JP4760940B2 - 電子部品実装装置 - Google Patents
電子部品実装装置 Download PDFInfo
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- JP4760940B2 JP4760940B2 JP2009073294A JP2009073294A JP4760940B2 JP 4760940 B2 JP4760940 B2 JP 4760940B2 JP 2009073294 A JP2009073294 A JP 2009073294A JP 2009073294 A JP2009073294 A JP 2009073294A JP 4760940 B2 JP4760940 B2 JP 4760940B2
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- paste
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- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/75611—Feeding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53265—Means to assemble electrical device with work-holder for assembly
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
Description
きに応じてボンディングノズル26の角度を修正する。またボンディングヘッド3によってピックアップされたチップ16の位置や向きは、移動テーブル18に配置されているカメラ13によって鉛直下方から撮像され、基板24に実装される前に確認、修正することもできる。
とが望ましい。
し、ボンディングヘッド3が部品中継テーブル7に置かれた微小チップ52を吸着する。その間に部品供給テーブル6では微小チップ52に換えてチップ55が準備されている。
2 ピックアップヘッド
3 ボンディングヘッド
4 描画ヘッド
5 転写ヘッド
6 部品供給テーブル
7 部品中継テーブル
8 実装テーブル
9 ペースト供給テーブル
16、50、55 チップ
24 基板
52 微小チップ
Claims (2)
- 複数の電子部品を収納する電子部品収納部と、
基板を支持する基板支持部と、
前記基板支持部を挟んで前記電子部品収納部と対向する側に位置し、前記基板にペースト状の接合剤を供給するペースト供給手段と、
前記ペーストが供給された前記基板に電子部品を移載する移載ヘッドと、
を備え、
前記ペースト供給手段が、ペーストを貯留するペースト貯留部と、前記ペースト貯留部から前記基板にペーストを転写する転写ヘッドと、前記基板にペーストを吐出して描画する描画ヘッドとを備え、実装する電子部品の品種に応じて前記転写ヘッドもしくは前記描画ヘッドの何れかを選択して前記ペーストの供給を行うことを特徴とする電子部品実装装置。 - 前記基板に予め定められた許容値を超える反りが生じている場合には、実装する電子部品の品種に関係なく前記転写ヘッドを選択して前記ペーストの供給を行うことをすることを特徴とする請求項1に記載の電子部品実装装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009073294A JP4760940B2 (ja) | 2009-03-25 | 2009-03-25 | 電子部品実装装置 |
US12/720,116 US8122595B2 (en) | 2009-03-25 | 2010-03-09 | Electronic parts mounting device |
CN201010147551.2A CN101848633B (zh) | 2009-03-25 | 2010-03-25 | 电子部件安装装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009073294A JP4760940B2 (ja) | 2009-03-25 | 2009-03-25 | 電子部品実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010225968A JP2010225968A (ja) | 2010-10-07 |
JP4760940B2 true JP4760940B2 (ja) | 2011-08-31 |
Family
ID=42773038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009073294A Active JP4760940B2 (ja) | 2009-03-25 | 2009-03-25 | 電子部品実装装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8122595B2 (ja) |
JP (1) | JP4760940B2 (ja) |
CN (1) | CN101848633B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014038946A (ja) * | 2012-08-16 | 2014-02-27 | Sony Corp | 実装装置、部材の配置方法及び基板の製造方法 |
EP2894956B1 (en) * | 2012-09-06 | 2017-05-03 | Fuji Machine Mfg. Co., Ltd. | Control system and control method for component mounting machine |
JP5360323B1 (ja) * | 2013-04-26 | 2013-12-04 | 富士ゼロックス株式会社 | 粘性剤厚調整装置、搭載装置、基板装置の製造方法 |
US9136243B2 (en) * | 2013-12-03 | 2015-09-15 | Kulicke And Soffa Industries, Inc. | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements |
EP4084046A4 (en) * | 2019-12-26 | 2023-01-04 | Fuji Corporation | COMPONENT MOUNTING MACHINE AND TRANSFER MATERIAL TRANSFER METHOD |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4998342A (en) * | 1989-08-31 | 1991-03-12 | International Business Machines Corporation | Method of attaching electronic components |
JP3877038B2 (ja) | 1999-11-10 | 2007-02-07 | 武蔵エンジニアリング株式会社 | 液体の塗布方法および装置 |
JP2002028568A (ja) | 2000-07-17 | 2002-01-29 | Koha Co Ltd | 転写ピン、コレット、およびこれらを用いたダイボンダ |
JP2002299889A (ja) * | 2001-03-30 | 2002-10-11 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法 |
JP4728755B2 (ja) * | 2005-09-22 | 2011-07-20 | ハリマ化成株式会社 | 導電性接合の形成方法 |
JP4793187B2 (ja) * | 2006-09-11 | 2011-10-12 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
US7793817B2 (en) * | 2006-09-11 | 2010-09-14 | Panasonic Corporation | Electronic component placing apparatus and electronic component mounting method |
JP4846649B2 (ja) * | 2007-04-26 | 2011-12-28 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
-
2009
- 2009-03-25 JP JP2009073294A patent/JP4760940B2/ja active Active
-
2010
- 2010-03-09 US US12/720,116 patent/US8122595B2/en not_active Expired - Fee Related
- 2010-03-25 CN CN201010147551.2A patent/CN101848633B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20100242268A1 (en) | 2010-09-30 |
US8122595B2 (en) | 2012-02-28 |
CN101848633B (zh) | 2014-06-11 |
JP2010225968A (ja) | 2010-10-07 |
CN101848633A (zh) | 2010-09-29 |
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