JP4799835B2 - 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 - Google Patents

室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 Download PDF

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Publication number
JP4799835B2
JP4799835B2 JP2004203661A JP2004203661A JP4799835B2 JP 4799835 B2 JP4799835 B2 JP 4799835B2 JP 2004203661 A JP2004203661 A JP 2004203661A JP 2004203661 A JP2004203661 A JP 2004203661A JP 4799835 B2 JP4799835 B2 JP 4799835B2
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Japan
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group
room temperature
composition
curable organopolysiloxane
organopolysiloxane composition
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JP2004203661A
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Japanese (ja)
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JP2006022278A5 (enExample
JP2006022278A (ja
Inventor
修 三谷
正之 大西
春美 小玉
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Publication of JP2006022278A5 publication Critical patent/JP2006022278A5/ja
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  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2004203661A 2004-07-09 2004-07-09 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器 Expired - Fee Related JP4799835B2 (ja)

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JP2004203661A JP4799835B2 (ja) 2004-07-09 2004-07-09 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器

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JP2004203661A JP4799835B2 (ja) 2004-07-09 2004-07-09 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器

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JP2006022278A JP2006022278A (ja) 2006-01-26
JP2006022278A5 JP2006022278A5 (enExample) 2007-08-09
JP4799835B2 true JP4799835B2 (ja) 2011-10-26

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5285892B2 (ja) * 2007-10-25 2013-09-11 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
JP5534656B2 (ja) * 2008-07-17 2014-07-02 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
JP2012236942A (ja) * 2011-05-13 2012-12-06 Dow Corning Toray Co Ltd 透明非金属製導電部の保護方法
JP2013012556A (ja) 2011-06-28 2013-01-17 Sony Corp 固体撮像装置とその製造方法、および電子機器
CN105874010A (zh) 2013-12-27 2016-08-17 道康宁东丽株式会社 室温下可固化的有机硅橡胶组合物及其用途
CN113773505A (zh) 2013-12-27 2021-12-10 陶氏东丽株式会社 室温下可固化的有机硅橡胶组合物及其用途以及修复电子设备的方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60255602A (ja) * 1984-05-29 1985-12-17 Toyota Motor Corp 酸化物超微粒子の製造方法
US4888380A (en) * 1988-09-26 1989-12-19 Dow Corning Corporation Clear, non-slumping silicone sealants
US4962151A (en) * 1989-06-22 1990-10-09 Dow Corning Corporation Silicone sealant compositions
JP3725178B2 (ja) * 1991-03-22 2005-12-07 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
JPH0739547B2 (ja) * 1992-01-10 1995-05-01 東レ・ダウコーニング・シリコーン株式会社 室温硬化性オルガノポリシロキサン組成物
JPH06248184A (ja) * 1993-02-24 1994-09-06 Toshiba Silicone Co Ltd 室温硬化性ポリオルガノシロキサン組成物
JP3447805B2 (ja) * 1994-06-14 2003-09-16 信越化学工業株式会社 剥離紙用シリコーン組成物およびその塗工物品
JPH11246742A (ja) * 1998-02-27 1999-09-14 Hitachi Chem Co Ltd ペースト組成物及びこれを用いた半導体装置
JP2001192641A (ja) * 2000-01-06 2001-07-17 Dow Corning Toray Silicone Co Ltd シーリング材組成物
JP2002356616A (ja) * 2001-05-30 2002-12-13 Dow Corning Toray Silicone Co Ltd 室温硬化性シリコーンゴム組成物
JP2003049072A (ja) * 2001-05-30 2003-02-21 Dow Corning Toray Silicone Co Ltd 室温硬化性シリコーンゴム組成物
WO2003010227A1 (en) * 2001-07-26 2003-02-06 Dow Corning Toray Silicone Co., Ltd. Room-temperature-curable organopolysiloxane composition
JP2004352947A (ja) * 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
JP4180477B2 (ja) * 2003-09-10 2008-11-12 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP4733937B2 (ja) * 2004-07-09 2011-07-27 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器

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