TW201039998A - Workpiece cutting method and winding width alteration device of the workpiece cutting wire - Google Patents
Workpiece cutting method and winding width alteration device of the workpiece cutting wire Download PDFInfo
- Publication number
- TW201039998A TW201039998A TW99108655A TW99108655A TW201039998A TW 201039998 A TW201039998 A TW 201039998A TW 99108655 A TW99108655 A TW 99108655A TW 99108655 A TW99108655 A TW 99108655A TW 201039998 A TW201039998 A TW 201039998A
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- cutting
- wire
- unwinding
- roller
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 189
- 238000004804 winding Methods 0.000 title claims description 45
- 238000000034 method Methods 0.000 title claims description 23
- 230000004075 alteration Effects 0.000 title 1
- 238000003825 pressing Methods 0.000 claims description 3
- 210000000952 spleen Anatomy 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 40
- 239000012790 adhesive layer Substances 0.000 abstract description 12
- 230000002452 interceptive effect Effects 0.000 abstract description 3
- 230000009545 invasion Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 230000002411 adverse Effects 0.000 description 5
- 230000009191 jumping Effects 0.000 description 5
- 238000005065 mining Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- QNRATNLHPGXHMA-XZHTYLCXSA-N (r)-(6-ethoxyquinolin-4-yl)-[(2s,4s,5r)-5-ethyl-1-azabicyclo[2.2.2]octan-2-yl]methanol;hydrochloride Chemical compound Cl.C([C@H]([C@H](C1)CC)C2)CN1[C@@H]2[C@H](O)C1=CC=NC2=CC=C(OCC)C=C21 QNRATNLHPGXHMA-XZHTYLCXSA-N 0.000 description 1
- 241000255925 Diptera Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009085264 | 2009-03-31 | ||
| JP2009114946A JP4743801B2 (ja) | 2009-03-31 | 2009-05-11 | ワーク切断方法およびワーク切断用ワイヤ巻き幅変更装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201039998A true TW201039998A (en) | 2010-11-16 |
Family
ID=43315176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99108655A TW201039998A (en) | 2009-03-31 | 2010-03-24 | Workpiece cutting method and winding width alteration device of the workpiece cutting wire |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4743801B2 (enrdf_load_stackoverflow) |
| TW (1) | TW201039998A (enrdf_load_stackoverflow) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103407008A (zh) * | 2013-07-19 | 2013-11-27 | 镇江环太硅科技有限公司 | 晶棒切割的改进方法 |
| CN103372922B (zh) * | 2013-07-30 | 2015-05-20 | 衡水英利新能源有限公司 | 一种分线网切割晶棒的方法 |
| JP6275551B2 (ja) * | 2014-05-27 | 2018-02-07 | 株式会社ディスコ | マルチワイヤ放電加工装置 |
| JP6923828B2 (ja) * | 2015-09-15 | 2021-08-25 | キヤノンマーケティングジャパン株式会社 | ワイヤ放電加工装置 |
| CN105479609A (zh) * | 2015-12-04 | 2016-04-13 | 湖南红太阳光电科技有限公司 | 一种用于切割拼接硅棒的多线切割方法 |
| CN107364023B (zh) * | 2017-07-20 | 2019-04-09 | 阜宁协鑫光伏科技有限公司 | 切割用分线网及分线网切割硅片的方法 |
| JP7011955B2 (ja) * | 2018-03-15 | 2022-02-10 | コマツＮｔｃ株式会社 | ワイヤソーにおける段取り方法及びワイヤソー |
| CN111844489B (zh) * | 2019-04-30 | 2024-02-06 | 天通日进精密技术有限公司 | 硅棒多工位开方设备及其多工位切割方法 |
| CN110466082A (zh) * | 2019-07-26 | 2019-11-19 | 扬州续笙新能源科技有限公司 | 一种适用于金刚线线网调整的切割装置及切割方法 |
| CN112847862A (zh) * | 2021-02-09 | 2021-05-28 | 常州时创能源股份有限公司 | 一种适用于单晶小硅块的切割方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02152765A (ja) * | 1988-11-29 | 1990-06-12 | Sumitomo Metal Ind Ltd | ワイヤソーによる切断加工方法 |
| JP3339231B2 (ja) * | 1995-01-19 | 2002-10-28 | 富士電機株式会社 | 半導体装置の製造方法 |
| JPH09123161A (ja) * | 1995-10-27 | 1997-05-13 | Tokyo Seimitsu Co Ltd | ワイヤソーのワーク保持装置 |
| JPH09290417A (ja) * | 1996-04-27 | 1997-11-11 | Nippei Toyama Corp | ワイヤソー及びワーク加工方法 |
| JP3716556B2 (ja) * | 1997-06-10 | 2005-11-16 | 株式会社東京精密 | マルチ切断ワイヤソーのウェーハ回収方法 |
| JP2006205661A (ja) * | 2005-01-31 | 2006-08-10 | Sumitomo Electric Ind Ltd | 基板製造方法 |
| JP4818848B2 (ja) * | 2006-08-28 | 2011-11-16 | コマツＮｔｃ株式会社 | ワイヤソー |
-
2009
- 2009-05-11 JP JP2009114946A patent/JP4743801B2/ja not_active Expired - Fee Related
-
2010
- 2010-03-24 TW TW99108655A patent/TW201039998A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010253664A (ja) | 2010-11-11 |
| JP4743801B2 (ja) | 2011-08-10 |
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