JP4745720B2 - 成膜方法、及びそれを用いたスペーサと薄型フラットパネルディスプレイの製造方法 - Google Patents

成膜方法、及びそれを用いたスペーサと薄型フラットパネルディスプレイの製造方法 Download PDF

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Publication number
JP4745720B2
JP4745720B2 JP2005142137A JP2005142137A JP4745720B2 JP 4745720 B2 JP4745720 B2 JP 4745720B2 JP 2005142137 A JP2005142137 A JP 2005142137A JP 2005142137 A JP2005142137 A JP 2005142137A JP 4745720 B2 JP4745720 B2 JP 4745720B2
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Japan
Prior art keywords
substrate
film
spacer
electron
forming method
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Expired - Fee Related
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JP2005142137A
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English (en)
Japanese (ja)
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JP2006015332A (ja
JP2006015332A5 (enExample
Inventor
和生 黒田
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2005142137A priority Critical patent/JP4745720B2/ja
Priority to US11/139,554 priority patent/US20050271826A1/en
Priority to KR1020050047010A priority patent/KR100787258B1/ko
Publication of JP2006015332A publication Critical patent/JP2006015332A/ja
Publication of JP2006015332A5 publication Critical patent/JP2006015332A5/ja
Application granted granted Critical
Publication of JP4745720B2 publication Critical patent/JP4745720B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/18—Assembling together the component parts of electrode systems
    • H01J9/185—Assembling together the component parts of electrode systems of flat panel display devices, e.g. by using spacers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1287—Process of deposition of the inorganic material with flow inducing means, e.g. ultrasonic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1291—Process of deposition of the inorganic material by heating of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels
    • H01J2329/86—Vessels
    • H01J2329/8625—Spacing members
    • H01J2329/863—Spacing members characterised by the form or structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels
    • H01J2329/86—Vessels
    • H01J2329/8625—Spacing members
    • H01J2329/863—Spacing members characterised by the form or structure
    • H01J2329/8635—Spacing members characterised by the form or structure having a corrugated lateral surface

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2005142137A 2004-06-03 2005-05-16 成膜方法、及びそれを用いたスペーサと薄型フラットパネルディスプレイの製造方法 Expired - Fee Related JP4745720B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005142137A JP4745720B2 (ja) 2004-06-03 2005-05-16 成膜方法、及びそれを用いたスペーサと薄型フラットパネルディスプレイの製造方法
US11/139,554 US20050271826A1 (en) 2004-06-03 2005-05-31 Film forming method, spacer utilizing the same and producing method for thin flat panel display
KR1020050047010A KR100787258B1 (ko) 2004-06-03 2005-06-02 성막방법, 이 성막방법을 이용한 스페이서 및 박형의 플랫패널 디스플레이의 제조방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004165562 2004-06-03
JP2004165562 2004-06-03
JP2005142137A JP4745720B2 (ja) 2004-06-03 2005-05-16 成膜方法、及びそれを用いたスペーサと薄型フラットパネルディスプレイの製造方法

Publications (3)

Publication Number Publication Date
JP2006015332A JP2006015332A (ja) 2006-01-19
JP2006015332A5 JP2006015332A5 (enExample) 2008-06-26
JP4745720B2 true JP4745720B2 (ja) 2011-08-10

Family

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Family Applications (1)

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JP2005142137A Expired - Fee Related JP4745720B2 (ja) 2004-06-03 2005-05-16 成膜方法、及びそれを用いたスペーサと薄型フラットパネルディスプレイの製造方法

Country Status (3)

Country Link
US (1) US20050271826A1 (enExample)
JP (1) JP4745720B2 (enExample)
KR (1) KR100787258B1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1862578B1 (en) 2006-06-01 2012-06-27 Samsung Electronics Co., Ltd. Drum Type Washing Machine
EP3828329B1 (en) 2006-06-01 2023-10-04 Samsung Electronics Co., Ltd. Washing machine having balancer
JP2008078113A (ja) * 2006-08-25 2008-04-03 Fujikura Ltd 透明導電性基板の製造装置
US8449970B2 (en) 2007-07-23 2013-05-28 3M Innovative Properties Company Antistatic article, method of making the same, and display device having the same
JP5309848B2 (ja) * 2008-09-30 2013-10-09 大日本印刷株式会社 積層体の製造方法
JPWO2013022032A1 (ja) * 2011-08-10 2015-03-05 日本曹達株式会社 積層体およびそれの製造方法
KR102689225B1 (ko) * 2016-10-07 2024-07-29 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN113971342B (zh) * 2021-10-20 2024-09-03 京东方科技集团股份有限公司 一种墨水干燥成膜的仿真方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
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FR910795A (fr) * 1939-05-20 1946-06-18 Union Des Verreries Mecaniques Procédé et dispositif de fabrication de verres spéciaux sur les machines à étirer
US4397671A (en) * 1981-11-30 1983-08-09 Ford Motor Company Method of placing a metal oxide film on a surface of a heated glass substrate
JPS61244025A (ja) * 1985-04-22 1986-10-30 Toa Nenryo Kogyo Kk 薄膜製造方法
JP3113149B2 (ja) * 1994-06-27 2000-11-27 キヤノン株式会社 電子線発生装置および該電子線発生装置を用いた画像形成装置
WO1996018204A1 (en) * 1994-12-05 1996-06-13 Color Planar Displays, Inc. Support structure for flat panel displays
US5540959A (en) * 1995-02-21 1996-07-30 Howard J. Greenwald Process for preparing a coated substrate
US6116184A (en) * 1996-05-21 2000-09-12 Symetrix Corporation Method and apparatus for misted liquid source deposition of thin film with reduced mist particle size
JP3681870B2 (ja) * 1997-09-05 2005-08-10 松下電池工業株式会社 化合物半導体膜の製造方法および太陽電池
JPH11176324A (ja) 1997-12-08 1999-07-02 Suzuki Sogyo Co Ltd 微細隔壁の形成方法
JPH11347477A (ja) * 1998-06-02 1999-12-21 Asahi Chem Ind Co Ltd コーティング方法
JP2000123724A (ja) 1998-10-20 2000-04-28 Matsushita Electric Ind Co Ltd ガス放電型表示装置の製造方法
US6617772B1 (en) * 1998-12-11 2003-09-09 Candescent Technologies Corporation Flat-panel display having spacer with rough face for inhibiting secondary electron escape
JP3135897B2 (ja) * 1999-02-25 2001-02-19 キヤノン株式会社 電子線装置用スペーサの製造方法と電子線装置の製造方法
JP3854794B2 (ja) * 1999-02-25 2006-12-06 キヤノン株式会社 電子線装置用スペーサの製造方法と電子線装置の製造方法
JP2002184313A (ja) 2000-12-12 2002-06-28 Toshiba Corp 画像表示装置の製造方法および封着材充填装置
JP2001259494A (ja) * 2000-03-17 2001-09-25 Matsushita Battery Industrial Co Ltd 薄膜形成方法
JP2003138376A (ja) * 2001-10-31 2003-05-14 Geomatec Co Ltd エアロゾル熱分解法による薄膜形成方法
JP4315363B2 (ja) * 2001-12-03 2009-08-19 日本板硝子株式会社 薄膜形成方法
JP2003206158A (ja) 2002-01-11 2003-07-22 Fujikura Ltd スプレー熱分解法による透明導電膜作製方法
JP2003303561A (ja) * 2002-04-10 2003-10-24 Canon Inc スペーサ、スペーサの製造方法および電子線装置
JP2004039269A (ja) * 2002-06-28 2004-02-05 Nippon Soda Co Ltd 透明導電膜付基体の製造方法
KR100462073B1 (ko) * 2002-07-10 2004-12-17 한국화학연구원 미분체 합성을 위한 초음파 분무열분해 장치

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Publication number Publication date
KR100787258B1 (ko) 2007-12-20
JP2006015332A (ja) 2006-01-19
KR20060049482A (ko) 2006-05-19
US20050271826A1 (en) 2005-12-08

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