JP4815708B2 - 発光ダイオードを用いた表示装置 - Google Patents

発光ダイオードを用いた表示装置 Download PDF

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Publication number
JP4815708B2
JP4815708B2 JP2001220972A JP2001220972A JP4815708B2 JP 4815708 B2 JP4815708 B2 JP 4815708B2 JP 2001220972 A JP2001220972 A JP 2001220972A JP 2001220972 A JP2001220972 A JP 2001220972A JP 4815708 B2 JP4815708 B2 JP 4815708B2
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JP
Japan
Prior art keywords
plating
emitting diode
light emitting
light
lead electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001220972A
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English (en)
Japanese (ja)
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JP2002094130A5 (enExample
JP2002094130A (ja
Inventor
育也 新居
昇 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2001220972A priority Critical patent/JP4815708B2/ja
Publication of JP2002094130A publication Critical patent/JP2002094130A/ja
Publication of JP2002094130A5 publication Critical patent/JP2002094130A5/ja
Application granted granted Critical
Publication of JP4815708B2 publication Critical patent/JP4815708B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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  • Led Device Packages (AREA)
JP2001220972A 1999-01-05 2001-07-23 発光ダイオードを用いた表示装置 Expired - Lifetime JP4815708B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001220972A JP4815708B2 (ja) 1999-01-05 2001-07-23 発光ダイオードを用いた表示装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP11-276 1999-01-05
JP1999000276 1999-01-05
JP27699 1999-01-05
JP2001220972A JP4815708B2 (ja) 1999-01-05 2001-07-23 発光ダイオードを用いた表示装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP16350199A Division JP3310955B2 (ja) 1999-01-05 1999-06-10 発光ダイオード及びその製造方法、並びにそれを用いた表示装置

Publications (3)

Publication Number Publication Date
JP2002094130A JP2002094130A (ja) 2002-03-29
JP2002094130A5 JP2002094130A5 (enExample) 2006-07-27
JP4815708B2 true JP4815708B2 (ja) 2011-11-16

Family

ID=26333216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001220972A Expired - Lifetime JP4815708B2 (ja) 1999-01-05 2001-07-23 発光ダイオードを用いた表示装置

Country Status (1)

Country Link
JP (1) JP4815708B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3685057B2 (ja) * 1999-12-08 2005-08-17 日亜化学工業株式会社 Ｌｅｄランプ及びその製造方法
JP2007157430A (ja) * 2005-12-02 2007-06-21 Nec Tokin Corp リードスイッチ
JP4618571B2 (ja) * 2008-12-19 2011-01-26 スタンレー電気株式会社 車両前照灯用光源装置
JP5556369B2 (ja) * 2010-05-25 2014-07-23 日亜化学工業株式会社 発光装置及びそれを用いた表示装置
JP7049769B2 (ja) * 2017-02-22 2022-04-07 株式会社本田電子技研 自動ドア開閉制御用センサ
US10483445B2 (en) 2017-08-31 2019-11-19 Nichia Corporation Lead frame, package for light emitting device, light emitting device, and method for manufacturing light emitting device

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4956870U (enExample) * 1972-08-26 1974-05-20
JPS53122392A (en) * 1977-03-31 1978-10-25 Omron Tateisi Electronics Co Manufacture for photo electric device
JPS574183A (en) * 1980-06-10 1982-01-09 Toshiba Corp Metallic thin strip for installing semiconductor light-emitting element
JPS574184A (en) * 1980-06-10 1982-01-09 Toshiba Corp Metallic thin strip for installing semiconductor light-emitting element
JPS5868993A (ja) * 1981-10-21 1983-04-25 Toshiba Corp 半導体装置
JPS58111958U (ja) * 1982-01-21 1983-07-30 シャープ株式会社 半導体装置のリ−ドフレ−ム
JPS60138090A (ja) * 1983-12-26 1985-07-22 Toppan Printing Co Ltd 部分銀めつき方法
JPS6118185A (ja) * 1984-07-04 1986-01-27 Toshiba Corp 光半導体装置用リ−ドフレ−ム
JP2812614B2 (ja) * 1992-06-25 1998-10-22 ローム株式会社 発光ダイオード
JPH06283763A (ja) * 1993-03-25 1994-10-07 Rohm Co Ltd Ｌｅｄランプのリードフレーム製造方法
JPH0732969U (ja) * 1994-11-14 1995-06-16 三洋電機株式会社 発光ダイオードランプ
JP2927202B2 (ja) * 1995-03-29 1999-07-28 日亜化学工業株式会社 Ｌｅｄランプ
JPH09260727A (ja) * 1996-03-25 1997-10-03 Rohm Co Ltd 発光装置
JPH1012926A (ja) * 1996-06-20 1998-01-16 Toyoda Gosei Co Ltd 全色発光型発光ダイオードランプ及びディスプレイ装置
JP2956594B2 (ja) * 1996-07-03 1999-10-04 日亜化学工業株式会社 発光ダイオード及びそれを用いた表示装置
JPH10144839A (ja) * 1996-11-05 1998-05-29 Metetsuku Kitamura Kk リードフレームとその製造方法及びリード部品
JP2828142B2 (ja) * 1997-01-31 1998-11-25 日亜化学工業株式会社 Ｌｅｄランプ及びその形成方法
JPH10265973A (ja) * 1997-03-27 1998-10-06 Kobe Steel Ltd 良好な銀めっき性を有する電子部品用銅合金材の製造方法

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Publication number Publication date
JP2002094130A (ja) 2002-03-29

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