JP4782712B2 - 多層基板およびその製造方法 - Google Patents
多層基板およびその製造方法 Download PDFInfo
- Publication number
- JP4782712B2 JP4782712B2 JP2007044065A JP2007044065A JP4782712B2 JP 4782712 B2 JP4782712 B2 JP 4782712B2 JP 2007044065 A JP2007044065 A JP 2007044065A JP 2007044065 A JP2007044065 A JP 2007044065A JP 4782712 B2 JP4782712 B2 JP 4782712B2
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- JP
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- Prior art keywords
- layer
- nickel
- plating
- core
- multilayer substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C7/00—Parts, details, or accessories of chairs or stools
- A47C7/36—Support for the head or the back
- A47C7/40—Support for the head or the back for the back
- A47C7/44—Support for the head or the back for the back with elastically-mounted back-rest or backrest-seat unit in the base frame
- A47C7/448—Support for the head or the back for the back with elastically-mounted back-rest or backrest-seat unit in the base frame with resilient blocks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C27/00—Spring, stuffed or fluid mattresses or cushions specially adapted for chairs, beds or sofas
- A47C27/14—Spring, stuffed or fluid mattresses or cushions specially adapted for chairs, beds or sofas with foamed material inlays
- A47C27/142—Spring, stuffed or fluid mattresses or cushions specially adapted for chairs, beds or sofas with foamed material inlays with projections, depressions or cavities
- A47C27/146—Spring, stuffed or fluid mattresses or cushions specially adapted for chairs, beds or sofas with foamed material inlays with projections, depressions or cavities on the outside surface of the mattress or cushion
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61H—PHYSICAL THERAPY APPARATUS, e.g. DEVICES FOR LOCATING OR STIMULATING REFLEX POINTS IN THE BODY; ARTIFICIAL RESPIRATION; MASSAGE; BATHING DEVICES FOR SPECIAL THERAPEUTIC OR HYGIENIC PURPOSES OR SPECIFIC PARTS OF THE BODY
- A61H39/00—Devices for locating or stimulating specific reflex points of the body for physical therapy, e.g. acupuncture
- A61H39/04—Devices for pressing such points, e.g. Shiatsu or Acupressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Rehabilitation Therapy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Pain & Pain Management (AREA)
- Physical Education & Sports Medicine (AREA)
- Epidemiology (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
Description
Claims (15)
- 配線パターンに応じて内部回路が形成され、ビスマレイミドトリアジン樹脂からなるコア絶縁層と、前記コア絶縁層の少なくとも一面に前記配線パターンに応じて積層される第1ニッケル層と、前記第1ニッケル層の上に積層される第1銅層とを含むコア層と、
前記コア層上に形成される、ビスマレイミドトリアジン樹脂またはエポキシ樹脂をベースとしてビスマレイミドトリアジン樹脂を添加して改質されたエポキシ樹脂を含む第1絶縁層と、
前記第1絶縁層上に前記配線パターンに応じて積層され、厚みが0.3ないし2μmである第2ニッケル層と、
前記第2ニッケル層の上部に積層される第2銅層と
を含み、前記第1ニッケル層、前記第1銅層、前記第2ニッケル層および前記第2銅層の配線幅は10ないし20μmである多層基板。 - 前記第2ニッケル層は、全体100重量部に対してリンを5ないし15重量部でさらに含む請求項1に記載の多層基板。
- 前記第1絶縁層と前記第2ニッケル層の結合力は、0.7ないし0.9kgf/cmである請求項1に記載の多層基板。
- ビスマレイミドトリアジン樹脂またはエポキシ樹脂をベースとしてビスマレイミドトリアジン樹脂を添加して改質されたエポキシ樹脂を含むコア絶縁層を提供する段階と、前記コア絶縁層の少なくとも一面に無電解めっき法により第1ニッケル層を形成する段階と、前記第1ニッケル層上に第1フォトレジスト層を積層する段階と、前記第1フォトレジスト層を配線パターンに応ずるように露光および現像する段階と、前記第1ニッケル層上に電解めっき法により第1銅層を形成する段階と、前記第1フォトレジスト層を除去する段階と、前記第1ニッケル層をエッチングする段階と、を含む方法によりコア層を製造する段階と、
前記コア層の少なくとも一面にビスマレイミドトリアジン樹脂またはエポキシ樹脂をベースとしてビスマレイミドトリアジン樹脂を添加して改質されたエポキシ樹脂を含む第1絶縁層を積層する段階と、
前記第1絶縁層上に無電解めっき法により厚みが0.3ないし2μmである第2ニッケル層を形成する段階と、
前記第2ニッケル層上に第2フォトレジスト層を積層する段階と、
前記第2フォトレジスト層を配線パターンに応ずるように露光および現像する段階と、
前記第2ニッケル層上に電解めっき法により第2銅層を形成する段階と、
前記第2フォトレジスト層を除去段階と、
前記第2ニッケル層をエッチングする段階と
を含む、前記第1ニッケル層、前記第1銅層、前記第2ニッケル層および前記第2銅層の配線幅は10ないし20μmである多層基板の製造方法。 - 前記無電解めっき法は、ニッケル塩、次亜リン酸ナトリウムおよびpH調整剤を含むめっき浴でめっきする請求項4に記載の多層基板の製造方法。
- 前記ニッケル塩は、硫酸ニッケル、塩化ニッケル、ホウフッ化ニッケルおよびアミド硫酸ニッケル(amidosulfonate)からなる群から選択される一つ以上の化合物である請求項5に記載の多層基板の製造方法。
- 前記ニッケル塩が、4ないし250g/L含まれる請求項5に記載の多層基板の製造方法。
- 前記次亜リン酸ナトリウムが、20ないし700g/Lで含まれる請求項5に記載の多層基板の製造方法。
- 前記pH調整剤は、アンモニア水、塩酸および酢酸からなる群から選択される一つ以上の化合物である請求項5に記載の多層基板の製造方法。
- 前記めっき浴のpHが、4ないし6である請求項5に記載の多層基板の製造方法。
- 前記めっき浴は、錯化剤をさらに含む請求項5に記載の多層基板の製造方法。
- 前記錯化剤は、コハク酸であり、前記コハク酸は、5ないし50g/Lで含まれる請求項11に記載の多層基板の製造方法。
- 前記めっき浴の温度が、60ないし90℃である請求項5に記載の多層基板の製造方法。
- 前記無電解めっきは、1ないし10分間行う請求項5に記載の多層基板の製造方法。
- 前記第2ニッケル層は、全体100重量部に対してリンを5ないし15重量部でさらに含む請求項4に記載の多層基板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2006-0018241 | 2006-02-24 | ||
KR1020060018241A KR100717909B1 (ko) | 2006-02-24 | 2006-02-24 | 니켈층을 포함하는 기판 및 이의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007227937A JP2007227937A (ja) | 2007-09-06 |
JP4782712B2 true JP4782712B2 (ja) | 2011-09-28 |
Family
ID=38270668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007044065A Expired - Fee Related JP4782712B2 (ja) | 2006-02-24 | 2007-02-23 | 多層基板およびその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US20070201214A1 (ja) |
JP (1) | JP4782712B2 (ja) |
KR (1) | KR100717909B1 (ja) |
CN (1) | CN101026927A (ja) |
Families Citing this family (7)
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WO2007000799A1 (ja) * | 2005-06-27 | 2007-01-04 | Advantest Corporation | コンタクタ、該コンタクタを備えたコンタクトストラクチャ、プローブカード、試験装置、コンタクトストラクチャ製造方法、及び、コンタクトストラクチャ製造装置 |
WO2007003223A1 (en) * | 2005-07-04 | 2007-01-11 | Freescale Semiconductor, Inc. | Method and apparatus for forming a noble metal layer, notably on inlaid metal features |
KR100643928B1 (ko) * | 2005-08-29 | 2006-11-10 | 삼성전기주식회사 | 이원화된 내층 구조를 가진 인쇄회로기판 |
US20080239684A1 (en) * | 2007-04-02 | 2008-10-02 | Shinko Electric Industries Co., Ltd. | Wiring board and method of manufacturing the same |
-
2006
- 2006-02-24 KR KR1020060018241A patent/KR100717909B1/ko not_active IP Right Cessation
-
2007
- 2007-02-16 CN CNA2007100795136A patent/CN101026927A/zh active Pending
- 2007-02-21 US US11/708,577 patent/US20070201214A1/en not_active Abandoned
- 2007-02-23 JP JP2007044065A patent/JP4782712B2/ja not_active Expired - Fee Related
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2010
- 2010-07-27 US US12/805,371 patent/US20100291488A1/en not_active Abandoned
Also Published As
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JP2007227937A (ja) | 2007-09-06 |
US20100291488A1 (en) | 2010-11-18 |
KR100717909B1 (ko) | 2007-05-14 |
US20070201214A1 (en) | 2007-08-30 |
CN101026927A (zh) | 2007-08-29 |
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