JP4743801B2 - ワーク切断方法およびワーク切断用ワイヤ巻き幅変更装置 - Google Patents

ワーク切断方法およびワーク切断用ワイヤ巻き幅変更装置 Download PDF

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Publication number
JP4743801B2
JP4743801B2 JP2009114946A JP2009114946A JP4743801B2 JP 4743801 B2 JP4743801 B2 JP 4743801B2 JP 2009114946 A JP2009114946 A JP 2009114946A JP 2009114946 A JP2009114946 A JP 2009114946A JP 4743801 B2 JP4743801 B2 JP 4743801B2
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JP
Japan
Prior art keywords
wire
workpiece
cutting
area
roller
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Expired - Fee Related
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JP2009114946A
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English (en)
Japanese (ja)
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JP2010253664A (ja
JP2010253664A5 (enrdf_load_stackoverflow
Inventor
靖弘 伊東
茂雄 小林
克彦 阿部
洋介 長谷川
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Komatsu NTC Ltd
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Komatsu NTC Ltd
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Priority to JP2009114946A priority Critical patent/JP4743801B2/ja
Priority to TW99108655A priority patent/TW201039998A/zh
Priority to KR1020100028405A priority patent/KR20100109487A/ko
Priority to CN201010141534A priority patent/CN101850579A/zh
Publication of JP2010253664A publication Critical patent/JP2010253664A/ja
Publication of JP2010253664A5 publication Critical patent/JP2010253664A5/ja
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Publication of JP4743801B2 publication Critical patent/JP4743801B2/ja
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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2009114946A 2009-03-31 2009-05-11 ワーク切断方法およびワーク切断用ワイヤ巻き幅変更装置 Expired - Fee Related JP4743801B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009114946A JP4743801B2 (ja) 2009-03-31 2009-05-11 ワーク切断方法およびワーク切断用ワイヤ巻き幅変更装置
TW99108655A TW201039998A (en) 2009-03-31 2010-03-24 Workpiece cutting method and winding width alteration device of the workpiece cutting wire
KR1020100028405A KR20100109487A (ko) 2009-03-31 2010-03-30 피가공물 절단방법 및 피가공물 절단용 와이어의 권취 폭 변경장치
CN201010141534A CN101850579A (zh) 2009-03-31 2010-03-31 工件切断方法以及工件切断用线材卷绕宽度变更装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009085264 2009-03-31
JP2009085264 2009-03-31
JP2009114946A JP4743801B2 (ja) 2009-03-31 2009-05-11 ワーク切断方法およびワーク切断用ワイヤ巻き幅変更装置

Publications (3)

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JP2010253664A JP2010253664A (ja) 2010-11-11
JP2010253664A5 JP2010253664A5 (enrdf_load_stackoverflow) 2011-03-24
JP4743801B2 true JP4743801B2 (ja) 2011-08-10

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JP2009114946A Expired - Fee Related JP4743801B2 (ja) 2009-03-31 2009-05-11 ワーク切断方法およびワーク切断用ワイヤ巻き幅変更装置

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JP (1) JP4743801B2 (enrdf_load_stackoverflow)
TW (1) TW201039998A (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103407008A (zh) * 2013-07-19 2013-11-27 镇江环太硅科技有限公司 晶棒切割的改进方法
CN103372922B (zh) * 2013-07-30 2015-05-20 衡水英利新能源有限公司 一种分线网切割晶棒的方法
JP6275551B2 (ja) * 2014-05-27 2018-02-07 株式会社ディスコ マルチワイヤ放電加工装置
JP6923828B2 (ja) * 2015-09-15 2021-08-25 キヤノンマーケティングジャパン株式会社 ワイヤ放電加工装置
CN105479609A (zh) * 2015-12-04 2016-04-13 湖南红太阳光电科技有限公司 一种用于切割拼接硅棒的多线切割方法
CN107364023B (zh) * 2017-07-20 2019-04-09 阜宁协鑫光伏科技有限公司 切割用分线网及分线网切割硅片的方法
JP7011955B2 (ja) * 2018-03-15 2022-02-10 コマツＮｔｃ株式会社 ワイヤソーにおける段取り方法及びワイヤソー
CN111844489B (zh) * 2019-04-30 2024-02-06 天通日进精密技术有限公司 硅棒多工位开方设备及其多工位切割方法
CN110466082A (zh) * 2019-07-26 2019-11-19 扬州续笙新能源科技有限公司 一种适用于金刚线线网调整的切割装置及切割方法
CN112847862A (zh) * 2021-02-09 2021-05-28 常州时创能源股份有限公司 一种适用于单晶小硅块的切割方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02152765A (ja) * 1988-11-29 1990-06-12 Sumitomo Metal Ind Ltd ワイヤソーによる切断加工方法
JP3339231B2 (ja) * 1995-01-19 2002-10-28 富士電機株式会社 半導体装置の製造方法
JPH09123161A (ja) * 1995-10-27 1997-05-13 Tokyo Seimitsu Co Ltd ワイヤソーのワーク保持装置
JPH09290417A (ja) * 1996-04-27 1997-11-11 Nippei Toyama Corp ワイヤソー及びワーク加工方法
JP3716556B2 (ja) * 1997-06-10 2005-11-16 株式会社東京精密 マルチ切断ワイヤソーのウェーハ回収方法
JP2006205661A (ja) * 2005-01-31 2006-08-10 Sumitomo Electric Ind Ltd 基板製造方法
JP4818848B2 (ja) * 2006-08-28 2011-11-16 コマツＮｔｃ株式会社 ワイヤソー

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JP2010253664A (ja) 2010-11-11
TW201039998A (en) 2010-11-16

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