JP4755942B2 - 基板の処理装置 - Google Patents
基板の処理装置 Download PDFInfo
- Publication number
- JP4755942B2 JP4755942B2 JP2006155150A JP2006155150A JP4755942B2 JP 4755942 B2 JP4755942 B2 JP 4755942B2 JP 2006155150 A JP2006155150 A JP 2006155150A JP 2006155150 A JP2006155150 A JP 2006155150A JP 4755942 B2 JP4755942 B2 JP 4755942B2
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- Prior art keywords
- substrate
- processing liquid
- chamber
- processing
- liquid
- Prior art date
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
上記処理液供給手段は、
下端面が長手方向に沿って傾斜した傾斜面に形成されその傾斜面が、搬送される上記基板の傾斜した上面と平行になるよう配設された容器本体と、
上記容器本体に設けた分割壁にて上記容器本体内に分割形成される、流入部と貯液部と、
上記傾斜面に開口して形成され上記貯液部に貯留された上記処理液を上記容器本体の貯液部から上記基板の上面の傾斜方向の全長にわたって直線状に流出させる流出部と、
上記容器本体内部を上記基板の傾斜方向に対して複数のチャンバに隔別する仕切り部材と、
上記流出部の各チャンバに対応する部分から流出する処理液の圧力が同じになるよう各チャンバに貯留される処理液の水頭を設定する水頭設定手段とを具備し、
上記水頭設定手段は、各チャンバに設けられそれぞれのチャンバに供給貯留される処理液を上記流入部側よりオーバフローさせて各チャンバの水頭が同じになるよう設定するオーバフロー壁であることを特徴とする基板の処理装置にある。
Claims (3)
- 所定の角度で傾斜しその傾斜方向と交差する方向に搬送される基板の上面を処理液供給手段から供給される処理液によって処理する基板の処理装置であって、
上記処理液供給手段は、
下端面が長手方向に沿って傾斜した傾斜面に形成されその傾斜面が、搬送される上記基板の傾斜した上面と平行になるよう配設された容器本体と、
上記容器本体に設けた分割壁にて上記容器本体内に分割形成される、流入部と貯液部と、
上記傾斜面に開口して形成され上記貯液部に貯留された上記処理液を上記容器本体の貯液部から上記基板の上面の傾斜方向の全長にわたって直線状に流出させる流出部と、
上記容器本体内部を上記基板の傾斜方向に対して複数のチャンバに隔別する仕切り部材と、
上記流出部の各チャンバに対応する部分から流出する処理液の圧力が同じになるよう各チャンバに貯留される処理液の水頭を設定する水頭設定手段とを具備し、
上記水頭設定手段は、各チャンバに設けられそれぞれのチャンバに供給貯留される処理液を上記流入部側よりオーバフローさせて各チャンバの水頭が同じになるよう設定するオーバフロー壁であることを特徴とする基板の処理装置。 - 上記流入部には、この流入部に供給される上記処理液が衝突する衝突壁が設けられることを特徴とする請求項1記載の基板の処理装置。
- 上記流出部には、この流出部から流出する上記処理液を上記基板の搬送方向前方に向かってガイドするガイド部材が設けられることを特徴とする請求項1または2記載の基板の処理装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006155150A JP4755942B2 (ja) | 2006-06-02 | 2006-06-02 | 基板の処理装置 |
TW096116594A TWI421925B (zh) | 2006-06-02 | 2007-05-10 | 基板處理裝置 |
KR1020070052062A KR101406048B1 (ko) | 2006-06-02 | 2007-05-29 | 기판 처리 장치 및 기판 처리 방법 |
CN2007101087587A CN101083206B (zh) | 2006-06-02 | 2007-05-31 | 基板的处理装置及处理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006155150A JP4755942B2 (ja) | 2006-06-02 | 2006-06-02 | 基板の処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007319824A JP2007319824A (ja) | 2007-12-13 |
JP4755942B2 true JP4755942B2 (ja) | 2011-08-24 |
Family
ID=38853054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006155150A Active JP4755942B2 (ja) | 2006-06-02 | 2006-06-02 | 基板の処理装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4755942B2 (ja) |
KR (1) | KR101406048B1 (ja) |
CN (1) | CN101083206B (ja) |
TW (1) | TWI421925B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7089902B2 (ja) * | 2018-02-28 | 2022-06-23 | 株式会社Screenホールディングス | 基板処理装置、基板処理装置における処理液排出方法、基板処理装置における処理液交換方法、基板処理装置における基板処理方法 |
EP3961226A4 (en) * | 2019-04-25 | 2023-02-15 | Kyocera Corporation | FLOW PATH DEVICE, CARTRIDGE AND METERING SYSTEM |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001035778A (ja) * | 1999-07-23 | 2001-02-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2003303806A (ja) * | 2002-04-12 | 2003-10-24 | Shibaura Mechatronics Corp | 処理液の供給装置、供給方法及び基板の処理装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3084809B2 (ja) * | 1991-08-07 | 2000-09-04 | ソニー株式会社 | スプレー塗布装置 |
-
2006
- 2006-06-02 JP JP2006155150A patent/JP4755942B2/ja active Active
-
2007
- 2007-05-10 TW TW096116594A patent/TWI421925B/zh not_active IP Right Cessation
- 2007-05-29 KR KR1020070052062A patent/KR101406048B1/ko active IP Right Grant
- 2007-05-31 CN CN2007101087587A patent/CN101083206B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001035778A (ja) * | 1999-07-23 | 2001-02-09 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2003303806A (ja) * | 2002-04-12 | 2003-10-24 | Shibaura Mechatronics Corp | 処理液の供給装置、供給方法及び基板の処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2007319824A (ja) | 2007-12-13 |
CN101083206A (zh) | 2007-12-05 |
KR101406048B1 (ko) | 2014-06-11 |
TWI421925B (zh) | 2014-01-01 |
KR20070115687A (ko) | 2007-12-06 |
CN101083206B (zh) | 2012-01-25 |
TW200802565A (en) | 2008-01-01 |
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