JP4762959B2 - 半導体チップおよび半導体装置 - Google Patents

半導体チップおよび半導体装置 Download PDF

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Publication number
JP4762959B2
JP4762959B2 JP2007227579A JP2007227579A JP4762959B2 JP 4762959 B2 JP4762959 B2 JP 4762959B2 JP 2007227579 A JP2007227579 A JP 2007227579A JP 2007227579 A JP2007227579 A JP 2007227579A JP 4762959 B2 JP4762959 B2 JP 4762959B2
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JP
Japan
Prior art keywords
protective film
film forming
forming layer
sheet
semiconductor chip
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Expired - Lifetime
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JP2007227579A
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English (en)
Japanese (ja)
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JP2008072108A5 (es
JP2008072108A (ja
Inventor
秀男 妹尾
貴志 杉野
修 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
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Lintec Corp
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Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Priority to JP2007227579A priority Critical patent/JP4762959B2/ja
Publication of JP2008072108A publication Critical patent/JP2008072108A/ja
Publication of JP2008072108A5 publication Critical patent/JP2008072108A5/ja
Application granted granted Critical
Publication of JP4762959B2 publication Critical patent/JP4762959B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
JP2007227579A 2007-09-03 2007-09-03 半導体チップおよび半導体装置 Expired - Lifetime JP4762959B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007227579A JP4762959B2 (ja) 2007-09-03 2007-09-03 半導体チップおよび半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007227579A JP4762959B2 (ja) 2007-09-03 2007-09-03 半導体チップおよび半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004054354A Division JP4271597B2 (ja) 2004-02-27 2004-02-27 チップ用保護膜形成用シート

Publications (3)

Publication Number Publication Date
JP2008072108A JP2008072108A (ja) 2008-03-27
JP2008072108A5 JP2008072108A5 (es) 2008-05-15
JP4762959B2 true JP4762959B2 (ja) 2011-08-31

Family

ID=39293378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007227579A Expired - Lifetime JP4762959B2 (ja) 2007-09-03 2007-09-03 半導体チップおよび半導体装置

Country Status (1)

Country Link
JP (1) JP4762959B2 (es)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160129757A (ko) 2015-04-30 2016-11-09 닛토덴코 가부시키가이샤 일체형 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법
KR20160129756A (ko) 2015-04-30 2016-11-09 닛토덴코 가부시키가이샤 이면 보호 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5153597B2 (ja) * 2008-12-05 2013-02-27 リンテック株式会社 チップ用保護膜形成用シートおよび保護膜付半導体チップ
JP5893250B2 (ja) * 2011-01-31 2016-03-23 リンテック株式会社 チップ用保護膜形成用シート、半導体チップの製造方法および半導体装置
JP2014165200A (ja) * 2013-02-21 2014-09-08 Shin Etsu Chem Co Ltd 半導体チップの製造方法
WO2014155756A1 (ja) * 2013-03-26 2014-10-02 リンテック株式会社 粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法
JP6220644B2 (ja) * 2013-11-18 2017-10-25 リンテック株式会社 チップの製造方法
JP6085288B2 (ja) * 2014-12-24 2017-02-22 リンテック株式会社 保護膜形成用フィルムおよび半導体チップの製造方法
JP2016021768A (ja) * 2015-09-09 2016-02-04 日本電波工業株式会社 圧電デバイスとその製造方法
WO2017188203A1 (ja) * 2016-04-28 2017-11-02 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
KR20220041858A (ko) * 2019-08-02 2022-04-01 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치
JP2024078062A (ja) * 2022-11-29 2024-06-10 株式会社レゾナック 接着剤フィルム、接着剤テープ、剥離フィルム付き接着剤テープ、半導体装置の製造方法及び半導体装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3483161B2 (ja) * 1994-08-11 2004-01-06 リンテック株式会社 粘接着テープおよびその使用方法
JP3506519B2 (ja) * 1995-03-06 2004-03-15 リンテック株式会社 粘接着テープおよびその使用方法
JPH1187282A (ja) * 1997-09-02 1999-03-30 Hitachi Chem Co Ltd 半導体ウェハデバイス面保護用フィルム及びこれを用いた半導体ウェハ裏面研磨処理方法
JP3756689B2 (ja) * 1999-02-08 2006-03-15 沖電気工業株式会社 半導体装置及びその製造方法
JP3339472B2 (ja) * 1999-08-24 2002-10-28 セイコーエプソン株式会社 半導体装置及びその製造方法
JP3544362B2 (ja) * 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160129757A (ko) 2015-04-30 2016-11-09 닛토덴코 가부시키가이샤 일체형 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법
KR20160129756A (ko) 2015-04-30 2016-11-09 닛토덴코 가부시키가이샤 이면 보호 필름, 필름, 반도체 장치의 제조 방법 및 보호 칩의 제조 방법

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JP2008072108A (ja) 2008-03-27

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