JP4771893B2 - 基板保持装置 - Google Patents

基板保持装置 Download PDF

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Publication number
JP4771893B2
JP4771893B2 JP2006227245A JP2006227245A JP4771893B2 JP 4771893 B2 JP4771893 B2 JP 4771893B2 JP 2006227245 A JP2006227245 A JP 2006227245A JP 2006227245 A JP2006227245 A JP 2006227245A JP 4771893 B2 JP4771893 B2 JP 4771893B2
Authority
JP
Japan
Prior art keywords
substrate
valve
surface plate
vacuum
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006227245A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008053391A (ja
Inventor
芳明 升
英典 宮本
健司 吉澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2006227245A priority Critical patent/JP4771893B2/ja
Priority to TW096119595A priority patent/TW200816358A/zh
Priority to CNB2007101452754A priority patent/CN100521144C/zh
Priority to KR1020070083176A priority patent/KR100906554B1/ko
Publication of JP2008053391A publication Critical patent/JP2008053391A/ja
Application granted granted Critical
Publication of JP4771893B2 publication Critical patent/JP4771893B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
JP2006227245A 2006-08-24 2006-08-24 基板保持装置 Active JP4771893B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006227245A JP4771893B2 (ja) 2006-08-24 2006-08-24 基板保持装置
TW096119595A TW200816358A (en) 2006-08-24 2007-05-31 Board retainer
CNB2007101452754A CN100521144C (zh) 2006-08-24 2007-08-17 基板保持装置
KR1020070083176A KR100906554B1 (ko) 2006-08-24 2007-08-20 기판 유지장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006227245A JP4771893B2 (ja) 2006-08-24 2006-08-24 基板保持装置

Publications (2)

Publication Number Publication Date
JP2008053391A JP2008053391A (ja) 2008-03-06
JP4771893B2 true JP4771893B2 (ja) 2011-09-14

Family

ID=39129152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006227245A Active JP4771893B2 (ja) 2006-08-24 2006-08-24 基板保持装置

Country Status (4)

Country Link
JP (1) JP4771893B2 (enExample)
KR (1) KR100906554B1 (enExample)
CN (1) CN100521144C (enExample)
TW (1) TW200816358A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5210060B2 (ja) * 2008-07-02 2013-06-12 東京応化工業株式会社 剥離装置および剥離方法
CN102179881A (zh) * 2011-04-01 2011-09-14 石金精密科技（深圳）有限公司 平面薄板吸附固定系统
CN102496595B (zh) * 2011-11-25 2014-06-11 清华大学 晶圆托架、晶圆交换装置以及晶圆在位检测方法
CN102496587B (zh) * 2011-11-25 2014-06-11 清华大学 晶圆在位检测装置以及晶圆在位检测方法
JP6057599B2 (ja) * 2012-08-09 2017-01-11 タツモ株式会社 吸着定盤及びその製造方法
TW201509544A (zh) * 2013-09-05 2015-03-16 Rich Chen Automatically Controlled Co Ltd 基板塗佈裝置及塗佈方法
CN106853432B (zh) * 2016-11-24 2019-04-16 重庆市永川区锐峰玻璃制品有限公司 旋转涂胶台
CN110124908B (zh) * 2019-06-21 2021-09-07 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 晶片真空吸附装置
CN111132539A (zh) * 2020-01-17 2020-05-08 安徽博微长安电子有限公司 一种手动点胶贴片机无损贴装凝胶盒中芯片的工装及方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2880264B2 (ja) * 1990-07-12 1999-04-05 キヤノン株式会社 基板保持装置
JPH08125000A (ja) * 1994-10-24 1996-05-17 Nec Kyushu Ltd ウェーハチャック
JPH0927541A (ja) * 1995-07-10 1997-01-28 Nikon Corp 基板ホルダ
JPH0945755A (ja) * 1995-07-26 1997-02-14 Hitachi Ltd ウェハチャックおよびウェハ吸着方法
JP2003023060A (ja) * 2001-07-10 2003-01-24 Shimadzu Corp 吊り下げ型基板保持装置および液晶パネル製造装置

Also Published As

Publication number Publication date
KR20080018808A (ko) 2008-02-28
TWI360195B (enExample) 2012-03-11
TW200816358A (en) 2008-04-01
CN100521144C (zh) 2009-07-29
KR100906554B1 (ko) 2009-07-07
CN101131954A (zh) 2008-02-27
JP2008053391A (ja) 2008-03-06

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