JP4741897B2 - Photocurable resin coating apparatus and coating method - Google Patents

Photocurable resin coating apparatus and coating method Download PDF

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JP4741897B2
JP4741897B2 JP2005229560A JP2005229560A JP4741897B2 JP 4741897 B2 JP4741897 B2 JP 4741897B2 JP 2005229560 A JP2005229560 A JP 2005229560A JP 2005229560 A JP2005229560 A JP 2005229560A JP 4741897 B2 JP4741897 B2 JP 4741897B2
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photocurable resin
substrate
coating
side portion
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JP2006218470A (en
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圭吾 今村
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Shibaura Mechatronics Corp
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Priority to JP2005229560A priority Critical patent/JP4741897B2/en
Priority to PCT/JP2005/016793 priority patent/WO2006075421A1/en
Priority to KR1020077012586A priority patent/KR100893739B1/en
Priority to CN2005800464537A priority patent/CN101098760B/en
Priority to TW094132120A priority patent/TWI368799B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
    • B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Description

この発明は基板とこの基板の側辺部に接続された電子部品との接続部分に補強用の光硬化性樹脂を塗布する光硬化性樹脂の塗布装置及び塗布方法に関する。   The present invention relates to a photocurable resin coating apparatus and a coating method for applying a reinforcing photocurable resin to a connection portion between a substrate and an electronic component connected to a side portion of the substrate.

液晶表示装置の組立工程では、たとえば図９（ａ）に示すように、まずアウタリードボンダにより基板としての矩形状の液晶パネル２００の４つの側辺部のうちの長さの異なる隣り合った２つの側辺部に、液晶駆動用ＩＣが搭載されたタブ（TAB:Tape Automated Bonding）などの電子部品２０２を図９（ｃ）に示すように異方性導電部材２０４によって実装してタブ付きの液晶パネル２００を製造する。   In the assembling process of the liquid crystal display device, for example, as shown in FIG. 9A, first, adjacent two of the four side portions of the rectangular liquid crystal panel 200 serving as a substrate are adjacent to each other by an outer lead bonder. An electronic component 202 such as a tab (TAB: Tape Automated Bonding) having a liquid crystal driving IC mounted on one side is mounted by an anisotropic conductive member 204 as shown in FIG. The liquid crystal panel 200 is manufactured.

ついでタブ付きの液晶パネル２００の電子部品２０２の部分に対して図９（ｂ）に示すように実装される部品としての回路基板２０３を同じく異方性導電部材２０４によって電気的に接続して液晶パネル２００を組み立てるということが行われている。   Next, a circuit board 203 as a component to be mounted as shown in FIG. 9B is electrically connected to the portion of the electronic component 202 of the tabbed liquid crystal panel 200 by the anisotropic conductive member 204 and the liquid crystal. Assembling the panel 200 is performed.

異方性導電部材２０４を用いて液晶パネル２００に電子部品２０２を接続すれば、ある程度の接続強度を得ることが可能である。しかしながら、液晶パネル２００に電子部品２０２を接続した後、このタブつきの液晶パネル２００を取り扱うことで、電子部品２０２が曲げられることがある。   If the electronic component 202 is connected to the liquid crystal panel 200 using the anisotropic conductive member 204, a certain degree of connection strength can be obtained. However, after the electronic component 202 is connected to the liquid crystal panel 200, the electronic component 202 may be bent by handling the tabbed liquid crystal panel 200.

電子部品２０２が曲げられると、電子部品２０２と液晶パネル２００との接続部分に曲げ応力が作用するから、その曲げ応力によって電子部品２０２が液晶パネル２００から剥離したり、電子部品２０２と液晶パネル２００との電極の電気的接続状態が損なわれるということがある。   When the electronic component 202 is bent, a bending stress acts on a connection portion between the electronic component 202 and the liquid crystal panel 200. Therefore, the electronic component 202 is peeled off from the liquid crystal panel 200 by the bending stress, or the electronic component 202 and the liquid crystal panel 200. The electrical connection state of the electrode may be impaired.

そこで、図９（ｄ）に示すように液晶パネル２００に電子部品２０２を接続したならば、この電子部品２０２液晶パネル２００との接続部分に光硬化性樹脂２０５を塗布し、ついで光硬化性樹脂２０５を紫外線などの照射光で照射して硬化させる。それによって、液晶パネル２００と電子部品２０２との接続強度を補強し、電子部品２０２が剥離するのを防止するということが行われている。   Therefore, when the electronic component 202 is connected to the liquid crystal panel 200 as shown in FIG. 9D, the photocurable resin 205 is applied to the connection portion with the liquid crystal panel 200, and then the photocurable resin is applied. 205 is cured by irradiation with irradiation light such as ultraviolet rays. This reinforces the connection strength between the liquid crystal panel 200 and the electronic component 202 and prevents the electronic component 202 from peeling off.

液晶パネル２００の側辺部には通常、複数の電子部品２０２が接続されている。そこで、従来は、塗布装置によって液晶パネル２００と電子部品２０２との複数の接続部分の全てに光硬化性樹脂２０５を塗布する。ついで、その液晶パネル２００を照射装置に搬送し、そこで液晶パネル２００の上記光硬化性樹脂２０５の塗布部分の全体に照射光を照射し、接続部分に塗布された光硬化性樹脂２０５を硬化させるようにしている。   A plurality of electronic components 202 are usually connected to the side portion of the liquid crystal panel 200. Therefore, conventionally, the photocurable resin 205 is applied to all of the plurality of connection portions between the liquid crystal panel 200 and the electronic component 202 by a coating apparatus. Next, the liquid crystal panel 200 is transported to an irradiation apparatus, where the entire application portion of the liquid crystal panel 205 of the liquid crystal panel 200 is irradiated with irradiation light to cure the photocurable resin 205 applied to the connection portion. I am doing so.

しかしながら、従来は光硬化性樹脂の塗布装置と、光硬化性樹脂を照射光で照射して硬化させる照射装置とが分かれていた。そのため、塗布装置と照射装置とを一列に配置しなければならないから、生産ラインが長くなるということがあった。   However, conventionally, a photocurable resin coating apparatus and an irradiation apparatus for irradiating and curing a photocurable resin with irradiation light have been separated. For this reason, since the coating device and the irradiation device must be arranged in a row, the production line may be lengthened.

しかも、照射装置は液晶パネルの光硬化性樹脂２０５の塗布部分の全体に照射光を照射する構成であったので、照射装置が液晶パネルを収容できる大きさとなるから、大型化するということがあり、とくに最近では液晶パネルが大型化しているため、照射装置が非常に大きくなってしまうということがある。さらに、塗布装置で光硬化性樹脂を塗布する作業と、照射装置で光硬化性樹脂に照射光を照射して硬化させる作業とが全く別々に行われているため、作業能率が悪いということもあった。   In addition, since the irradiation device is configured to irradiate the entire application portion of the photocurable resin 205 of the liquid crystal panel with irradiation light, the irradiation device is large enough to accommodate the liquid crystal panel, and thus may be increased in size. In particular, recently, since the liquid crystal panel has become larger, the irradiation device may become very large. Furthermore, the work of applying the photocurable resin with the coating device and the work of irradiating and curing the photocurable resin with the irradiation device are performed completely separately, which means that the work efficiency is poor. there were.

この発明は、基板と電子部品との接続部分に光硬化性樹脂を塗布したならば、その塗布に続いて光硬化性樹脂を硬化させる照射光を照射できるようにすることで、生産ラインの短縮化や作業能率の向上を図ることができるようにした光硬化性樹脂の塗布装置及び塗布方法を提供することにある。   This invention shortens the production line by enabling the application of photo-curing resin to the connection part between the substrate and the electronic component, so that irradiation light for curing the photo-curing resin can be irradiated following the application. An object of the present invention is to provide a photo-curing resin coating apparatus and coating method that can improve the efficiency and work efficiency.

この発明は、長方形状の基板とこの基板の側辺部に接続された電子部品との接続部分に光硬化性樹脂を塗布する光硬化性樹脂の塗布装置であって、
上記基板が載置される基板ステージと、
この基板ステージと対向して配置され上記基板と電子部品との接続部分に光硬化性樹脂を塗布する塗布ノズルを有する塗布ユニットと、
上記塗布ノズルを駆動して上記基板の側辺部に沿う方向に移動させる駆動手段と、
上記塗布ユニットに上記塗布ノズルと一体的に移動するよう設けられ上記塗布ノズルによって上記基板と電子部品との接続部分に塗布された光硬化性樹脂に照射光を照射して硬化させる光照射部と、
上記光照射部からの照射光が上記塗布ノズルを照射するのを阻止する遮光手段を具備し、
上記塗布ユニットは、長方形状の上記基板の１つの短側辺部に対向して配置され１つの塗布ノズルが設けられた第１の塗布ユニットと、上記基板の１つの長側辺部に対向して配置され複数の塗布ノズルが設けられた第２の塗布ユニットを有し、
上記第１の塗布ユニットの塗布ノズルは、上記基板の上記短側辺部の一端部から上記光硬化性樹脂の塗布を開始するよう駆動され、
上記第２の塗布ユニットの複数の塗布ノズルのうちの１つは、上記長側辺部の上記１つの短側辺部と反対側に位置する一端部から他端部に向かって上記光硬化性樹脂の塗布を開始するよう駆動され、残りの塗布ノズルは、上記長側辺部の中途部から他端部に向かって上記光硬化性樹脂の塗布を開始するよう駆動される
ことを特徴とする光硬化性樹脂の塗布装置にある。 This invention is a photocurable resin coating apparatus for applying a photocurable resin to a connection portion between a rectangular substrate and an electronic component connected to a side portion of the substrate,
A substrate stage on which the substrate is placed;
An application unit having an application nozzle that is disposed opposite to the substrate stage and applies a photocurable resin to a connection portion between the substrate and the electronic component;
Driving means for moving in a direction along the side portion of the upper Symbol substrate by driving the application nozzle,
A light irradiation unit that is provided in the application unit so as to move integrally with the application nozzle, and that irradiates the photocurable resin applied to a connection portion between the substrate and the electronic component by the application nozzle and cures the irradiation light. ,
Comprising light shielding means for preventing the irradiation light from the light irradiation unit from irradiating the coating nozzle,
The coating unit is disposed opposite to one short side portion of the rectangular substrate, and is opposed to one long side portion of the substrate, and a first coating unit provided with one coating nozzle. And a second coating unit provided with a plurality of coating nozzles,
The application nozzle of the first application unit is driven to start application of the photocurable resin from one end of the short side portion of the substrate,
One of the plurality of application nozzles of the second application unit includes the photo-curing property from one end portion of the long side portion opposite to the one short side portion toward the other end portion. It is driven to start the application of the resin, and the remaining application nozzles are driven to start the application of the photocurable resin from the middle part of the long side part toward the other end part. It exists in the application | coating apparatus of photocurable resin.

上記基板の少なくとも上記塗布ノズルによって光硬化性樹脂が塗布される側辺部は上記基板ステージから突出していて、この基板の上記基板ステージから突出した部分の下面は支持体によって支持されることが好ましい。   It is preferable that at least a side portion of the substrate on which the photocurable resin is applied by the application nozzle protrudes from the substrate stage, and a lower surface of a portion of the substrate protruding from the substrate stage is supported by a support. .

上記支持体の上面に上記基板を吸着保持する吸着手段を備えていることが好ましい。   It is preferable that an adsorption means for adsorbing and holding the substrate is provided on the upper surface of the support.

上記塗布ノズルによって塗布された光硬化性樹脂を撮像する撮像手段と、この撮像手段からの撮像信号によって上記光硬化性樹脂の塗布状態を判定する判定手段とを備えていることが好ましい。   It is preferable to include an imaging unit that images the photocurable resin applied by the application nozzle, and a determination unit that determines the application state of the photocurable resin based on an imaging signal from the imaging unit.

上記基板は上記一側部が上記他側部よりも長い直方形状であって、上記一側部に対向する上記第１の塗布ユニットには上記基板の一側部の長手方向一端部と中途部から上記光硬化性樹脂を同時に塗布する塗布ノズルを有する一対のヘッドステージが設けられていることが好ましい。   The substrate has a rectangular shape in which the one side portion is longer than the other side portion, and the first coating unit facing the one side portion has one longitudinal end portion and a midway portion of the one side portion of the substrate. It is preferable that a pair of head stages having an application nozzle for applying the photocurable resin at the same time are provided.

この発明は、長方形状の基板とこの基板の長さの異なる１つの短側辺部と１つの長側辺部にそれぞれ接続された電子部品との接続部分に塗布ノズルから吐出される光硬化性樹脂を塗布する光硬化性樹脂の塗布方法であって、
上記塗布ノズルを上記基板の側辺部に沿う方向に移動させて上記基板と上記電子部品との接続部分に光硬化性樹脂を塗布する工程と、
上記塗布ノズルによる光硬化性樹脂の塗布に続いて上記接続部分に塗布された光硬化性樹脂に照射光を照射して硬化させる工程を具備し、
上記基板の上記１つの短側辺部に対してはこの短側辺部に対向して配置された第１の塗布ユニットに設けられた１つの塗布ノズルによって上記１つの長側辺部と隣接する一端から光硬化性樹脂の塗布を開始し、上記１つの長側辺部に対してはこの長側辺部に対向して配置された第２の塗布ユニットに設けられた複数の塗布ノズルの１つによって上記長側辺部の上記１つの短側辺部と反対側に位置する一端から他端に向かって光硬化性樹脂の塗布を開始し、残りの塗布ノズルによって上記長側辺部の長手方向の中途部から他端に向かって光硬化性樹脂の塗布を開始することを特徴とする光硬化性樹脂の塗布方法にある。 The present invention is a photocurable composition that is ejected from a coating nozzle to a connecting portion between a rectangular substrate, one short side portion having a different length of the substrate, and an electronic component connected to each long side portion . A method of applying a photocurable resin to apply a resin,
Moving the coating nozzle in a direction along the side of the substrate to apply a photocurable resin to a connection portion between the substrate and the electronic component;
A step of irradiating the photocurable resin applied to the connecting portion with the irradiation light and curing the photocurable resin applied by the application nozzle;
The one short side part of the substrate is adjacent to the one long side part by one application nozzle provided in a first application unit arranged to face the short side part. Application of the photocurable resin is started from one end, and one of the plurality of application nozzles provided in the second application unit arranged to face the one long side portion is opposed to the long side portion. The application of the photocurable resin from one end located on the opposite side to the one short side portion of the long side portion is started by the other, and the length of the long side portion is determined by the remaining application nozzles. The photocurable resin coating method is characterized in that the application of the photocurable resin is started from the middle part in the direction toward the other end .

この発明によれば、基板と電子部品の接続部分に、光硬化性樹脂の塗布に続いてその光硬化性樹脂を硬化させる照射光を照射する。そのため、光硬化性樹脂を硬化させるための専用の装置が不要となるから、生産ラインの短縮化や生産能率の向上を図ることが可能となる。   According to this invention, the irradiation light which hardens the photocurable resin is irradiated to the connection part of a board | substrate and an electronic component following application | coating of photocurable resin. This eliminates the need for a dedicated device for curing the photo-curable resin, so that the production line can be shortened and the production efficiency can be improved.

以下、実施の形態を図面を参照して説明する。
図１乃至図６は液晶パネル２００隣り合う長側辺部と短側辺部とに光硬化性樹脂を、第１の塗布ユニット２と第２の塗布ユニット３によって別々に塗布する参考となる実施の形態を示す。図１は塗布装置の概略的構成を示す平面図である。この塗布装置はベース１を備えている。このベース１には図１に矢印で示すＸ方向に沿って第１の塗布ユニット２と第２の塗布ユニット３が配置されている。 Hereinafter will be described the form of implementation with reference to the drawings.
1 to 6 are reference implementations in which a photocurable resin is separately applied by the first application unit 2 and the second application unit 3 to the adjacent long side and short side of the liquid crystal panel 200 . The form of is shown. FIG. 1 is a plan view showing a schematic configuration of a coating apparatus. This coating apparatus includes a base 1. A first coating unit 2 and a second coating unit 3 are arranged on the base 1 along the X direction indicated by an arrow in FIG.

図２は第１の塗布ユニット２の正面図であって、図３は第２の塗布ユニット３の正面図である。各塗布ユニット２，３は上記ベース１上の所定の高さ位置に上記Ｘ方向に沿って配置された上部Ｘガイド体４を有する。この上部Ｘガイド体４の長手方向の一端と他端とには支持板５が設けられ、これらの支持板５には駆動ねじ６の端部がそれぞれ回転可能に支持されている。一方の支持板５にはＸ駆動源７が設けられ、このＸ駆動源７によって上記駆動ねじ６が回転駆動されるようになっている。   FIG. 2 is a front view of the first coating unit 2, and FIG. 3 is a front view of the second coating unit 3. Each coating unit 2, 3 has an upper X guide body 4 disposed along the X direction at a predetermined height position on the base 1. Support plates 5 are provided at one end and the other end in the longitudinal direction of the upper X guide body 4, and end portions of the drive screws 6 are rotatably supported by these support plates 5. One support plate 5 is provided with an X drive source 7, and the drive screw 6 is rotationally driven by the X drive source 7.

第１の塗布ユニット２の上部Ｘガイド体４には１つのＸ可動体８ａがＸ方向に沿って移動可能に設けられ、このＸ可動体８ａに上記駆動ねじ６が螺合している。したがって、Ｘ駆動源７が作動すれば、上記Ｘ可動体８ａは上記上部Ｘガイド体４に沿ってＸ方向に駆動される。   One X movable body 8a is provided on the upper X guide body 4 of the first coating unit 2 so as to be movable along the X direction, and the drive screw 6 is screwed to the X movable body 8a. Therefore, when the X drive source 7 is operated, the X movable body 8a is driven in the X direction along the upper X guide body 4.

第２の塗布ユニット３の上部Ｘガイド体４には２つのＸ可動体８ｂ，８ｃがＸ方向に沿って移動可能に設けられている。これらＸ可動体８ｂ，８ｃには上記駆動ねじ６が螺合している。したがって、Ｘ駆動源７が作動すれば、上記Ｘ可動体８ｂ，８ｃは上記上部Ｘガイド体４に沿ってＸ方向に駆動される。   Two X movable bodies 8b and 8c are provided on the upper X guide body 4 of the second coating unit 3 so as to be movable along the X direction. The drive screw 6 is screwed into these X movable bodies 8b and 8c. Therefore, when the X drive source 7 is operated, the X movable bodies 8b and 8c are driven in the X direction along the upper X guide body 4.

各Ｘ可動体８ａ〜８ｃの前面にはそれぞれ板状のヘッドステージ１１が上下方向、つまり図５に矢印で示すＺ方向に移動可能に設けられている。各ヘッドステージ１１は各Ｘ可動体８ａ〜８ｃの上面端面に設けられたＺ駆動源１２によって駆動されるようになっている。   A plate-like head stage 11 is provided on the front surface of each X movable body 8a to 8c so as to be movable in the vertical direction, that is, in the Z direction indicated by an arrow in FIG. Each head stage 11 is driven by a Z drive source 12 provided on the upper end face of each X movable body 8a-8c.

上記ヘッドステージ１１の前面の幅方向一端部には塗布ノズル１３が軸線を垂直にして設けられている。各塗布ノズル１３は図示しない光硬化性樹脂の供給部に配管接続されていて、先端から上記光硬化性樹脂２０５を吐出し、後述するように液晶パネル２００と電子部品２０２との接続部分に塗布することができるようになっている。   A coating nozzle 13 is provided at one end in the width direction of the front surface of the head stage 11 with the axis line vertical. Each application nozzle 13 is connected to a photo-curable resin supply unit (not shown) by piping, and discharges the photo-curable resin 205 from the tip, and is applied to a connection portion between the liquid crystal panel 200 and the electronic component 202 as will be described later. Can be done.

なお、第２の塗布ユニット３の一対のＸ可動体８ｂと８ｃの間隔、つまり各Ｘ可動体８ｂと８ｃに設けられた一対の塗布ノズル１３のＸ方向に沿う間隔は、図６（ａ）に示す液晶パネル２００の長側辺部に接続された６つの電子部品２０２の一端から他端までの距離Ｌの約半分に設定されている。   The distance between the pair of X movable bodies 8b and 8c of the second coating unit 3, that is, the distance along the X direction of the pair of coating nozzles 13 provided on each X movable body 8b and 8c is shown in FIG. Is set to about half of the distance L from one end to the other end of the six electronic components 202 connected to the long side portion of the liquid crystal panel 200 shown in FIG.

上記ヘッドステージ１１の前面の幅方向他端部には、上記塗布ノズル１３によって塗布された光硬化性樹脂２０５を硬化させるための紫外線などの照射光を出射する光照射部１４が設けられている。   At the other end in the width direction of the front surface of the head stage 11, a light irradiation unit 14 for emitting irradiation light such as ultraviolet rays for curing the photocurable resin 205 applied by the application nozzle 13 is provided. .

上記光照射部１４は遮光手段としての筒状の遮光体１５によって覆われている。それによって、上記光照射部１４から出射された照射光が周囲に散乱して上記塗布ノズル１３を照射するのを防止するようになっている。つまり、光照射部１４から出射された照射光は遮光体１５の開口した下端面に対向する部位を照射し、他の部位を照射することがないようになっている。   The light irradiation part 14 is covered with a cylindrical light shielding body 15 as a light shielding means. Thereby, the irradiation light emitted from the light irradiation unit 14 is prevented from being scattered around and irradiating the coating nozzle 13. In other words, the irradiation light emitted from the light irradiation unit 14 irradiates a portion facing the lower end surface of the light shield 15 that is opened, and does not irradiate other portions.

上記ヘッドステージ１１の前面の幅方向他端にはアーム１６が側方に向かって突設されている。このアーム１６には撮像手段としての撮像カメラ１７が撮像面を下に向けて設けられている。   At the other end in the width direction of the front surface of the head stage 11, an arm 16 projects from the side. The arm 16 is provided with an imaging camera 17 as an imaging means with an imaging surface facing downward.

上記撮像カメラ１７は上記塗布ノズル１３によって液晶パネル２００と電子部品２０２との接続部分に塗布されて上記光照射部１４からの照射光によって硬化された光硬化性樹脂２０５を撮像する。撮像カメラ１７からの撮像信号は図２と図３に示す制御装置１８に入力される。   The imaging camera 17 images the photocurable resin 205 that is applied to the connection portion between the liquid crystal panel 200 and the electronic component 202 by the application nozzle 13 and is cured by the irradiation light from the light irradiation unit 14. An imaging signal from the imaging camera 17 is input to the control device 18 shown in FIGS.

上記制御装置１８には図４に示すように画像処理部１９ａと、基準信号Ｓを設定する設定部１９ｂと、画像処理部１９ａで処理されたデジタル信号を設定部１９ｂに設定された基準信号Ｓと比較する比較部２０ａと、この比較部２０ａでの比較に基づいて撮像カメラ１７によって撮像された光硬化性樹脂２０５の塗布形状が正常であるか否かを判定する判定手段である判定部２０ｂが設けられている。   As shown in FIG. 4, the control device 18 includes an image processing unit 19a, a setting unit 19b for setting a reference signal S, and a digital signal processed by the image processing unit 19a as a reference signal S set in the setting unit 19b. And a determination unit 20b that is a determination unit that determines whether or not the application shape of the photocurable resin 205 imaged by the imaging camera 17 is normal based on the comparison in the comparison unit 20a. Is provided.

それによって、液晶パネル２００と電子部品２０２との接続部分に塗布された光硬化性樹脂２０５の形状が基準形状であるか否かが検出される。つまり、光硬化性樹脂２０５の塗布幅が所定の範囲内にあるかということや光硬化性樹脂２０５が途切れていないかなどのことが検出される。   Thereby, it is detected whether or not the shape of the photocurable resin 205 applied to the connection portion between the liquid crystal panel 200 and the electronic component 202 is the reference shape. That is, it is detected whether the coating width of the photocurable resin 205 is within a predetermined range, whether the photocurable resin 205 is not interrupted, or the like.

そして、光硬化性樹脂２０５の撮像形状が許容範囲内であれば、上記判定部２０ｂによって上記光硬化性樹脂２０５の塗布状態が正常であると判定され、範囲外であれば異常であると判定される。異常時には制御装置１８がそのことを警報ブザーやランプなどの警報手段２０ｃを作動させ、それによって作業者に異常を知らせるようになっている。   If the imaging shape of the photocurable resin 205 is within an allowable range, the determination unit 20b determines that the application state of the photocurable resin 205 is normal, and determines that the photocurable resin 205 is abnormal if it is out of the range. Is done. When an abnormality occurs, the control device 18 activates an alarm means 20c such as an alarm buzzer or a lamp, thereby notifying the operator of the abnormality.

上記ベース１の、第１、第２の塗布ユニット２，３のヘッドステージ１１と対向する部位には、それぞれ基板ステージ２１が設けられている。この基板ステージ２１はＸ方向及びＹ方向に駆動可能となっている。すなわち、上記ベース１には図２、図３及び図５に示すようにベーステーブル２２が設けられている。このベーステーブル２２の上面には図５に矢印で示すＹ方向に沿って長いＸテーブル２３がＹ方向と直交するＸ方向に沿って移動可能に設けられている。このＸテーブル２３は上記ベーステーブル２２のＸ方向に沿う一端に設けられたＸ駆動源２４によってＸ方向に沿って駆動されるようになっている。   Substrate stages 21 are respectively provided at portions of the base 1 facing the head stages 11 of the first and second coating units 2 and 3. The substrate stage 21 can be driven in the X direction and the Y direction. That is, the base 1 is provided with a base table 22 as shown in FIGS. On the upper surface of the base table 22, an X table 23 that is long along the Y direction indicated by an arrow in FIG. 5 is provided so as to be movable along the X direction orthogonal to the Y direction. The X table 23 is driven along the X direction by an X drive source 24 provided at one end of the base table 22 along the X direction.

上記Ｘテーブル２３にはＹテーブル２５がＹ方向に沿って移動可能に設けられ、上記Ｘテーブル２３のＹ方向に沿う一端に設けられたＹ駆動源２６によってＹ方向に沿って駆動されるようになっている。そして、このＹテーブル２５上に上記基板ステージ２１がＺ駆動源２７によってＺ方向に駆動可能に設けられている。この基板ステージ２１には上記液晶パネル２００が供給され、図示しない吸着手段によって吸着保持されるようになっている。それによって、液晶パネル２００は基板ステージ２１とともにＸ方向、Ｙ方向及びＺ方向に駆動されるようになっている。   A Y table 25 is provided on the X table 23 so as to be movable along the Y direction, and is driven along the Y direction by a Y drive source 26 provided at one end of the X table 23 along the Y direction. It has become. The substrate stage 21 is provided on the Y table 25 so as to be driven in the Z direction by a Z drive source 27. The liquid crystal panel 200 is supplied to the substrate stage 21 and is sucked and held by suction means (not shown). Accordingly, the liquid crystal panel 200 is driven in the X direction, the Y direction, and the Z direction together with the substrate stage 21.

光硬化性樹脂２０５が塗布される液晶パネル２００は、第１の塗布ユニット２の基板ステージ２１に供給される。つまり、液晶パネル２００は図６（ａ）、（ｂ）に示すように隣り合う２つの側辺の長さが異なる長方形状をなしている。そして、液晶パネル２００には、１つの短側辺部に３つの電子部品２０２が接続され、この短側辺部に隣り合う１つの長側辺部に６つの電子部品２０２が接続されている。つまり、液晶パネル２００には、４つの側辺部のうちの２つの側辺部に電子部品２０２が予め接続されている。   The liquid crystal panel 200 to which the photocurable resin 205 is applied is supplied to the substrate stage 21 of the first application unit 2. That is, the liquid crystal panel 200 has a rectangular shape in which the lengths of two adjacent sides are different as shown in FIGS. In the liquid crystal panel 200, three electronic components 202 are connected to one short side, and six electronic components 202 are connected to one long side adjacent to the short side. That is, in the liquid crystal panel 200, the electronic component 202 is connected in advance to two of the four side portions.

図５に示すように、液晶パネル２００の周辺部は基板ステージ２１の周縁から外方に突出しており、上記液晶パネル２００の短側辺部或いは長側辺部を塗布位置に位置決めすると、その側辺部は支持体２８の上方に対向位置する。この支持体２８の上面には吸引路２９の一端が開口している。この吸引路２９の他端には吸引ポンプ３１が吸引チューブ３２によって接続されている。   As shown in FIG. 5, the peripheral part of the liquid crystal panel 200 protrudes outward from the peripheral edge of the substrate stage 21, and when the short side part or the long side part of the liquid crystal panel 200 is positioned at the application position, The side part is positioned above the support 28. One end of a suction path 29 is opened on the upper surface of the support 28. A suction pump 31 is connected to the other end of the suction path 29 by a suction tube 32.

したがって、基板ステージ２１がＸ、Ｙ方向に位置決めされた後、下降方向に駆動すれば、液晶パネル２００の側辺部を支持体２８の上面に吸着保持することができる。液晶パネル２００の側辺部を支持体２８の上面に吸着保持すれば、その側辺部の反りを矯正することができるから、その側辺部の上面に塗布ノズル１３によって光硬化性樹脂２０５を均一に塗布することができる。   Therefore, if the substrate stage 21 is positioned in the X and Y directions and then driven in the downward direction, the side portion of the liquid crystal panel 200 can be held by suction on the upper surface of the support 28. If the side portion of the liquid crystal panel 200 is held by suction on the upper surface of the support 28, the warpage of the side portion can be corrected. Therefore, the photocurable resin 205 is applied to the upper surface of the side portion by the application nozzle 13. It can be applied uniformly.

つぎに、上記構成の塗布装置を用いて液晶パネル２００と、その液晶パネル２００の短側辺部と長側辺部に接続された電子部品２０２との接続部分に光硬化性樹脂を塗布する手順について説明する。   Next, a procedure for applying a photocurable resin to a connection portion between the liquid crystal panel 200 and the electronic component 202 connected to the short side portion and the long side portion of the liquid crystal panel 200 using the coating apparatus having the above configuration. Will be described.

まず、図示しない供給ロボットなどによって液晶パネル２００が第１の塗布ヘッド２の基板ステージ２１に供給される。つまり、液晶パネル２００は電子部品２０２が設けられた短側辺部をヘッドステージ１１側に向けるとともにＸ方向に沿うよう上記基板ステージ２１に供給される。   First, the liquid crystal panel 200 is supplied to the substrate stage 21 of the first coating head 2 by a supply robot or the like (not shown). That is, the liquid crystal panel 200 is supplied to the substrate stage 21 so that the short side portion where the electronic component 202 is provided faces the head stage 11 side and is along the X direction.

ついで、上記基板ステージ２１は、液晶パネル２００の短側辺部の一端に位置する電子部品２０２の接続部分に塗布ノズル１３の下端が対向位置するようＸ、Ｙ方向に位置決めされる。このようにして、液晶パネル２００をＸ、Ｙ方向に位置決めすると、その短側辺部が支持体２８の上方に位置するから、基板ステージ２１を下降させれば、液晶パネル２００の短側辺部が支持体２８の上面に吸着保持される。   Next, the substrate stage 21 is positioned in the X and Y directions so that the lower end of the coating nozzle 13 faces the connecting portion of the electronic component 202 located at one end of the short side portion of the liquid crystal panel 200. Thus, when the liquid crystal panel 200 is positioned in the X and Y directions, the short side portion thereof is positioned above the support 28, and therefore, if the substrate stage 21 is lowered, the short side portion of the liquid crystal panel 200 is arranged. Is adsorbed and held on the upper surface of the support 28.

液晶パネル２００の短側辺部を支持体２８の上面に保持したならば、ヘッドステージ１１を下降させ、上記塗布ノズル１３から光硬化性樹脂２０５を電子部品２０２の接続部分に吐出させるとともに、光照射部１４から照射光を出射させながら塗布ノズル１３が短側辺部の一端から他端に向かうよう、ヘッドステージ１１をＸ方向に駆動する。   If the short side portion of the liquid crystal panel 200 is held on the upper surface of the support 28, the head stage 11 is lowered, the photocurable resin 205 is discharged from the coating nozzle 13 to the connection part of the electronic component 202, and the light The head stage 11 is driven in the X direction so that the coating nozzle 13 is directed from one end to the other end of the short side while emitting the irradiation light from the irradiation unit 14.

それによって、塗布ノズル１３から吐出される光硬化性樹脂２０５が液晶パネル２００の電子部品２０２が接続された短側辺部に沿って塗布される。そして、光硬化性樹脂２０５が塗布された箇所は、その塗布に続いて光照射部１４から出射される照射光によって照射されて硬化する。   Thereby, the photocurable resin 205 discharged from the application nozzle 13 is applied along the short side portion to which the electronic component 202 of the liquid crystal panel 200 is connected. Then, the portion where the photocurable resin 205 is applied is irradiated with the irradiation light emitted from the light irradiation unit 14 subsequent to the application and cured.

上記液晶パネル２００の短側辺部に塗布されて硬化した光硬化性樹脂は、ヘッドステージ１１がＸ方向に駆動されることで、このヘッドステージ１１に設けられた撮像カメラ１７によって撮像される。撮像カメラ１７の撮像信号は制御装置１８に入力されて画像処理され、基準信号と比較される。   The photocurable resin applied and cured on the short side of the liquid crystal panel 200 is imaged by the imaging camera 17 provided on the head stage 11 when the head stage 11 is driven in the X direction. An imaging signal of the imaging camera 17 is input to the control device 18 and subjected to image processing, and compared with a reference signal.

たとえば、硬化した光硬化性樹脂２０５が途切れていたり、塗布幅の変化が一定以上であると、上記制御装置１８から警報が出力される。それによって、作業者は異常に気付くから、その液晶パネル２００を下流に流さないようにするなどして対策を講じることができる。   For example, an alarm is output from the control device 18 when the cured photo-curable resin 205 is interrupted or the change in the coating width is greater than a certain value. As a result, the operator notices an abnormality and can take measures such as preventing the liquid crystal panel 200 from flowing downstream.

上記光照射部１４は遮蔽体１５によって覆われ、光照射部１４から出射される照射光が周囲に散乱するのを防止している。そのため、塗布ノズル１３が光照射部１４から出射される照射光によって照射され、光硬化性樹脂２０５が塗布される前に硬化するなどのことを防止できる。つまり、塗布ノズル１３が光照射部１４との距離を小さくすることが可能となるから、ヘッドステージ１１を小型化することが可能となる。   The light irradiation unit 14 is covered with a shield 15 to prevent the irradiation light emitted from the light irradiation unit 14 from being scattered around. Therefore, it is possible to prevent the application nozzle 13 from being irradiated with the irradiation light emitted from the light irradiation unit 14 and being cured before the photocurable resin 205 is applied. That is, since the coating nozzle 13 can reduce the distance from the light irradiation unit 14, the head stage 11 can be downsized.

このようにして、図６（ａ）に示すように第１の塗布ユニット２のヘッドステージ１１が液晶パネル２００の短側辺部の全長にわたって移動して光硬化性樹脂２０５がされたならば、ヘッドステージ１１が上昇後、液晶パネル２００は図示しない搬送ロボットによって第１の塗布ユニット２の基板ステージ２１から取り出され、水平方向に９０度回転されて第２の塗布ユニット３の基板ステージ２１に供給される。   In this way, as shown in FIG. 6A, if the head stage 11 of the first coating unit 2 moves over the entire length of the short side portion of the liquid crystal panel 200 and the photocurable resin 205 is formed, After the head stage 11 is raised, the liquid crystal panel 200 is taken out of the substrate stage 21 of the first coating unit 2 by a transfer robot (not shown), rotated 90 degrees in the horizontal direction, and supplied to the substrate stage 21 of the second coating unit 3. Is done.

つまり、短側辺部に光硬化性樹脂２０５が塗布された液晶パネル２００は、電子部品２０２が接続された長側辺部をＸ方向に沿わせるとともにヘッドステージ１１側に向けて第２の塗布ユニット３の基板ステージ２１に供給載置される。   That is, the liquid crystal panel 200 in which the photo-curable resin 205 is applied to the short side part has the long side part to which the electronic component 202 is connected along the X direction and the second application toward the head stage 11 side. It is supplied and placed on the substrate stage 21 of the unit 3.

液晶パネル２００が供給された第２の塗布ユニット３の基板ステージ２１はＸ方向とＹ方向に駆動され、第２の塗布ユニット３の一対の塗布ノズル１３の一方が液晶パネル２００の長側辺部の一端に対向し、他方が長側辺部の長手方向中央部に対向するよう位置決めされる。   The substrate stage 21 of the second coating unit 3 to which the liquid crystal panel 200 is supplied is driven in the X direction and the Y direction, and one of the pair of coating nozzles 13 of the second coating unit 3 is the long side portion of the liquid crystal panel 200. It is positioned so that it may oppose one end of this, and the other may oppose the longitudinal center part of a long side part.

つまり、一方の塗布ノズル１３は液晶パネル２００の長側辺部の図６（ａ）にＸ１で示す一端部に位置決めされ、他方の塗布ノズル１３はＸ２で示す長側辺部のほぼ中央部に位置決めされる。ついで、基板ステージ２１は下降方向に駆動され、この基板ステージ２１に保持された液晶パネル２００の長側辺部が支持体２８の上面に吸着保持される。また、液晶パネル２００は一対の塗布ノズル１３の先端部が電子部品２０２の接続部分の上方に位置するよう基板ステージ２１によってＹ方向にも位置決めされる。   That is, one application nozzle 13 is positioned at one end portion indicated by X1 in FIG. 6A of the long side portion of the liquid crystal panel 200, and the other application nozzle 13 is positioned at a substantially central portion of the long side portion indicated by X2. Positioned. Next, the substrate stage 21 is driven in the downward direction, and the long side portion of the liquid crystal panel 200 held on the substrate stage 21 is sucked and held on the upper surface of the support 28. The liquid crystal panel 200 is also positioned in the Y direction by the substrate stage 21 so that the tip ends of the pair of application nozzles 13 are located above the connection portion of the electronic component 202.

このようにして、基板ステージ２１をＸ、Ｙ及びＺ方向に位置決めしたならば、ヘッドステージ１１を下降させ、第２の塗布ユニット３の一対の塗布ノズル１３から光硬化性樹脂２０５を吐出するとともに光照射部１４から照射光を出射し、一対のヘッドステージ１１をＸ方向、つまり一対の塗布ノズル１３が液晶パネル２００の長側辺部の他端に向かう方向に駆動する。   When the substrate stage 21 is thus positioned in the X, Y, and Z directions, the head stage 11 is lowered, and the photocurable resin 205 is discharged from the pair of application nozzles 13 of the second application unit 3. Irradiation light is emitted from the light irradiation unit 14, and the pair of head stages 11 are driven in the X direction, that is, the pair of application nozzles 13 toward the other end of the long side portion of the liquid crystal panel 200.

それによって、一方の塗布ノズル１３は液晶パネル２００の長側辺部のＸ１の位置から光硬化性樹脂２０５の塗布を開始し、他方の塗布ノズル１３はＸ２の位置から塗布を開始する。そして、一対のヘッドステージ１１をＸ方向に図６（ａ）にＬで示す距離の半分の距離を移動させることで、図６（ｂ）に示すように上記長側辺部の電子部品２０２が接続された部分の全長に光硬化性樹脂２０５を塗布することができる。   Accordingly, one application nozzle 13 starts application of the photocurable resin 205 from the position X1 on the long side of the liquid crystal panel 200, and the other application nozzle 13 starts application from the position X2. Then, by moving the pair of head stages 11 in the X direction by a distance that is half the distance indicated by L in FIG. 6A, the electronic component 202 on the long side portion is moved as shown in FIG. 6B. The photocurable resin 205 can be applied to the entire length of the connected portion.

つまり、液晶パネル２００の長側辺部に、２つの塗布ノズル１３によって光硬化性樹脂２０５を塗布するようにしたので、１つの塗布ノズル１３で塗布する場合に比べて半分の時間で塗布することができるから、生産性の向上を図ることができる。   That is, since the photocurable resin 205 is applied to the long side portion of the liquid crystal panel 200 by the two application nozzles 13, the application is performed in half the time compared to the case of applying by one application nozzle 13. Therefore, productivity can be improved.

第２の塗布ユニット３の各ヘッドステージ１１には第１の塗布ユニット２のヘッドステージ１１と同様、光照射部１４が設けられ、一対の塗布ノズル１３によって塗布された光硬化性樹脂２０５は塗布に続いて硬化させられる。上記光照射部１４は遮光体１５によって覆われているから、この光照射部１４と塗布ノズル１３との間隔を十分に小さくしてヘッドステージ１１の小型化を図ることができる。   As with the head stage 11 of the first coating unit 2, each head stage 11 of the second coating unit 3 is provided with a light irradiation unit 14, and the photocurable resin 205 coated by the pair of coating nozzles 13 is coated. Followed by curing. Since the light irradiation unit 14 is covered with the light shield 15, the head stage 11 can be reduced in size by sufficiently reducing the distance between the light irradiation unit 14 and the coating nozzle 13.

さらに、ヘッドステージ１１には撮像カメラ１７が設けられているから、この撮像カメラ１７からの撮像信号によって各塗布ノズル１３による光硬化性樹脂２０５の塗布状態が判定され、異常があればそのことを作業者に知らせることができる。   Further, since an imaging camera 17 is provided on the head stage 11, the application state of the photocurable resin 205 by each application nozzle 13 is determined based on the imaging signal from the imaging camera 17, and if there is an abnormality, this is indicated. The operator can be informed.

このように、参考となる実施の形態の塗布装置によれば、液晶パネル２００の電子部品２０２が接続された長側辺部と短側辺部とに、それぞれ光硬化性樹脂２０５を塗布することができるばかりか、その塗布に続いて照射光を照射して硬化させることができる。 As described above, according to the coating apparatus of the reference embodiment, the photocurable resin 205 is applied to the long side portion and the short side portion to which the electronic component 202 of the liquid crystal panel 200 is connected. It can be cured by irradiation with irradiation light following the coating.

つまり、光硬化性樹脂２０５の塗布と硬化との作業を塗布装置の各塗布ユニット２，３によって連続して行えるから、生産性の向上を図れるばかりか、装置全体のライン長を短くすることができるなどのことがある。   In other words, the application and curing operations of the photocurable resin 205 can be performed continuously by the coating units 2 and 3 of the coating apparatus, so that productivity can be improved and the line length of the entire apparatus can be shortened. There are things you can do.

図７と図８はこの発明の実施の形態を示す。この実施の形態は、第１の塗布ユニット２と第２の塗布ユニット３とが軸線を直交させて配置されている。すなわち、基板ステージ２１に保持された長方形状の基板２００の短側辺部に対向して第１の塗布ユニット２が配置され、長側辺部に対向して第２の塗布ユニット３が配置されている。なお、第１、第２の塗布ユニット２，３の構成は第１の実施の形態に示された塗布ユニットと同じであるので、同一部分には同一記号を付して説明を省略する。 7 and 8 show a form of implementation of the present invention. Implementation form of this is a first coating unit 2 and the second coating unit 3 is arranged to be perpendicular to the axis. That is, the first coating unit 2 is disposed to face the short side portion of the rectangular substrate 200 held by the substrate stage 21, and the second coating unit 3 is disposed to face the long side portion. ing. In addition, since the structure of the 1st, 2nd application | coating units 2 and 3 is the same as the application | coating unit shown by 1st Embodiment, the same code | symbol is attached | subjected to the same part and description is abbreviate | omitted.

図７に示すように、第１の塗布ユニット２に設けられた塗布ノズル１３は、上記長側辺部に隣り合う短側辺部の一端部Ｙ１から光硬化性樹脂２０５の塗布を開始する。上記第２の塗布ユニット３に設けられた一対の塗布ノズル１３は、上記基板２００の長側辺部の長手方向一端部Ｘ１と中央部Ｘ２とから光硬化性樹脂２０５の塗布を同時に開始する。   As shown in FIG. 7, the application nozzle 13 provided in the first application unit 2 starts application of the photocurable resin 205 from one end Y1 of the short side part adjacent to the long side part. The pair of application nozzles 13 provided in the second application unit 3 simultaneously start application of the photocurable resin 205 from the longitudinal end portion X1 and the central portion X2 of the long side portion of the substrate 200.

第１の塗布ユニット２と第２の塗布ユニット３による光硬化性樹脂２０５の塗布は同期して行われる。すなわち、第１の塗布ユニット２の一対の塗布ノズル１３が図８に矢印Ｙで示す方向に駆動が開始されると同時に、第２の塗布ユニット３の塗布ノズル１３が矢印Ｘで示す方向に駆動される。
それによって、基板２００の隣り合う長側辺部と短側辺部とに光硬化性樹脂２０５を同時に塗布できるから、塗布に要するタクトタイムを短縮することができる。 The application of the photocurable resin 205 by the first application unit 2 and the second application unit 3 is performed in synchronization. That is, the pair of coating nozzles 13 of the first coating unit 2 starts to be driven in the direction indicated by the arrow Y in FIG. 8, and simultaneously, the coating nozzle 13 of the second coating unit 3 is driven in the direction indicated by the arrow X. Is done.
Thereby, since the photocurable resin 205 can be simultaneously applied to the adjacent long side portion and short side portion of the substrate 200, the tact time required for the application can be shortened.

さらに、基板２００の長側辺部の長手方向の中央部Ｘ２から塗布を開始する第２の塗布ユニット３の一方の塗布ノズル１３が設けられたヘッドステージ１１が矢印Ｘで示す方向の末端まで移動したとき、第１の塗布ヘッド２の塗布ノズル１３が設けられたヘッドステージ１１は基板２００の短側辺部の一端部Ｙ１から矢印Ｙで示す方向へ移動している。   Further, the head stage 11 provided with one application nozzle 13 of the second application unit 3 that starts application from the longitudinal center X2 of the long side portion of the substrate 200 moves to the end in the direction indicated by the arrow X. At this time, the head stage 11 provided with the coating nozzle 13 of the first coating head 2 has moved in the direction indicated by the arrow Y from the one end Y1 of the short side portion of the substrate 200.

そのため、第２の塗布ヘッド３の一方の塗布ノズル１３が第１の塗布ヘッド２の塗布ノズル１３に干渉するのを防止することもできる。   Therefore, it is possible to prevent one application nozzle 13 of the second application head 3 from interfering with the application nozzle 13 of the first application head 2.

この発明は上記一実施の形態に限定されず、たとえば第２の塗布ユニットには２つの塗布ノズルを設けたが基板の大きさに応じて３つ或いはそれ以上の塗布ノズルを設けるようにしてもよい。   The present invention is not limited to the above-described embodiment. For example, the second application unit is provided with two application nozzles, but may be provided with three or more application nozzles according to the size of the substrate. Good.

液晶パネルのタブが接続された短側辺部或いは長側辺部を支持体によって吸着保持するようにしたが、吸着せず、単に支持するだけであっても液晶パネルの側辺部の反りをある程度は矯正することが可能である。   The short side or the long side to which the tab of the liquid crystal panel is connected is sucked and held by the support, but the side of the liquid crystal panel is warped even if it is simply not supported but sucked. It can be corrected to some extent.

第２の塗布ユニットに設けられた２つの塗布ノズルを駆動ねじによってＸ方向に駆動するようにしたが、リニアモータによってＸ方向に駆動可能な構造としてもよい。リニアモータによって駆動する構造にすれば、一対の塗布ノズルを別々に駆動することが可能となるから、一対の塗布ノズルの間隔を液晶パネルの大きさの変化に応じて容易に設定することができる。   The two application nozzles provided in the second application unit are driven in the X direction by a drive screw, but may be configured to be driven in the X direction by a linear motor. If the structure is driven by a linear motor, the pair of application nozzles can be driven separately, so that the interval between the pair of application nozzles can be easily set according to the change in the size of the liquid crystal panel. .

また、ヘッドステージに設けられた塗布ノズルを液晶パネルの側辺部に沿って駆動したが、基板ステージを駆動し、上記塗布ノズルに対して基板ステージに保持された液晶パネルの側辺部を移動させるようにしてもよく、要は液晶パネルと塗布ノズルとを相対的に移動させればよい。   Also, the coating nozzle provided on the head stage was driven along the side of the liquid crystal panel, but the substrate stage was driven to move the side of the liquid crystal panel held on the substrate stage relative to the coating nozzle. In short, the liquid crystal panel and the coating nozzle may be moved relatively.

また、光硬化性樹脂の塗布と硬化とを同時に行うようにしたが、光硬化性樹脂の塗布後、硬化を別に行うようにしてもよい。   Moreover, although application | coating and hardening of photocurable resin were performed simultaneously, you may make it harden | cure separately after application | coating of photocurable resin.

参考となる実施の形態の塗布装置の概略的構成を示す平面図。 The top view which shows schematic structure of the coating device of embodiment used as reference. 第１の塗布ユニットの正面図。The front view of a 1st application | coating unit. 第２の塗布ユニットの正面図。The front view of a 2nd application | coating unit. 制御装置のブロック図。The block diagram of a control apparatus. 第１、第２の塗布ユニットの側面図。The side view of the 1st, 2nd application | coating unit. （ａ）は液晶パネルの短辺に光硬化性樹脂を塗布する説明図、（ｂ）短辺に光硬化性樹脂を塗布してから長辺に光硬化性樹脂を塗布する説明図。(A) is explanatory drawing which apply | coats photocurable resin to the short side of a liquid crystal panel, (b) explanatory drawing which applies photocurable resin to a long side after apply | coating photocurable resin to a short side. この発明の実施の形態の塗布装置の概略的構成を示す平面図。Plan view showing a schematic configuration of the coating apparatus of the implementation of embodiment of the present invention. 液晶パネル長辺と短辺とに光硬化性樹脂を同時に塗布する説明図。Explanatory drawing which apply | coats photocurable resin simultaneously to a liquid crystal panel long side and a short side. （ａ）は２つの辺に電子部品が接続された液晶パネルの平面図、（ｂ）は電子部品に回路基板を接続した液晶パネルの平面図、（ｃ）は液晶パネルと回路基板との接続構造を示す側面図、（ｄ）は電子部品の接続部分に光硬化性樹脂を塗布した状態を示す側面図。(A) is a plan view of a liquid crystal panel in which an electronic component is connected to two sides, (b) is a plan view of a liquid crystal panel in which a circuit board is connected to the electronic component, and (c) is a connection between the liquid crystal panel and the circuit board. The side view which shows a structure, (d) is a side view which shows the state which apply | coated the photocurable resin to the connection part of an electronic component.

符号の説明Explanation of symbols

２…第１の塗布ユニット、３…第２の塗布ユニット、１１…ヘッドステージ、１３…塗布ノズル、１４…光照射部、１５…遮光体、１７…撮像カメラ、１８…制御装置、２１…基盤ステージ、２８…支持体、２９…吸引路、３１…吸引ポンプ。   DESCRIPTION OF SYMBOLS 2 ... 1st coating unit, 3 ... 2nd coating unit, 11 ... Head stage, 13 ... Coating nozzle, 14 ... Light irradiation part, 15 ... Shading body, 17 ... Imaging camera, 18 ... Control apparatus, 21 ... Base Stage, 28 ... support, 29 ... suction path, 31 ... suction pump.

Claims (6)

長方形状の基板とこの基板の側辺部に接続された電子部品との接続部分に光硬化性樹脂を塗布する光硬化性樹脂の塗布装置であって、
上記基板が載置される基板ステージと、
この基板ステージと対向して配置され上記基板と電子部品との接続部分に光硬化性樹脂を塗布する塗布ノズルを有する塗布ユニットと、
上記塗布ノズルを駆動して上記基板の側辺部に沿う方向に移動させる駆動手段と、
上記塗布ユニットに上記塗布ノズルと一体的に移動するよう設けられ上記塗布ノズルによって上記基板と電子部品との接続部分に塗布された光硬化性樹脂に照射光を照射して硬化させる光照射部と、
上記光照射部からの照射光が上記塗布ノズルを照射するのを阻止する遮光手段を具備し、
上記塗布ユニットは、長方形状の上記基板の１つの短側辺部に対向して配置され１つの塗布ノズルが設けられた第１の塗布ユニットと、上記基板の１つの長側辺部に対向して配置され複数の塗布ノズルが設けられた第２の塗布ユニットを有し、
上記第１の塗布ユニットの塗布ノズルは、上記基板の上記短側辺部の一端部から上記光硬化性樹脂の塗布を開始するよう駆動され、
上記第２の塗布ユニットの複数の塗布ノズルのうちの１つは、上記長側辺部の上記１つの短側辺部と反対側に位置する一端部から他端部に向かって上記光硬化性樹脂の塗布を開始するよう駆動され、残りの塗布ノズルは、上記長側辺部の中途部から他端部に向かって上記光硬化性樹脂の塗布を開始するよう駆動される
ことを特徴とする光硬化性樹脂の塗布装置。 A photocurable resin coating apparatus that applies a photocurable resin to a connection portion between a rectangular substrate and an electronic component connected to a side portion of the substrate,
A substrate stage on which the substrate is placed;
An application unit having an application nozzle that is disposed opposite to the substrate stage and applies a photocurable resin to a connection portion between the substrate and the electronic component;
Driving means for moving in a direction along the side portion of the upper Symbol substrate by driving the application nozzle,
A light irradiation unit that is provided in the application unit so as to move integrally with the application nozzle, and that irradiates the photocurable resin applied to a connection portion between the substrate and the electronic component by the application nozzle and cures the irradiation light. ,
Comprising light shielding means for preventing the irradiation light from the light irradiation unit from irradiating the coating nozzle,
The coating unit is disposed opposite to one short side portion of the rectangular substrate, and is opposed to one long side portion of the substrate, and a first coating unit provided with one coating nozzle. And a second coating unit provided with a plurality of coating nozzles,
The application nozzle of the first application unit is driven to start application of the photocurable resin from one end of the short side portion of the substrate,
One of the plurality of application nozzles of the second application unit includes the photo-curing property from one end portion of the long side portion opposite to the one short side portion toward the other end portion. It is driven to start the application of the resin, and the remaining application nozzles are driven to start the application of the photocurable resin from the middle part of the long side part toward the other end part. Photocurable resin coating device. 上記基板の少なくとも上記塗布ノズルによって光硬化性樹脂が塗布される側辺部は上記基板ステージから突出していて、この基板の上記基板ステージから突出した部分の下面は支持体によって支持されることを特徴とする請求項１記載の光硬化性樹脂の塗布装置。   The side portion of the substrate on which the photocurable resin is applied by the coating nozzle protrudes from the substrate stage, and the lower surface of the portion protruding from the substrate stage of the substrate is supported by a support. The photocurable resin coating apparatus according to claim 1. 上記支持体の上面に上記基板を吸着保持する吸着手段を備えていることを特徴とする請求項２記載の光硬化性樹脂の塗布装置。   The photocurable resin coating apparatus according to claim 2, further comprising suction means for sucking and holding the substrate on the upper surface of the support. 上記塗布ノズルによって塗布された光硬化性樹脂を撮像する撮像手段と、この撮像手段からの撮像信号によって上記光硬化性樹脂の塗布状態を判定する判定手段とを備えていることを特徴とする請求項１記載の光硬化性樹脂の塗布装置。   An image pickup means for picking up an image of the photocurable resin applied by the application nozzle, and a determination means for determining the application state of the photocurable resin based on an image pickup signal from the image pickup means. Item 2. A photocurable resin coating apparatus according to Item 1. 上記第１の塗布ユニットに設けられた１つの塗布ノズルと、上記第２の塗布ユニットに設けられた複数の塗布ノズルとは、上記基板の一側部と他側部に沿って同期して駆動されることを特徴とする請求項１記載の光硬化性樹脂の塗布装置。 One application nozzle provided in the first application unit and a plurality of application nozzles provided in the second application unit are driven synchronously along one side and the other side of the substrate. The photocurable resin coating apparatus according to claim 1, wherein 長方形状の基板とこの基板の長さの異なる１つの短側辺部と１つの長側辺部にそれぞれ接続された電子部品との接続部分に塗布ノズルから吐出される光硬化性樹脂を塗布する光硬化性樹脂の塗布方法であって、
上記塗布ノズルを上記基板の側辺部に沿う方向に移動させて上記基板と上記電子部品との接続部分に光硬化性樹脂を塗布する工程と、
上記塗布ノズルによる光硬化性樹脂の塗布に続いて上記接続部分に塗布された光硬化性樹脂に照射光を照射して硬化させる工程を具備し、
上記基板の上記１つの短側辺部に対してはこの短側辺部に対向して配置された第１の塗布ユニットに設けられた１つの塗布ノズルによって上記１つの長側辺部と隣接する一端から光硬化性樹脂の塗布を開始し、上記１つの長側辺部に対してはこの長側辺部に対向して配置された第２の塗布ユニットに設けられた複数の塗布ノズルの１つによって上記長側辺部の上記１つの短側辺部と反対側に位置する一端から他端に向かって光硬化性樹脂の塗布を開始し、残りの塗布ノズルによって上記長側辺部の長手方向の中途部から他端に向かって光硬化性樹脂の塗布を開始することを特徴とする光硬化性樹脂の塗布方法。 The photocurable resin discharged from the coating nozzle is applied to a connection portion between the rectangular substrate, one short side portion having a different length of the substrate, and an electronic component connected to each long side portion. A method of applying a photocurable resin,
Moving the coating nozzle in a direction along the side of the substrate to apply a photocurable resin to a connection portion between the substrate and the electronic component;
A step of irradiating the photocurable resin applied to the connecting portion with the irradiation light and curing the photocurable resin applied by the application nozzle;
The one short side part of the substrate is adjacent to the one long side part by one application nozzle provided in a first application unit arranged to face the short side part. Application of the photocurable resin is started from one end, and one of the plurality of application nozzles provided in the second application unit arranged to face the one long side portion is opposed to the long side portion. The application of the photocurable resin from one end located on the opposite side to the one short side portion of the long side portion is started by the other, and the length of the long side portion is determined by the remaining application nozzles. A method of applying a photocurable resin, characterized by starting application of a photocurable resin from a midway portion in the direction toward the other end .
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