JP4769132B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP4769132B2
JP4769132B2 JP2006183685A JP2006183685A JP4769132B2 JP 4769132 B2 JP4769132 B2 JP 4769132B2 JP 2006183685 A JP2006183685 A JP 2006183685A JP 2006183685 A JP2006183685 A JP 2006183685A JP 4769132 B2 JP4769132 B2 JP 4769132B2
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JP
Japan
Prior art keywords
light
phosphor
light emitting
emitting device
wavelength conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006183685A
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English (en)
Japanese (ja)
Other versions
JP2007180483A (ja
JP2007180483A5 (enExample
Inventor
昌嗣 増田
潤 鈴木
司 井ノ口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2006183685A priority Critical patent/JP4769132B2/ja
Publication of JP2007180483A publication Critical patent/JP2007180483A/ja
Publication of JP2007180483A5 publication Critical patent/JP2007180483A5/ja
Application granted granted Critical
Publication of JP4769132B2 publication Critical patent/JP4769132B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Landscapes

  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2006183685A 2005-11-30 2006-07-03 発光装置 Active JP4769132B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006183685A JP4769132B2 (ja) 2005-11-30 2006-07-03 発光装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005345884 2005-11-30
JP2005345884 2005-11-30
JP2006183685A JP4769132B2 (ja) 2005-11-30 2006-07-03 発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010254758A Division JP2011091414A (ja) 2005-11-30 2010-11-15 発光装置

Publications (3)

Publication Number Publication Date
JP2007180483A JP2007180483A (ja) 2007-07-12
JP2007180483A5 JP2007180483A5 (enExample) 2010-09-16
JP4769132B2 true JP4769132B2 (ja) 2011-09-07

Family

ID=38305326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006183685A Active JP4769132B2 (ja) 2005-11-30 2006-07-03 発光装置

Country Status (1)

Country Link
JP (1) JP4769132B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11377594B2 (en) 2018-09-12 2022-07-05 Denka Company Limited Phosphor and light-emitting device

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007049114A (ja) 2005-05-30 2007-02-22 Sharp Corp 発光装置とその製造方法
JP2011091414A (ja) * 2005-11-30 2011-05-06 Sharp Corp 発光装置
JP5367218B2 (ja) 2006-11-24 2013-12-11 シャープ株式会社 蛍光体の製造方法および発光装置の製造方法
JP5412710B2 (ja) * 2007-01-31 2014-02-12 日亜化学工業株式会社 窒化物系蛍光体又は酸窒化物系蛍光体
US8513876B2 (en) * 2007-05-22 2013-08-20 National Institute For Materials Science Fluorescent substance, method for producing the same, and light-emitting device using the same
JP2009019163A (ja) * 2007-07-13 2009-01-29 Sharp Corp 発光装置用蛍光体粒子集合体、発光装置、および液晶表示用バックライト装置
US8344400B2 (en) * 2007-08-31 2013-01-01 Lg Innotek Co., Ltd. Light emitting device package
CN101960624B (zh) 2008-03-03 2012-09-26 夏普株式会社 发光装置
CN101960619B (zh) * 2008-03-26 2013-06-26 松下电器产业株式会社 半导体发光装置
JP5239043B2 (ja) 2008-07-18 2013-07-17 シャープ株式会社 発光装置および発光装置の製造方法
US8415870B2 (en) * 2008-08-28 2013-04-09 Panasonic Corporation Semiconductor light emitting device and backlight source, backlight source system, display device and electronic device using the same
US8928005B2 (en) 2009-07-02 2015-01-06 Sharp Kabushiki Kaisha Light-emitting device
JP5791034B2 (ja) * 2010-02-26 2015-10-07 国立研究開発法人物質・材料研究機構 発光装置
US8901591B2 (en) 2010-07-26 2014-12-02 Sharp Kabushiki Kaisha Light-emitting device
CN102376860A (zh) 2010-08-05 2012-03-14 夏普株式会社 发光装置及其制造方法
JP5319743B2 (ja) * 2010-09-08 2013-10-16 株式会社東芝 発光装置
EP2428543B1 (en) * 2010-09-08 2013-05-08 Kabushiki Kaisha Toshiba Light emitting device
JP5557828B2 (ja) * 2011-12-07 2014-07-23 三菱電機株式会社 発光装置
WO2013118329A1 (ja) * 2012-02-09 2013-08-15 電気化学工業株式会社 蛍光体及び発光装置
JP5916409B2 (ja) * 2012-02-09 2016-05-11 デンカ株式会社 蛍光体及び発光装置
JP5697766B2 (ja) * 2012-02-09 2015-04-08 電気化学工業株式会社 蛍光体及び発光装置
JP5916413B2 (ja) * 2012-02-09 2016-05-11 デンカ株式会社 蛍光体及び発光装置
JP5916408B2 (ja) * 2012-02-09 2016-05-11 デンカ株式会社 蛍光体及び発光装置
JP7045192B2 (ja) 2016-01-15 2022-03-31 デンカ株式会社 蛍光体および発光装置
JP2018150431A (ja) * 2017-03-10 2018-09-27 デンカ株式会社 緑色蛍光体および発光装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3717480B2 (ja) * 2003-01-27 2005-11-16 ローム株式会社 半導体発光装置
JP3871668B2 (ja) * 2003-08-26 2007-01-24 東芝電子エンジニアリング株式会社 半導体発光装置
JP3837588B2 (ja) * 2003-11-26 2006-10-25 独立行政法人物質・材料研究機構 蛍光体と蛍光体を用いた発光器具
JP3921545B2 (ja) * 2004-03-12 2007-05-30 独立行政法人物質・材料研究機構 蛍光体とその製造方法
JP4045298B2 (ja) * 2004-03-22 2008-02-13 株式会社フジクラ 発光デバイス及び照明装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11377594B2 (en) 2018-09-12 2022-07-05 Denka Company Limited Phosphor and light-emitting device

Also Published As

Publication number Publication date
JP2007180483A (ja) 2007-07-12

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