JP4480660B2 - Substrate bonding equipment - Google Patents

Description

  The present invention relates to a substrate bonding apparatus, and more particularly to a substrate bonding apparatus that can bond electrode substrates of a pair of liquid crystal display panels with good bonding position accuracy and cell gap accuracy.

  A liquid crystal display panel is manufactured by bonding a pair of electrode substrates each having an electrode formed on a glass substrate at an interval (cell gap) of 2 to 5 μm and enclosing a liquid crystal material in the gap. When a voltage is applied to the pixel electrodes on both electrode substrates, the orientation of liquid crystal molecules between the electrodes changes, and the amount of transmitted light changes accordingly. By controlling the voltage applied to each pixel, a gray image can be displayed. At this time, if the cell gap between the two electrode substrates is not uniform or the bonding position is shifted, display unevenness (color unevenness, unevenness of light and shade), a decrease in contrast, and the like occur.

  The electrode substrate is bonded by applying a sealing agent (thermosetting adhesive or ultraviolet curable adhesive) to one electrode substrate, aligning and bonding the other electrode substrate, and curing the sealing agent. Conventionally, many thermosetting adhesives have been used as sealing agents, but there are problems such as requiring large equipment for heat treatment, increasing the process time, and deforming the electrode substrate by heat treatment. there were.

  In view of these problems, an ultraviolet curable adhesive has come to be used as a sealant. This ultraviolet curable adhesive can be cured by irradiating a predetermined amount of ultraviolet rays, and since a high temperature process is not required, the apparatus configuration can be simplified and the product is not deformed by heat. Have advantages.

  As an apparatus for laminating a substrate using this ultraviolet curable adhesive, for example, an apparatus described in Patent Document 1 includes a glass substrate 132 and a quartz glass substrate on a base 131 as shown in FIG. The lower surface plate 133 is placed, the lower surface plate 133 is provided with a through hole 133a, and the base plate 132 is provided with a groove 132a. And if the groove | channel 132a is connected to the vacuum pump which is not shown in figure, the board | substrate 110 mounted in the lower surface plate 133 will be adsorb | sucked.

  A support column 136 and a support plate 136 are installed on the base 131. A table 137 is provided on the support plate 136. A cylinder 138 is provided on the lower surface of the table 137, and a lower end of the cylinder 138 is provided on the lower surface. Vacuum suction arms 139A and 139B are respectively attached. A vertical rod 140 is attached to the support plate 136 via a guide member 141, and an upper surface plate 142 and a frame body 142 a are attached to the lower end of the vertical rod 140. The upper surface plate 142 is raised and lowered by the air cylinder 143.

  Next, the operation of the substrate bonding apparatus having the above configuration will be described.

  First, the substrate 110 coated with a sealing agent is placed on the lower surface plate 133 and adsorbed. Next, the counter substrate 120 is attracted to the vacuum suction arms 139A and 139B. Next, the table 137 is moved based on the image of the camera 147, and the substrate 110 on which the sealant is applied and the counter substrate 120 are aligned with an accuracy of several μm.

  Next, the cylinder 138 is lowered, and alignment is performed with an accuracy of about 1 μm in a state where the substrate 110 coated with the sealant and the counter substrate 120 are in contact with each other. Then, the suction of the vacuum suction arms 139A and 139B is released, and the cylinder 138 is raised.

  Next, when the air cylinder 143 is lowered and the gel rubber 144 of the frame 142a is brought into contact with the counter substrate 120, the upper surface plate 142, the frame 142a, the gel rubber 144, and the counter substrate 120 are surrounded. A sealed space is formed. Therefore, the air pressure in the sealed space is increased and the light source 134 is turned on while the counter substrate 120 is pressed against the substrate 110 coated with the sealant with the atmospheric pressure, and the sealant is cured by irradiating ultraviolet rays.

Japanese Patent No. 3536651

  However, in the conventional substrate laminating apparatus or the like, the lower surface plate 133 is made of quartz glass, and the entire surface of the plate transmits ultraviolet rays. Therefore, the portions other than the sealant of the substrate 110 are irradiated with ultraviolet rays, and the substrate 110 , 120 may damage the TFT (thin film transistor) element formed in 120.

  In addition, since the ultraviolet rays are irradiated over the entire substrates 110 and 120, the illuminance of the ultraviolet rays applied to the sealing agent is lowered, and the exposure time until reaching the integrated light amount necessary for curing of the sealing agent is increased. There was a problem of increased consumption. Further, when the illuminance is increased and the exposure time is shortened, there is a problem that an ultraviolet light source having a larger output is required.

  Furthermore, after positioning the counter substrate 120, the vacuum suction arms 139A, 139B are separated from the counter substrate 120, and then the counter substrate 120 is pressed by the gel rubber 144 of the frame 142a, so that pressure is applied. When the vacuum suction arms 139A and 139B are separated from each other, there is a problem that the counter substrate 120 becomes movable and the position is shifted due to the viscosity of the sealing agent.

  Therefore, the present invention has been made in view of the problems in the above conventional substrate bonding apparatus, and in bonding a pair of substrates, in particular, an electrode substrate of a liquid crystal display panel, the bonding position accuracy, the cell gap, and the like. It is an object of the present invention to provide a substrate bonding apparatus capable of bonding with good accuracy.

In order to achieve the above object, the present invention is a substrate laminating apparatus that superposes a pair of substrates composed of an upper substrate and a lower substrate, and cures and fixes a sealant applied between both substrates. An upper substrate holding means for holding the upper substrate, a lower substrate holding means for holding the lower substrate, an upper substrate held by the upper substrate holding means, and a lower substrate held by the lower substrate holding means Positioning means for positioning the substrate at a predetermined position, pressurizing means for pressing the upper substrate and the lower substrate positioned at a predetermined position by the positioning means against each other with a predetermined pressure, and the pressurizing means An ultraviolet irradiation means for irradiating and curing the sealing agent with ultraviolet rays in a state of being pressurized by, and an irradiation area control means for controlling an ultraviolet irradiation area irradiated by the ultraviolet irradiation means; Wherein said ultraviolet light irradiation means includes a rectangular frame-shaped radiation holes, and irradiating ultraviolet rays to the radiation hole.

According to the present invention, the irradiation region control unit can control the irradiation region of the ultraviolet ray irradiated by the ultraviolet irradiation unit, so that the illuminance of the ultraviolet ray irradiated to the sealing agent is high and the exposure time is shorter. A predetermined integrated light quantity can be reached. Thereby, since there is no useless ultraviolet irradiation, power consumption for turning on the ultraviolet light source can be suppressed, the productivity of the substrate can be improved, and the manufacturing cost can be reduced. In addition, since the sealing agent can be cured by irradiating ultraviolet rays while holding the substrate between the lower substrate holding means and the upper substrate holding means, the bonding position accuracy of the substrates is good and the manufacturing yield of the substrates is improved. Thus, the manufacturing cost can be reduced. Furthermore, since the ultraviolet irradiation means has a rectangular frame-shaped irradiation hole and irradiates the irradiation hole with ultraviolet light, wasteful ultraviolet irradiation can be further reduced, power consumption can be suppressed, and the productivity of the substrate can be improved. Cost can be reduced.

  In the substrate bonding apparatus, the upper substrate holding means and / or the lower substrate holding means can suck and hold the upper substrate and / or the lower substrate via a vacuum source. Accordingly, the substrate can be firmly fixed and held, and the bonding position accuracy of the substrates can be maintained high.

  Further, the irradiation area control means may be an opening having the same shape as the application pattern of the sealant formed on the lower substrate holding means and applied to the lower substrate. Thereby, ultraviolet rays are irradiated only to the sealant portion, and it is possible to prevent the TFT elements and the like from being damaged by the ultraviolet rays, thereby improving the production yield of the substrate and reducing the production cost.

  In the substrate bonding apparatus, a cross section parallel to the vertical surface of the opening can be formed into a trapezoidal shape that gradually expands downward from above. Accordingly, when the ultraviolet ray is irradiated, a shadow portion is hardly formed in the opening, and the ultraviolet ray can be surely irradiated to the coating pattern of the sealing agent.

  The cross section of the opening parallel to the vertical plane may have a convex shape that expands downward from above. Thus, similarly to the above, when the ultraviolet ray is irradiated, it becomes difficult to form a shadow portion in the opening, and the application pattern of the sealing agent can be reliably irradiated with the ultraviolet ray.

  In the substrate bonding apparatus, the lower substrate holding means can be placed on a quartz plate located below the lower substrate holding means, and the ultraviolet rays can be irradiated through the quartz plate.

  Further, the lower substrate holding means can be placed on a honeycomb plate positioned below the lower substrate holding means and having a mirror-finished surface, and the ultraviolet rays can be irradiated through the honeycomb plate. Thereby, the ultraviolet rays pass through the inner surface of the honeycomb plate while being reflected, and are irradiated to the sealing agent. At this time, since the ultraviolet rays diffuse and the illuminance distribution of the ultraviolet rays does not occur, it is possible to manufacture a device that is cheaper and lighter than the quartz plate.

The present invention is also a substrate laminating apparatus that superposes a pair of substrates composed of an upper substrate and a lower substrate, and cures and fixes a sealant applied between the two substrates. An upper substrate holding means for holding, a lower substrate holding means for holding the lower substrate, an upper substrate held by the upper substrate holding means, and a lower substrate held by the lower substrate holding means in a predetermined position Positioning means for positioning, pressurizing means for pressing the upper substrate and the lower substrate positioned at predetermined positions by the positioning means against each other with a predetermined pressing force, and pressure applied by the pressing means state, comprising an ultraviolet irradiation means for curing by irradiating ultraviolet rays to the sealing agent, an irradiation area control means for controlling the irradiation area of the ultraviolet rays irradiated by the ultraviolet light irradiation means, the ultraviolet Morphism means, you characterized in that it is constituted by arranging the ultraviolet irradiation unit having a linear irradiating hole 4 Motosonae, the ultraviolet irradiation unit of the four in a rectangular frame shape. Thereby, the shape of the irradiation hole can be rearranged in accordance with the coating pattern of the sealing agent, and it is possible to easily cope with multi-product production.

  As described above, according to the present invention, it is possible to improve the bonding position accuracy and the cell gap accuracy when bonding a pair of substrates, particularly an electrode substrate of a liquid crystal display panel.

  Next, embodiments of the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the substrate bonding apparatus according to the present invention includes a base 1, an XYθ axis stage 2, a suction table 3, a mount 4, a guide post 5, a bearing 6, and a pressure plate 7. And a pressurizing means 8, a rod 9, a manifold plate 10, an elastic body 11, an upper suction plate 12, a video camera 13, and the like. Further, as shown in FIG. 3, the suction table 3 includes a lower suction plate 20, a quartz plate 22, a top plate 23, a side wall 24, a column 26, an ultraviolet irradiation unit 27, and the like.

  As shown in FIG. 1, an XYθ-axis stage 2 is mounted on the base 1, and a suction table 3 is mounted on the XYθ-axis stage 2. The XYθ-axis stage 2 is driven by at least three sets of drive shafts configured by a pulse motor, a ball screw, and the like. It can be moved to any position within the movable range, for example, in units of 0.1 μm in the Y-axis) and turning (θ-axis) directions.

  As shown in FIGS. 2 and 3, the suction table 3 is formed by forming a side wall 24 and a top plate 23 in a box shape, and combining the quartz plate 22 and the lower suction plate 20 with the top plate 23. Mount.

  The lower suction plate 20 desirably has a surface flatness of, for example, 1 μm or less. The lower suction plate 20 is separated into an outer peripheral portion 20a and an inner peripheral portion 20b, and is fixed to the quartz plate 22 respectively. The opening 20e formed between the outer peripheral portion 20a and the inner peripheral portion 20b of the lower suction plate 20 has the same shape as the application pattern of the ultraviolet curable sealant 19 applied to the lower substrate 18. A guide pin 21 having a diameter of 4 mm is embedded in the outer peripheral portion 20a, and guides the mounting position when the lower substrate 18 is mounted on the lower suction plate 20.

  For the guide pin 21, polyether ether ketone resin, polyacetal resin, polyimide resin, polyamide resin, or the like can be used. The guide pins 21 are provided in consideration of the case where the lower substrate 18 is manually mounted, and can be omitted when the lower substrate 18 is mounted by a substrate transfer device or the like.

  When the lower substrate 18 is mounted on the lower suction plate 20 along the guide pins 21 with the application surface of the sealing agent 19 facing up, the opening 20e is positioned immediately below the sealing agent 19 applied to the lower substrate 18. . A plurality of suction holes 20 c having a diameter of 1.5 mm for sucking and holding the lower substrate 18 are formed in the inner peripheral portion 20 b of the lower suction plate 20. Further, as shown in FIG. 4, a groove 20d having a width of 1.5 mm and a depth of 1 mm is provided on the back surface of the inner peripheral portion 20b so as to connect the plurality of suction holes 20c.

  As shown in FIGS. 2 and 3, a support column 26 is erected inside the suction table 3. The support column 26 is provided with an intake passage 26 a and is electrically connected to the through hole 22 a of the quartz plate 22 through the O-ring 25. The through hole 22 a of the quartz plate 22 is electrically connected to the groove 20 d (see FIG. 4) of the inner peripheral portion 20 b of the lower suction plate 20. When the vacuum source 30 and the intake path 26a inside the support column 26 are connected by the intake pipe 29 via the switching valve 31, and the switching valve 31 is operated to conduct with the vacuum source 30, the inner circumference of the lower suction plate 20 Air is sucked from the suction hole 20 c provided in the portion 20 b, and the lower substrate 18 can be sucked and held on the lower suction plate 20.

  An ultraviolet irradiation unit 27 is installed outside the support column 26 so as to surround the support column 26. The ultraviolet irradiation unit 27 includes a rectangular frame-shaped ultraviolet irradiation hole 27a, and one end of a large number of quartz fibers 28 having a diameter of 0.2 mm is arranged in the ultraviolet irradiation hole 27a. The remaining end of the quartz fiber 28 is bundled and extended outward, and is connected to the ultraviolet light source 32.

  When the ultraviolet light source 32 is turned on, the ultraviolet light is irradiated from the ultraviolet irradiation hole 27a to the rectangular frame-shaped irradiation area through the quartz fiber 28. Although it is preferable that the ultraviolet irradiation hole 27a has the same shape as the opening 20e of the lower suction plate 20, since the ultraviolet light is diffused and emitted, the size and shape may be slightly different. The ultraviolet light passes through the quartz plate 22, passes through the opening 20 e of the lower suction plate, and is irradiated to the sealing agent 19 applied to the lower substrate 18. The opening 20e has the same shape as the application pattern of the sealant 19, and ultraviolet rays are concentrated and irradiated on the application site of the sealant 19, so that the sealant 19 can be cured in a shorter irradiation time, The portion other than the sealing agent 19 is prevented from being irradiated with ultraviolet rays, and the TFT elements and the like formed on the upper substrate 17 or the lower substrate 18 are not damaged.

  When the size of the opening 20e of the lower suction plate 20 and the ultraviolet irradiation hole 27a of the ultraviolet irradiation unit 27 are different, ultraviolet rays pass through the opening 20e obliquely, but as shown in FIG. 4, the vertical plane of the opening 20e If the cross-sectional shape parallel to is a trapezoidal shape that gradually expands downward from above or a convex shape that expands downward from above, no shadow is generated in the opening 20e, and ultraviolet rays easily pass.

  A stainless steel guide post 5 is erected on the base 1 of FIG. 1 and a pressure plate 7 is attached via a bearing 6. The pressure plate 7 slides up and down by the action of the bearing 6. A manifold plate 10, an elastic body 11, and an upper suction plate 12 are attached to the pressure plate 7.

  As shown in FIG. 2, the upper suction plate 12 made of stainless steel is provided with a plurality of suction holes 12 a having a diameter of 1.5 mm, like the lower suction plate 20. The elastic body 11 made of polyurethane rubber having a shore hardness of 50 to 70 and the manifold plate 10 are also provided with a plurality of through holes 10 a and 11 a so as to match the suction holes 12 a of the upper suction plate 12. On the upper surface side of the manifold plate 10, a groove 10b is provided so as to connect the plurality of through holes 10a. The pressurizing plate 7 is provided with an intake passage 7a. When the vacuum source 30 and the intake passage 7a are connected to each other through an intake pipe 29 via a switching valve 31, and the switching valve 31 is operated to conduct with the vacuum source 30, Air is sucked from the suction holes 12 a of the upper suction plate 12, and the upper substrate 17 can be sucked and held on the upper suction plate 12.

  A pressing means 8 is mounted on the gantry 4 on the base 1 in FIG. The pressurizing means 8 is constituted by a pulse motor, a ball screw or the like. The tip of the ball screw is connected to the rod 9 and drives the pulse motor in response to a command from a controller (not shown) so that the rod 9 can be moved up and down to any position within the movable range with any torque. . The tip of the rod 9 is connected to the pressure plate 7, and the pressure plate 7 can be moved up and down by driving the pressure means 8.

  A compression spring 33 is incorporated in the guide post 5 to apply a force in the direction of lifting the bearing 6 and the pressure plate 7. The load of the spring 33 is selected so as to balance the weight of the bearing 6 and the pressure plate 7, and the weight of the bearing 6 and the pressure plate 7 is offset, so that the pressure operation is performed with a weak pressure. You can also.

  The gantry 4 is equipped with two video cameras 13. The video camera 13 is equipped with a magnifying lens 14, a 90 ° prism 16, an illumination device 15, and the like, and can photograph alignment marks formed in advance on the upper substrate 17 and the lower substrate 18. Further, holes are formed in the pressure plate 7, the manifold plate 10, the elastic body 11, and the upper suction plate 12 so that the alignment mark can be photographed. As the magnifying lens 14, an optical magnification of 8 ×, an object side telecentric optical system with coaxial falling illumination, or the like can be used. A light emitting diode, a halogen lamp, or the like can be used as a light source for illumination. Data relating to the photographed alignment mark is sent to an image processing apparatus (not shown), and a relative shift amount between the upper substrate 17 and the lower substrate 18 is calculated.

  The video camera 13 can use a CCD (charge coupled device) or a CMOS (complementary metal oxide semiconductor) as an imaging device. If the size of the image sensor is 6.4 mm wide x 4.8 mm long, the number of effective pixels is 1600 pixels wide x 1200 pixels wide, and the lens magnification is 8 times, the field of view is 0.8 mm wide x 0.6 mm long, 1 The resolution per pixel is 0.5 μm, which is convenient for fine alignment.

  In addition, the material, dimension, required number, processing method, assembly method, etc. of each component described here are examples, and other materials, dimensions, required number, processing method, assembly method may be used. Of course.

  Next, the operation of the substrate bonding apparatus having the above configuration will be described in detail with reference to FIGS.

  First, as shown in FIG. 1, the upper substrate 17 is transported and brought into close contact with a predetermined position of the upper suction plate 12 manually or by an upper substrate transport means (not shown). Next, when the switching valve 31 of FIG. 2 is operated and the intake path 7 a is conducted to the vacuum source 30, the upper substrate 17 is sucked and held by the upper suction plate 12.

  Next, the lower substrate 18 is transported to a predetermined position of the lower suction plate 20 manually or by a lower substrate transport means (not shown), and mounted with the application surface of the sealant 19 (see FIG. 3) facing upward. When the switching valve 31 is operated and the intake path 26 a is conducted to the vacuum source 30, the lower substrate 18 is sucked and held by the lower suction plate 20.

  Next, the pressing means 8 of FIG. 1 is driven, and the pressing plate 7 is lowered to a predetermined height set in advance. This height is such that the sealant 19 applied to the upper substrate 17 and the lower substrate 18 is not in contact, and is within the depth of field of the magnifying lens 14, and the alignment marks of both the upper substrate 17 and the lower substrate 18 are aligned. Is a height that can be photographed well. For example, the height between the upper substrate 17 and the lower substrate 18 is 50 μm. In the present embodiment, the height at which the pressure plate 7 is lowered and stopped is determined in advance by a set value. However, a means for measuring the distance between the upper substrate 17 and the lower substrate 18 is separately provided. From the measured value, the height at which the pressure plate 7 is lowered and stopped may be dynamically determined.

  Next, an alignment mark (not shown) provided on each of the upper substrate 17 and the lower substrate 18 is photographed by the video camera 13. The captured video is sent to an image processing device (not shown), and the relative shift amount between the upper substrate 17 and the lower substrate 18 is calculated.

  Next, the calculated data regarding the relative displacement between the upper substrate 17 and the lower substrate 18 is sent to a controller (not shown) and compared with a specified value. The specified value is a limit value of the relative shift amount between the upper substrate 17 and the lower substrate 18 and is stored in advance in the controller. If the calculated displacement amount is larger than the specified value, the XYθ axis stage 2 is driven to correct the position of the lower substrate 18 so that the displacement amount of the lower substrate 18 with respect to the upper substrate 17 is minimized. After performing the correction operation, the alignment mark is photographed again, and the amount of deviation is calculated. The position correction of the lower substrate 18 is repeated in the same procedure until the deviation amount converges below the specified value.

  Next, the pressurizing means 8 is driven, the upper substrate 17 is overlaid on the lower substrate 18, pressed with a predetermined pressure for a predetermined time, and pressurized. At least one of the upper substrate 17 and the lower substrate 18 is provided with a gap control material, and an appropriate gap is formed by pressurizing the upper substrate 17 and the lower substrate 18 with a predetermined pressure and time. Further, since the elastic body 11 is interposed between the manifold plate 10 and the upper suction plate 12, even if the parallelism between the upper substrate 17 and the lower substrate 18 is not accurate, the upper substrate 17 does not come into contact with each other. And the entire surface of the lower substrate 18 can be pressurized with a uniform applied pressure, and an accurate gap can be formed. At this time, the sealing agent 19 applied to the lower substrate 18 contacts the upper substrate 17.

  Next, when the ultraviolet light source 32 is turned on with the upper substrate 17 and the lower substrate 18 being pressurized, the ultraviolet light passes through the quartz fiber 28 and is emitted from the ultraviolet irradiation hole 27 a of the ultraviolet irradiation unit 27. The emitted ultraviolet light passes through the quartz plate 22 and is irradiated to the sealing agent 19 through the opening 20 e of the lower suction plate 20. The opening 20e has the same shape as the application pattern of the sealing agent 19, and ultraviolet rays are concentrated and irradiated on the application site of the sealing agent 19, so that the sealing agent 19 can be cured in a shorter irradiation time. At the same time, it is possible to prevent the portions other than the sealing agent 19 from being irradiated with ultraviolet rays, and the TFT elements and the like formed on the upper substrate 17 or the lower substrate 18 are not damaged. Further, since the sealing agent 19 is cured in a state where the upper substrate 17 and the lower substrate 18 are pressurized, the upper substrate 17 and the lower substrate 18 are not displaced and the gap is not changed. The sealing agent 19 is cured by irradiating the sealing agent 19 with ultraviolet rays for a predetermined time. After completion of irradiation for a predetermined time, the ultraviolet light source 32 is turned off.

  Next, the switching valve 31 is operated, and the intake paths 7a and 26a are opened to the atmosphere to release the suction of the upper suction plate 12 and the lower suction plate 20. Next, the pressurizing means 8 is driven and the pressurizing plate 7 is pulled up. Finally, the substrate that has been bonded is taken out manually or by the lower substrate transfer means (not shown), and the series of operations is completed.

  As another embodiment of the substrate bonding apparatus according to the present invention, as shown in FIG. 5, four ultraviolet irradiation sections 35 each having a linear irradiation hole 35a are arranged in a rectangular frame shape. Thereby, the shape of an irradiation hole can be rearranged according to the application pattern of the sealing agent 19, and it becomes easy to cope with multi-product production. FIG. 5A shows an arrangement example of the ultraviolet irradiation units 35 corresponding to a narrow irradiation area, and FIG. 5B shows a wide irradiation area.

  Further, as another embodiment of the substrate bonding apparatus according to the present invention, as shown in FIG. 6, a honeycomb plate 34 having a honeycomb-like honeycomb structure is used instead of the quartz plate 22 (see FIG. 3). You can also. As an example, the honeycomb plate 34 is formed by corrugating a 0.1 mm thick aluminum plate having a mirror-finished surface and a 1 mm thick stainless steel plate bonded to the upper and lower surfaces.

  Thereby, the ultraviolet rays emitted from the ultraviolet irradiation holes 27a of the ultraviolet irradiation portion 27 of FIG. 3 pass through the inner surface of the honeycomb plate 34 while reflecting, and pass through the openings 20e of the lower adsorption plate 20 to the sealing agent 19 of the lower substrate 18. Irradiated. Further, since the ultraviolet rays diffuse, the shadow due to the thickness of the aluminum plate constituting the honeycomb plate 34 is canceled out, and the illuminance distribution of the ultraviolet rays is not uneven. By using the honeycomb plate 34, it is possible to manufacture a device that is cheaper and lighter than the quartz plate 22.

  INDUSTRIAL APPLICABILITY The present invention can be used as a substrate bonding apparatus that can bond a pair of electrode substrates, such as a liquid crystal display panel, with good positional accuracy and gap accuracy.

It is a front view which shows one Embodiment of the board | substrate bonding apparatus concerning this invention. It is sectional drawing which shows one Embodiment of the board | substrate bonding apparatus concerning this invention. It is a disassembled perspective view which shows the adsorption | suction table of the board | substrate bonding apparatus of FIG. It is sectional drawing which shows the lower adsorption | suction plate of the board | substrate bonding apparatus of FIG. It is a perspective view which shows other embodiment of the board | substrate bonding apparatus concerning this invention. It is a perspective view which shows other embodiment of the board | substrate bonding apparatus concerning this invention. Sectional view showing a conventional example

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base 2 XYtheta axis stage 3 Suction table 4 Base 5 Guide post 6 Bearing 7 Pressure plate 7a Intake path 8 Pressure means 9 Rod 10 Manifold plate 10a Through hole 10b Groove 11 Elastic body 11a Through hole 12 Upper adsorption plate 12a Adsorption Hole 13 Video camera 14 Magnifying lens 15 Illumination device 16 90 ° prism 17 Upper substrate 18 Lower substrate 19 Sealing agent 20 Lower adsorption plate 20a Outer peripheral portion 20b Inner peripheral portion 20c Adsorption hole 20d Groove 20e Opening portion 21 Guide pin 22 Quartz plate 22a Through Hole 23 Top plate 24 Side wall 25 O-ring 26 Strut 26a Intake path 27 Ultraviolet irradiation section 27a Ultraviolet irradiation hole 28 Quartz fiber 29 Intake pipe 30 Vacuum source 31 Switching valve 32 Ultraviolet light source 33 Spring 34 Honeycomb plate 35 Ultraviolet irradiation section 35a Irradiation hole 110 substrate 20 counter substrate 131 base 132 base 132a vacuum chuck 133 lower surface plate 133a vacuum chuck 134 light source 135 column 136 support plate 137 table 138 cylinder 139A vacuum suction arm 139B vacuum suction arm 140 vertical rod 141 guide member 142 upper surface plate 142a frame 143 air Cylinder 144 Gel rubber 147 Positioning camera

Claims (8)

A substrate laminating apparatus that superimposes a pair of substrates composed of an upper substrate and a lower substrate, and cures and fixes a sealing agent applied between both substrates,
An upper substrate holding means for holding the upper substrate;
Lower substrate holding means for holding the lower substrate;
Positioning means for positioning the upper substrate held by the upper substrate holding means and the lower substrate held by the lower substrate holding means at a predetermined position;
A pressurizing unit that pressurizes the upper substrate and the lower substrate, which are positioned at a predetermined position by the positioning unit, by pressing each other with a predetermined pressing force;
Ultraviolet irradiation means for irradiating the sealing agent with ultraviolet rays to be cured in a state of being pressurized by the pressure means;
An irradiation area control means for controlling the irradiation area of the ultraviolet rays irradiated by the ultraviolet irradiation means ,
The said ultraviolet irradiation means has a rectangular frame-shaped irradiation hole, and irradiates this irradiation hole with an ultraviolet-ray, The board | substrate bonding apparatus characterized by the above-mentioned.   The substrate bonding apparatus according to claim 1, wherein the upper substrate holding unit and / or the lower substrate holding unit sucks and holds the upper substrate and / or the lower substrate through a vacuum source.   3. The substrate according to claim 1, wherein the irradiation region control means is an opening having the same shape as a coating pattern of a sealing agent formed on the lower substrate holding means and applied to the lower substrate. Bonding device.   The substrate bonding apparatus according to claim 3, wherein a cross section of the opening parallel to the vertical surface has a trapezoidal shape that gradually expands downward from above.   The substrate bonding apparatus according to claim 3, wherein a cross section of the opening parallel to the vertical plane has a convex shape that expands downward from above.   6. The lower substrate holding means is placed on a quartz plate positioned below the lower substrate holding means, and the ultraviolet rays are irradiated through the quartz plate. The board | substrate bonding apparatus of crab.   The lower substrate holding means is located below the lower substrate holding means, is placed on a honeycomb plate having a mirror-finished surface, and is irradiated with the ultraviolet rays through the honeycomb plate. The board | substrate bonding apparatus in any one of Claims 1 thru | or 5. A substrate laminating apparatus that superimposes a pair of substrates composed of an upper substrate and a lower substrate, and cures and fixes a sealing agent applied between both substrates,
An upper substrate holding means for holding the upper substrate;
Lower substrate holding means for holding the lower substrate;
Positioning means for positioning the upper substrate held by the upper substrate holding means and the lower substrate held by the lower substrate holding means at a predetermined position;
A pressurizing unit that pressurizes the upper substrate and the lower substrate, which are positioned at a predetermined position by the positioning unit, by pressing each other with a predetermined pressing force;
Ultraviolet irradiation means for irradiating the sealing agent with ultraviolet rays to be cured in a state of being pressurized by the pressure means;
An irradiation area control means for controlling the irradiation area of the ultraviolet rays irradiated by the ultraviolet irradiation means,
The ultraviolet irradiation means, the ultraviolet irradiation unit having a linear irradiating hole 4 Motosonae, the four ultraviolet irradiator rectangular frame being configured by arranging the bonding board you characterized in apparatus.

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