JP4747952B2 - 試料加工装置および試料加工方法 - Google Patents

試料加工装置および試料加工方法 Download PDF

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Publication number
JP4747952B2
JP4747952B2 JP2006150872A JP2006150872A JP4747952B2 JP 4747952 B2 JP4747952 B2 JP 4747952B2 JP 2006150872 A JP2006150872 A JP 2006150872A JP 2006150872 A JP2006150872 A JP 2006150872A JP 4747952 B2 JP4747952 B2 JP 4747952B2
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sample
sample piece
piece
branch
holding
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JP2006150872A
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Japanese (ja)
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JP2006292766A (ja
JP2006292766A5 (enExample
Inventor
昌和 菅谷
広康 志知
宗行 福田
馨 梅村
英巳 小池
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Hitachi Ltd
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Hitachi Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/208—Elements or methods for movement independent of sample stage for influencing or moving or contacting or transferring the sample or parts thereof, e.g. prober needles or transfer needles in FIB/SEM systems

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  • Analysing Materials By The Use Of Radiation (AREA)
  • Sampling And Sample Adjustment (AREA)
JP2006150872A 2006-05-31 2006-05-31 試料加工装置および試料加工方法 Expired - Fee Related JP4747952B2 (ja)

Priority Applications (1)

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JP2006150872A JP4747952B2 (ja) 2006-05-31 2006-05-31 試料加工装置および試料加工方法

Applications Claiming Priority (1)

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JP2006150872A JP4747952B2 (ja) 2006-05-31 2006-05-31 試料加工装置および試料加工方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001136829A Division JP4200665B2 (ja) 2001-05-08 2001-05-08 加工装置

Related Child Applications (2)

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JP2010171334A Division JP4826680B2 (ja) 2010-07-30 2010-07-30 はり部材
JP2011066959A Division JP5024468B2 (ja) 2011-03-25 2011-03-25 試料加工装置

Publications (3)

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JP2006292766A JP2006292766A (ja) 2006-10-26
JP2006292766A5 JP2006292766A5 (enExample) 2006-12-07
JP4747952B2 true JP4747952B2 (ja) 2011-08-17

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ID=37413445

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JP2006150872A Expired - Fee Related JP4747952B2 (ja) 2006-05-31 2006-05-31 試料加工装置および試料加工方法

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JP (1) JP4747952B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5055594B2 (ja) * 2007-03-13 2012-10-24 エスアイアイ・ナノテクノロジー株式会社 荷電粒子ビーム装置における試料移設方法及び荷電粒子ビーム装置
JP5009126B2 (ja) * 2007-10-26 2012-08-22 真則 尾張 アトムプローブ用針状試料の加工方法及び集束イオンビーム装置
JP5192411B2 (ja) * 2009-01-30 2013-05-08 株式会社日立ハイテクノロジーズ イオンビーム加工装置及び試料加工方法
JP2010181339A (ja) * 2009-02-06 2010-08-19 Sii Nanotechnology Inc 微小マニピュレータ装置
JP5152111B2 (ja) * 2009-06-22 2013-02-27 新日鐵住金株式会社 集束イオンビーム加工装置用プローブ、プローブ装置、及びプローブの製造方法
EP3101406B1 (de) * 2015-06-05 2022-12-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur präparation einer probe für die mikrostrukturdiagnostik sowie probe für die mikrostrukturdiagnostik

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62157789A (ja) * 1985-12-27 1987-07-13 オリンパス光学工業株式会社 微細物体操作装置
JPH02105038A (ja) * 1988-10-14 1990-04-17 Toshiba Corp 電子顕微鏡用試料の電解研磨装置
JP2708547B2 (ja) * 1989-05-10 1998-02-04 株式会社日立製作所 デバイス移植方法
JPH03154784A (ja) * 1989-11-13 1991-07-02 Hitachi Ltd 支持機構、支持システム、それを用いた組立方法及び組立装置
JP2716573B2 (ja) * 1990-06-14 1998-02-18 株式会社ニッコー クランプ装置
JPH07256575A (ja) * 1994-03-22 1995-10-09 Yotaro Hatamura 微小ワークの処理方法および装置
JP2560262B2 (ja) * 1994-11-09 1996-12-04 工業技術院長 二本指マイクロハンド機構
JPH08261897A (ja) * 1995-03-24 1996-10-11 Matsushita Electric Ind Co Ltd 透過型電子顕微鏡の試料作製方法及び試料作製装置
JPH09216187A (ja) * 1996-02-08 1997-08-19 Ebara Corp 微小物の把持具
JPH09262780A (ja) * 1996-03-27 1997-10-07 Nikon Corp マイクログリッパー装置
WO1999017103A2 (en) * 1997-08-27 1999-04-08 Micrion Corporation In-line fib process monitoring with wafer preservation
JP2000002630A (ja) * 1998-06-15 2000-01-07 Hitachi Ltd プローブ移動装置およびそれを用いた試料作製装置
JP4126786B2 (ja) * 1998-11-24 2008-07-30 株式会社日立製作所 試料作成装置および方法

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Publication number Publication date
JP2006292766A (ja) 2006-10-26

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