
package
led
Prior art date
Application number
TW096113426A
Other languages
English (en)
Other versions
TW200746476A (en
Inventor
Masayoshi Koike
Bum Joon Kim
Original Assignee
Samsung Led Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Led Co Ltd filed Critical Samsung Led Co Ltd
Publication of TW200746476A publication Critical patent/TW200746476A/zh
Application granted granted Critical
Publication of TWI370566B publication Critical patent/TWI370566B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
TW096113426A 2006-04-21 2007-04-17 Led package TWI370566B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060036373A KR100799864B1 (ko) 2006-04-21 2006-04-21 Ｌｅｄ 패키지

Publications (2)

Publication Number Publication Date
TW200746476A TW200746476A (en) 2007-12-16
TWI370566B true TWI370566B (en) 2012-08-11

Family

ID=38618645

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096113426A TWI370566B (en) 2006-04-21 2007-04-17 Led package

Country Status (5)

Country Link
US (1) US8546834B2 (zh)
JP (1) JP4828468B2 (zh)
KR (1) KR100799864B1 (zh)
CN (1) CN101060116B (zh)
TW (1) TWI370566B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101323401B1 (ko) * 2006-12-29 2013-10-29 엘지디스플레이 주식회사 광원소자, 그 제조방법, 이를 구비한 백라이트 유닛 및액정표시장치
CN201066688Y (zh) * 2007-05-11 2008-05-28 群康科技(深圳)有限公司 发光二极管及背光模组
CN102820410B (zh) * 2008-01-28 2015-06-03 晶元光电股份有限公司 发光元件的封装结构
DE102008018353A1 (de) * 2008-01-30 2009-08-06 Osram Opto Semiconductors Gmbh Strahlungsemittierendes optoelektronisches Bauelement und Verfahren zur Herstellung eines strahlungsemittierenden Bauelelements
JP2009272193A (ja) * 2008-05-09 2009-11-19 Funai Electric Co Ltd バックライト装置及び液晶表示装置
CN101707197B (zh) * 2009-09-23 2013-09-18 东莞市莱硕光电科技有限公司 全方位发光led器件
KR101081069B1 (ko) 2009-12-21 2011-11-07 엘지이노텍 주식회사 발광소자 및 그를 이용한 라이트 유닛
KR101039881B1 (ko) * 2009-12-21 2011-06-09 엘지이노텍 주식회사 발광소자 및 그를 이용한 라이트 유닛
US20120161170A1 (en) * 2010-12-27 2012-06-28 GE Lighting Solutions, LLC Generation of radiation conducive to plant growth using a combination of leds and phosphors
JP2012142410A (ja) * 2010-12-28 2012-07-26 Rohm Co Ltd 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置
WO2013010389A1 (zh) 2011-07-15 2013-01-24 中国科学院半导体研究所 发光二极管封装结构及其制造方法
US9228727B2 (en) 2012-04-05 2016-01-05 Michael W. May Lighting assembly
US8702265B2 (en) 2012-04-05 2014-04-22 Michael W. May Non-curvilinear LED luminaries
CN104157770B (zh) * 2013-05-14 2017-01-25 展晶科技(深圳)有限公司 发光二极管模组
CN106461196B (zh) 2014-04-18 2018-06-26 迈克尔·W·梅 发光组合件
DE202015103126U1 (de) * 2015-06-15 2016-09-19 Tridonic Jennersdorf Gmbh LED-Modul
US10267489B2 (en) * 2015-12-22 2019-04-23 Citizen Electronics Co., Ltd. Light-emitting apparatus
JP6827295B2 (ja) * 2015-12-22 2021-02-10 シチズン電子株式会社 Ｌｅｄ発光装置
MX2018008480A (es) 2016-01-07 2018-11-09 May Michael Sistema conector para conjunto de iluminacion.
US9739427B1 (en) 2016-02-09 2017-08-22 Michael W. May Networked LED lighting system
CN108160422B (zh) * 2017-12-28 2019-01-29 旭宇光电（深圳）股份有限公司 大功率led透镜注胶方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997152A (en) * 1997-09-15 1999-12-07 Oki Electric Industry Co., Ltd. Light emitting element module and printer head using the same
US6325524B1 (en) 1999-01-29 2001-12-04 Agilent Technologies, Inc. Solid state based illumination source for a projection display
US7728345B2 (en) * 2001-08-24 2010-06-01 Cao Group, Inc. Semiconductor light source for illuminating a physical space including a 3-dimensional lead frame
US6840654B2 (en) * 2002-11-20 2005-01-11 Acolyte Technologies Corp. LED light and reflector
JP2004200102A (ja) 2002-12-20 2004-07-15 Kankyo Shomei:Kk 白色発光ダイオード屋外照明器具
US6917057B2 (en) * 2002-12-31 2005-07-12 Gelcore Llc Layered phosphor coatings for LED devices
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法
US20040183081A1 (en) * 2003-03-20 2004-09-23 Alexander Shishov Light emitting diode package with self dosing feature and methods of forming same
JP3931916B2 (ja) 2003-04-24 2007-06-20 日亜化学工業株式会社 半導体装置及びその製造方法
US7005679B2 (en) * 2003-05-01 2006-02-28 Cree, Inc. Multiple component solid state white light
US6869812B1 (en) 2003-05-13 2005-03-22 Heng Liu High power AllnGaN based multi-chip light emitting diode
JP4183180B2 (ja) 2003-07-23 2008-11-19 シャープ株式会社 半導体発光装置
TW200512949A (en) * 2003-09-17 2005-04-01 Nanya Plastics Corp A method to provide emission of white color light by the principle of secondary excitation and its product
CN2678144Y (zh) 2003-11-20 2005-02-09 宏齐科技股份有限公司 发光二极管光源模块结构
JP2005158958A (ja) 2003-11-25 2005-06-16 Matsushita Electric Works Ltd 発光装置
TWI250664B (en) 2004-01-30 2006-03-01 South Epitaxy Corp White light LED
KR100583159B1 (ko) * 2004-02-16 2006-05-23 엘지이노텍 주식회사 발광 다이오드 패키지
US7250715B2 (en) * 2004-02-23 2007-07-31 Philips Lumileds Lighting Company, Llc Wavelength converted semiconductor light emitting devices
TWI237406B (en) 2004-06-04 2005-08-01 Advanced Optoelectronic Tech Multichip light emitting diode package
JP4353042B2 (ja) * 2004-09-27 2009-10-28 パナソニック電工株式会社 半導体発光装置

Also Published As

Publication number Publication date
TW200746476A (en) 2007-12-16
US8546834B2 (en) 2013-10-01
JP4828468B2 (ja) 2011-11-30
US20070246714A1 (en) 2007-10-25
KR20070104145A (ko) 2007-10-25
KR100799864B1 (ko) 2008-01-31
JP2007294962A (ja) 2007-11-08
CN101060116B (zh) 2010-06-16
CN101060116A (zh) 2007-10-24

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