JP4762959B2 - 半導体チップおよび半導体装置 - Google Patents
半導体チップおよび半導体装置 Download PDFInfo
- Publication number
- JP4762959B2 JP4762959B2 JP2007227579A JP2007227579A JP4762959B2 JP 4762959 B2 JP4762959 B2 JP 4762959B2 JP 2007227579 A JP2007227579 A JP 2007227579A JP 2007227579 A JP2007227579 A JP 2007227579A JP 4762959 B2 JP4762959 B2 JP 4762959B2
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- film forming
- forming layer
- sheet
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007227579A JP4762959B2 (ja) | 2007-09-03 | 2007-09-03 | 半導体チップおよび半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007227579A JP4762959B2 (ja) | 2007-09-03 | 2007-09-03 | 半導体チップおよび半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004054354A Division JP4271597B2 (ja) | 2004-02-27 | 2004-02-27 | チップ用保護膜形成用シート |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008072108A JP2008072108A (ja) | 2008-03-27 |
JP2008072108A5 JP2008072108A5 (es) | 2008-05-15 |
JP4762959B2 true JP4762959B2 (ja) | 2011-08-31 |
Family
ID=39293378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007227579A Expired - Lifetime JP4762959B2 (ja) | 2007-09-03 | 2007-09-03 | 半導体チップおよび半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4762959B2 (es) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160129757A (ko) | 2015-04-30 | 2016-11-09 | 닛토덴코 가부시키가이샤 | 일체형 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법 |
KR20160129756A (ko) | 2015-04-30 | 2016-11-09 | 닛토덴코 가부시키가이샤 | 이면 보호 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5153597B2 (ja) * | 2008-12-05 | 2013-02-27 | リンテック株式会社 | チップ用保護膜形成用シートおよび保護膜付半導体チップ |
JP5893250B2 (ja) * | 2011-01-31 | 2016-03-23 | リンテック株式会社 | チップ用保護膜形成用シート、半導体チップの製造方法および半導体装置 |
JP2014165200A (ja) * | 2013-02-21 | 2014-09-08 | Shin Etsu Chem Co Ltd | 半導体チップの製造方法 |
WO2014155756A1 (ja) * | 2013-03-26 | 2014-10-02 | リンテック株式会社 | 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法 |
JP6220644B2 (ja) * | 2013-11-18 | 2017-10-25 | リンテック株式会社 | チップの製造方法 |
JP6085288B2 (ja) * | 2014-12-24 | 2017-02-22 | リンテック株式会社 | 保護膜形成用フィルムおよび半導体チップの製造方法 |
JP2016021768A (ja) * | 2015-09-09 | 2016-02-04 | 日本電波工業株式会社 | 圧電デバイスとその製造方法 |
WO2017188203A1 (ja) * | 2016-04-28 | 2017-11-02 | リンテック株式会社 | 保護膜付き半導体チップの製造方法及び半導体装置の製造方法 |
KR20220041858A (ko) * | 2019-08-02 | 2022-04-01 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 방법 및 기판 처리 장치 |
JP2024078062A (ja) * | 2022-11-29 | 2024-06-10 | 株式会社レゾナック | 接着剤フィルム、接着剤テープ、剥離フィルム付き接着剤テープ、半導体装置の製造方法及び半導体装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3483161B2 (ja) * | 1994-08-11 | 2004-01-06 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
JP3506519B2 (ja) * | 1995-03-06 | 2004-03-15 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
JPH1187282A (ja) * | 1997-09-02 | 1999-03-30 | Hitachi Chem Co Ltd | 半導体ウェハデバイス面保護用フィルム及びこれを用いた半導体ウェハ裏面研磨処理方法 |
JP3756689B2 (ja) * | 1999-02-08 | 2006-03-15 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
JP3339472B2 (ja) * | 1999-08-24 | 2002-10-28 | セイコーエプソン株式会社 | 半導体装置及びその製造方法 |
JP3544362B2 (ja) * | 2001-03-21 | 2004-07-21 | リンテック株式会社 | 半導体チップの製造方法 |
-
2007
- 2007-09-03 JP JP2007227579A patent/JP4762959B2/ja not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160129757A (ko) | 2015-04-30 | 2016-11-09 | 닛토덴코 가부시키가이샤 | 일체형 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법 |
KR20160129756A (ko) | 2015-04-30 | 2016-11-09 | 닛토덴코 가부시키가이샤 | 이면 보호 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
JP2008072108A (ja) | 2008-03-27 |
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