TWI318467B - Light-emitting device - Google Patents

Light-emitting device

Info

Publication number
TWI318467B
TWI318467B TW95146805A TW95146805A TWI318467B TW I318467 B TWI318467 B TW I318467B TW 95146805 A TW95146805 A TW 95146805A TW 95146805 A TW95146805 A TW 95146805A TW I318467 B TWI318467 B TW I318467B
Authority
TW
Taiwan
Prior art keywords
light
emitting device
emitting
Prior art date
Application number
TW95146805A
Other languages
Chinese (zh)
Other versions
TW200826320A (en
Inventor
Min-De Lin
Hsi-Hsuan Yen
Ming-Yao Lin
Wen-Yung Yeh
Chia-Chang Kuo
Sheng-Pan Huang
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW95146805A priority Critical patent/TWI318467B/en
Publication of TW200826320A publication Critical patent/TW200826320A/en
Application granted granted Critical
Publication of TWI318467B publication Critical patent/TWI318467B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
TW95146805A 2006-12-14 2006-12-14 Light-emitting device TWI318467B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95146805A TWI318467B (en) 2006-12-14 2006-12-14 Light-emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95146805A TWI318467B (en) 2006-12-14 2006-12-14 Light-emitting device

Publications (2)

Publication Number Publication Date
TW200826320A TW200826320A (en) 2008-06-16
TWI318467B true TWI318467B (en) 2009-12-11

Family

ID=44772356

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95146805A TWI318467B (en) 2006-12-14 2006-12-14 Light-emitting device

Country Status (1)

Country Link
TW (1) TWI318467B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508612B (en) * 2010-07-28 2015-11-11 Epistar Corp A light-emitting device with temperature compensation

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM374153U (en) 2009-03-19 2010-02-11 Intematix Technology Ct Corp Light emitting device applied to AC drive
TWM388109U (en) 2009-10-15 2010-09-01 Intematix Tech Center Corp Light emitting diode apparatus
US9210767B2 (en) 2011-12-20 2015-12-08 Everlight Electronics Co., Ltd. Lighting apparatus and light emitting diode device thereof
TW201434134A (en) 2013-02-27 2014-09-01 Everlight Electronics Co Ltd Lighting device, backlight module and illuminating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI508612B (en) * 2010-07-28 2015-11-11 Epistar Corp A light-emitting device with temperature compensation

Also Published As

Publication number Publication date
TW200826320A (en) 2008-06-16

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