JP2020120085A - Manufacturing method of wiring board and manufacturing installation of wiring board - Google Patents

Abstract

To provide a manufacturing method of wiring board and a manufacturing installation of wiring board capable of coating a wiring board with insulation paste suitably.SOLUTION: By analyzing the image of the surface of a work substrate 31 (i.e., a work substrate 31 to which an output line 9 is joined) photographed by means of a camera 95, determination is made whether or not there is a portion coated with glass paste in the coating region TR on the surface of the work substrate 31 (more specifically, an image processing region GR). When coating region TR is coated with glass paste, subsequent processing content for the work substrate 31 is changed. More specifically, when the coating region TR is coated with glass paste, first time coating is carried out for the work substrate 31, according to the first time coating conditions of coating with glass paste. Meanwhile, when the coating region TR is coated with glass paste, second time coating is carried out according to the second time coating conditions of coating with glass paste.SELECTED DRAWING: Figure 9

Description

The present disclosure relates to a method for manufacturing a wiring board in which a conductive wire is joined to a wiring layer formed on the surface of an insulating substrate, and a manufacturing apparatus for the wiring board.

Conventionally, as a temperature sensor used in an exhaust system of an internal combustion engine (for example, an automobile engine), a temperature sensor including a temperature sensitive element having a metal resistor (platinum resistor) is known. This temperature sensor detects the temperature of an object to be measured (gas to be measured, etc.) by utilizing the change in the electric resistance value of the metal resistor due to the temperature change (see Patent Document 1).

As the temperature-sensitive element described above, as illustrated in FIG. 13, a thin film terminal P3 connected to a platinum resistor P2 is formed on the surface of an alumina substrate P1, and a thick film pad portion ( That is, there is known a wiring board in which a wiring layer) P4 is formed and an output line (that is, a conductive line) P5 is joined to the pad portion P4.

The pad portion P4 and the output line P5 are covered with an insulating coating portion P6 made of glass which is an electric insulating material. The insulating coating portion P6 is a member for preventing the output line P5 from peeling (that is, for reinforcing) and for ensuring electrical insulation. When forming the insulating coating portion P6, glass paste (that is, insulating paste) was applied so as to cover the output line P5 and the pad portion P4, dried, and then baked.

JP, 2005-180861, A

By the way, when forming the above-mentioned insulating coating portion, conventionally, since the operator or the like has only applied the glass paste once around the output line and the pad portion, the glass paste is not applied around the output line and the like. There has been a problem that unfilled gaps (that is, gaps due to bubbles or the like) are likely to occur.

As a result, when there is a gap around the output line or the like, for example, when an external force is applied to the output line, the output line or the like may be separated. In addition, if the amount of the glass paste applied once is not sufficient, there is a possibility that the electrical insulation is not sufficient.

An object of the present disclosure is to provide a wiring board manufacturing method and a wiring board manufacturing apparatus capable of suitably applying an insulating paste to a wiring board so that peeling of a conductive wire or the like does not easily occur.

(1) According to the first aspect of the present disclosure, an insulating paste is applied to a surface side of an insulating substrate so as to cover the wiring layer and the conductive line, with respect to the wiring substrate in which the conductive line is joined to the wiring layer formed on the surface of the insulating substrate. The present invention relates to a method for manufacturing a wiring board by applying to form an applying portion.

This method of manufacturing a wiring board has a first coating step, a second coating step, a photographing step, and a determination step.
In the first coating step, the insulating paste is first coated on the surface side of the insulating substrate.

In the second applying step, the insulating paste is applied again to the place where the insulating paste was first applied. In the photographing step, the surface of the wiring board provided with the wiring layer and the conductive wires is photographed using a camera.

In the determination step, the captured image is analyzed to determine whether or not there is a coating portion on the surface of the wiring board.
Then, based on the determination result, the content of the subsequent processing to be performed on the wiring board is changed depending on whether or not there is a coating portion on the surface of the wiring board.

As described above, in the first aspect, the photographed image of the wiring board on which the wiring layer and the conductive lines are provided is analyzed to determine whether or not there is a coating portion on the surface of the wiring board, and to determine the surface of the wiring board. Since the content of the post-treatment performed on the wiring board is changed depending on whether the coating portion is provided or not, it is possible to suitably perform the necessary post-treatment.

For example, when there is no coating part on the surface of the wiring board, the insulating paste can be first coated on the surface of the wiring board in the first coating step. On the other hand, if there is an applied portion on the surface of the wiring board, the insulating paste can be applied again to the place where the insulating paste was first applied in the second applying step.

As a result, the surface of the portion (for example, the first coating portion) first coated in the first coating step is coated again in the second coating step to form the coating portion (for example, the second coating portion) again. Can be formed.
Therefore, when the first coating is performed, for example, by supplying the insulating paste so as to form the first coating portion having a smaller thickness as compared with the conventional one-time coating, the conductive wire and the like can be formed. It is possible to prevent the formation of a gap that is not filled with the insulating paste around the periphery. Moreover, by coating the insulating paste again on the first coating portion, it is possible to supply a sufficient amount of the insulating paste around the conductive lines and the wiring layer.

Therefore, by baking the wiring substrate having the above-mentioned coating portion formed thereon, the insulating coating portion having preferable characteristics can be formed. In other words, there are few gaps around the conductive wire in the insulating coating, and since the insulating coating is made of a sufficient amount of insulating material, the bonding strength of the conductive wire is large (thus peeling is less likely to occur) and high. It has an effect of having electric insulation.

(2) In the second aspect of the present disclosure, the coating condition for coating the insulating paste may be changed depending on whether the surface of the wiring board has the coating portion or not.
For example, when there is no coating portion on the surface of the wiring board, the thickness of the wiring board should be smaller than that of the conventional one-time coating in order to fill the insulating paste around the conductive wires without any gaps. An insulating paste may be applied.

On the other hand, when there is a coating portion on the surface of the wiring board, in order to enhance the bonding strength and electrical insulation of the conductive wire, for example, a larger amount of insulating paste is supplied than in the case of forming the first coating portion. You may form a 2nd application part.

As a result, the insulating paste can be filled around the conductive wires without any gaps and a sufficient amount of the insulating paste can be supplied, so that the bonding strength and electrical insulation of the conductive wires can be improved.

(3) In the third aspect of the present disclosure, the wiring board that has been subjected to the first coating step is transported to the first position through the first path, and the wiring board that has been subjected to the second coating step is transferred to the second position. It may be conveyed to the second position along the route.

In this way, by transporting wiring boards having different coating processes to different positions, it is possible to easily and without fail perform necessary processing at different positions.
(4) The fourth aspect of the present disclosure may include a first drying step, a second drying step, and a firing step.

In the first drying step, when the wiring board is transported through the first path, the wiring board is placed on the first transport member and transported through the first path to dry the insulating paste. To do.
In the second drying step, when the wiring board is transported through the second path, the wiring board is placed on the second transporting member for firing which has higher heat resistance than the first transporting member, The insulating paste is conveyed by the route 2 and dried.

In the firing step, the insulating paste is fired after the second drying step to form the insulating coating portion.
In the fourth aspect, the wiring board on which the first coating section is formed can be placed on the first transport member to dry the insulating paste of the first layer. Further, the wiring substrate on which the first coating section and the second coating section are formed can be placed on the second transport member to dry the insulating paste of the second coating section.

Moreover, since the second transport member is a member for firing having high heat resistance, the wiring substrate after the drying of the second coating section is placed on the second transport member for firing in the firing step. It can be fired in this state. Therefore, the manufacturing process can be simplified.

(5) In a fifth aspect of the present disclosure, a coating device is driven to a wiring board in which a conductive wire is bonded to a wiring layer formed on the surface of an insulating substrate, and insulation is performed so as to cover the wiring layer and the conductive wire. The present invention relates to an apparatus for manufacturing a wiring board, in which an insulating paste is applied to the front surface side of a board to form an applied portion.

This wiring board manufacturing apparatus has a first coating control unit, a second coating control unit, a photographing control unit, a determination unit, and a post-processing unit.
The first application control unit controls the operation of first applying the insulating paste to the front surface side of the insulating substrate.

The second application control unit controls the operation of applying the insulating paste again to the location where the insulating paste was first applied.
The imaging control unit uses a camera to image the surface of the wiring board on which the wiring layer and the conductive wires are provided.

The determination unit analyzes the captured image and determines whether or not there is a coating unit on the surface of the wiring board.
The post-processing section changes the content of the post-processing performed on the wiring board, based on the determination result, depending on whether the surface of the wiring board has the coating section or not.

The wiring board manufacturing apparatus according to the fifth aspect has the same operational effects as those of the first aspect.
(6) In the sixth aspect of the present disclosure, the coating conditions for coating the insulating paste may be changed depending on whether the surface of the wiring board has a coating portion or not.

The sixth aspect has the same effects as the second aspect.
(7) In the seventh aspect of the present disclosure, the wiring board after the operation of the first coating control section is conveyed to the first position through the first path, and the wiring board after the operation of the second coating control section is transferred. , May be conveyed to the second position on the second path.

The seventh aspect has the same effects as the third aspect.
(8) In the eighth aspect of the present disclosure, a drying unit for drying the insulating paste and a baking unit for baking the dried insulating paste may be included.

When the wiring board is transported through the first route, the wiring substrate is placed on the first transport member and transported to the drying section through the first route to dry the insulating paste.
When the wiring board is transported through the second route, the wiring board is placed on the second transporting member for firing, which has higher heat resistance than the first transporting member, and the second route is used. Then, the insulating paste is conveyed to a drying section to dry the insulating paste.

Then, in the baking section, the dried insulating paste on the wiring substrate on the second carrying member is baked to form an insulating coating section.
The eighth aspect has the same effects as the fourth aspect.
<Description of Each Configuration of the Present Disclosure>
As a material for the insulating substrate, a high insulating material such as Al ₂ O ₃ or MgO can be used.

As the material of the insulating paste, for example, a material mainly containing SiO ₂ (that is, containing the main component) can be adopted.
As the material of the wiring layer, for example, a material mainly containing Pt can be adopted.

As the material of the conductive wire, for example, a material mainly containing Pt can be adopted.
The application conditions include, for example, the height of the application member that ejects the insulating paste when applying (for example, the height of the ejection port of the needle), the pressure for pushing out the insulating paste, the supply speed (the ejection amount per unit time), Examples include the moving speed of the coating member.

When the second coating portion is coated thicker than the first coating portion, for example, “increasing the height of the coating member”, “increasing the pressure for pushing the insulating paste”, and “increasing the supply speed” And “reducing the moving speed of the coating member”.

It is a partial fracture sectional view showing the structure by the side of the tip of temperature sensor 1 of an embodiment. FIG. 2A is a cross-sectional view showing a vertical cross-section (A-A cross section of FIG. 2B) of a part of the temperature-sensitive element, and FIG. Is. It is a flow chart which shows the whole manufacturing process of a temperature sensing element. It is a top view which shows the whole structure of a coating system. 5A is a plan view showing a pallet, and FIG. 5B is a plan view showing a setter. FIG. 6A is a front view showing the glass coating unit and the glass coating stage, and FIG. 6B is a side view showing the glass coating unit and the glass coating stage. 7A is a front view showing the rotational movement state of the glass coating stage, and FIG. 7B is a plan view showing the movement state of the glass coating stage in the Y-axis direction. It is a block diagram which shows the structure of an electronic controller. It is a flow chart which shows the application process of glass paste. It is a top view showing a work substrate. FIG. 11A shows an image taken by a camera, FIG. 11A is an explanatory view showing an image of a work substrate to which glass paste is not applied, FIG. 11B is an explanatory view showing an image processing area in FIG. 11A, and FIG. 11C is glass paste applied. 11D is an explanatory diagram showing an image of the work substrate, and FIG. 11D is an explanatory diagram showing an image processing area in FIG. 11D. It is explanatory drawing which shows the procedure after a glass paste is applied to a work substrate until a glass layer is formed. It is explanatory drawing of a prior art.

Embodiments of a wiring board manufacturing method and a wiring board manufacturing apparatus of the present disclosure will be described below with reference to the drawings.
[1. Embodiment]
The wiring board in this embodiment is used for a temperature sensitive element of a temperature sensor.
[1-1. Configuration of temperature sensor]
First, a temperature sensor having a temperature sensitive element will be briefly described.

As shown in a part in FIG. 1, the temperature sensor 1 is a long rod-shaped sensor, and although not shown, is attached to a distribution pipe (for example, an exhaust pipe of an internal combustion engine of a vehicle) to measure a flow in the distribution pipe. The temperature of a target gas (for example, exhaust gas) is detected.

The temperature sensor 1 is a sensor capable of measuring a temperature in the range of −40 to 1000° C., for example. That is, it is a temperature sensor that can measure the temperature in a high temperature range.
The temperature sensor 1 is provided with a known metal tube 3 on the tip side (downward in FIG. 1), and the temperature sensitive element 5 is arranged on the tip side inside the metal tube 3. ..

As will be described later, the temperature-sensitive element 5 has a temperature-sensing section 7 in which the electrical characteristics (electrical resistance value) of the internal metal resistor changes with temperature, and a pair of output lines connected to the temperature-sensing section 7 ( Element electrode lines) 9a and 9b (collectively referred to as 9) are provided.
[1-2. Configuration of temperature sensor]
Next, the configuration of the temperature sensitive element 5 will be described in detail.

As shown in FIG. 2, the temperature sensitive element 5 is formed on the same main surface as the ceramic substrate 11 and the metal resistor layer 13 formed on one main surface (upper side of FIG. 2A) of the ceramic substrate 11. The volatilization suppressing layer 15 and a pair of pad portions 17a and 17b (collectively referred to as 17) formed on a part of the surface of the metal resistor layer 13 on the rear end side (left side in FIG. 2A) of the same main surface, The pair of output lines 9a and 9b bonded to the surface of each pad portion 17, the ceramic coating layer 19 covering the upper side (upper side of FIG. 2A) of the metal resistor layer 13 on the tip side, and the tip side of the output line 9 And an insulating coating portion 21 that covers the pair of pad portions 17 and the like.

The temperature sensing unit 7 is a plate-shaped portion of the temperature sensing element 5 other than the output line 9.
Each configuration will be described below.
The ceramics substrate 11 is, for example, a rectangular plate material (that is, an insulating substrate having an electrical insulating property) made of alumina having a purity of 99.9% (in a plan view).

The metal resistor layer 13 is a metal thin film made of, for example, Pt having conductivity, and is composed of a thin wire portion 23 on the front end side and a pair of terminal portions 25a, 25b (collectively referred to as 25) on the rear end side. Become.

Among them, the thin line portion 23 is a thin line having a narrow line width (for example, a width of 20 μm), and is formed so as to meander a plurality of times in the region covered with the ceramic coating layer 19.
On the other hand, each terminal portion 25 is a terminal (wider than the thin wire portion 23) formed so as to be connected to a pair of end portions on the rear end side of the thin wire portion 23 and extend to the rear end side.

The volatilization suppressing layer 15 is a layer made of the same material as the metal resistor layer 13 and having the same thickness.
Each pad portion 17 is a conductive layer formed on the surface of each terminal portion 25. The pad portion 17 is made of a mixed material composed of Pt and glass.

The output wire 9 is a wire made of Pt (Pt wire), and its tip is joined to the surface of the pad portion 17. The output line 9 may be made of Pt alloy. The output line 9 is joined to the pad portion 17 by parallel welding (resistance welding).

The ceramic coating layer 19 is, for example, a substrate made of alumina having a purity of 99.9%, and the ceramic coating layer 19 covers the thin line portion 23 of the metal resistor layer 13, the volatilization suppressing layer 15, and the like.

The ceramic coating layer 19 is bonded to the ceramic substrate 11 or the like by a bonding layer 27 made of alumina having a purity of 99.9%, for example.
The insulating coating portion 21 is a glass coating layer having an electrical insulating property made of the same glass material (may be different) as the glass of the pad portion 17, for example. The surface side of the rear end side of the ceramic substrate 11, that is, the front end side of the output line 9, the pad portion 17, the rear end side of the ceramic coating layer 19, and the like are covered and hermetically sealed by the insulating coating portion 21.

The glass is, for example, a high heat-resistant glass having a transition point of 700° C. or higher and a softening point of 900° C. or higher, and the composition thereof is, for example, SiO ₂ : 52 mass %, CaO: 25 mass %, Al ₂ O. _3:15 wt%, SrO: 8% by mass.

As this glass, various kinds of glass such as silicate glass, aluminosilicate glass, borate glass, borosilicate glass, and phosphosilicate glass can be adopted.
[1-3. Manufacturing method of temperature sensitive device]
Next, the entire method of manufacturing the temperature sensitive element 5 will be described. The method of applying the glass paste in the method of manufacturing the temperature sensitive element 5 will be described in detail later.

As shown in FIG. 3, first, a base material (not shown) of the ceramic substrate 11 is cleaned by ultrasonic cleaning (S100). The base material is a plate material (that is, a rectangular plate material having substantially the same vertical and horizontal dimensions) for manufacturing the plurality of temperature sensitive elements 5 from one large-sized substrate.

Next, in order to form the metal resistor layer 13 and the volatilization suppressing layer 15, a well-known PVD method (for example, a PVD method) is applied to a surface portion of the surface of the base material where the metal resistor layer 13 and the volatilization suppressing layer 15 are formed. Then, a Pt film (not shown) is formed by a sputtering method (S110).

Next, the metal resistor layer 13 and the volatilization suppressing layer 15 are formed by a well-known photolithography process such as resist film formation, exposure treatment, development, etching, and resist film peeling (S120).

Next, an annealing process (aging process) is performed (S130).
Next, a material obtained by adding 10 parts by mass of a cellulose resin to 100 parts by mass of a total of 100 parts by mass of Pt material (powder) and 7 parts by mass of glass powder having the composition is used so that the composition of the pad part 17 is obtained. To prepare a Pt-glass paste.

Then, the Pt-glass paste is printed on the place where the pad portion 17 is formed (S140).
Next, 90 parts by mass of alumina powder and 10 parts by mass of butyral resin are added to prepare an alumina paste (not shown), and the alumina paste is covered with a predetermined portion on the base material, that is, a portion covered with the ceramic coating layer 19. Is printed (S150).

Next, a coating layer substrate (not shown), which is a base material of the ceramic coating layer 19, is arranged so as to overlap the printed area of the alumina paste (S160). The coating layer substrate is a fired ceramics substrate.

Next, as described above, the base material (thus the ceramics substrate 11) having the layers and the like arranged on the surface is fired at a firing temperature of 1000 to 1400° C. for 2 hours (S170). As a result, each paste is fired.

Next, the base material is cut into a long work size for welding described later by dicing to produce a strip-shaped intermediate substrate (not shown) (S180). This intermediate substrate is a substrate for simultaneously producing a plurality (for example, 16) of temperature sensitive elements 5.

Next, the output line 9 is arranged on each pad portion 17 of the intermediate substrate, and each output line 9 is joined to each pad portion 17 by parallel welding (resistance welding) (S190). In the following, the intermediate substrate to which the output line 9 is connected is referred to as a work substrate 31 (see FIG. 10A). In addition, in FIG. 10A, a part of the pad portion 17 and the like is omitted.

Next, 90 parts by mass of a glass material (powder) having the composition of the insulating coating part 21 and 10 parts by mass of butyral resin are added to prepare a glass paste (not shown).
Then, as will be described later in detail, using the glass paste coating system 33 (see FIG. 4), a portion of the surface of the work substrate 31 where the insulating coating portion 21 is formed (a strip-shaped coating region TR: FIG. 10B). (See), the glass paste is applied twice (S200).

Next, the glass is fired at a firing temperature of 1000 to 1400° C. for 2 hours (S210).
Next, the work substrate 31 is cut by dicing to separate the temperature sensitive elements 5. Here, one temperature sensitive element 5 is an element in the range surrounded by a broken line in FIG. 12E.

In this way, the temperature sensitive element 5 can be manufactured by the steps described above.
The temperature sensor 1 can be manufactured by assembling the temperature sensitive element 5 manufactured as described above in the same procedure as the conventional one.
[1-4. Glass paste application system]
Next, the coating system 33 used for the glass paste coating method will be described.

As shown in FIG. 4, the coating system 33 according to the present embodiment includes an electronic control device 35, a coating device 37 that is controlled by the electronic control device 35 to automatically apply a glass paste to the work substrate 31. Equipped with.

The coating device 37 supplies the work substrate 31 from the upstream side (the right side in FIG. 4) to the downstream side (the left side in FIG. 4), and at the time of the supply, the glass paste is supplied to the work substrate 31 once ( It is configured to be applied twice in total.

In this coating device 37, as a route for supplying the work substrate 31, a common route K0 from the upstream side to the substantially central portion of the coating device 37 along the X-axis direction, and a branch from the common route K0 in the vertical direction of FIG. Further, it has a first path K1 and a second path K2 extending in parallel toward the downstream side along the X-axis direction.

(1) First, the overall configuration of the coating device 37 will be briefly described.
The coating device 37 includes a pre-coating pallet standby unit 41 at a pre-coating pallet standby position, a pre-coating pallet supply unit 43 at a pre-coating pallet supply position, and a pre-coating pallet discharge unit 45 at a pre-coating pallet discharge position. Equipped with. The pre-coating pallet standby unit 41, the pre-coating pallet supplying unit 43, and the pre-coating pallet discharging unit 45 are on the upstream side of the coating device 37 and are arranged in a line along the Y-axis direction.

Further, a glass coating stage 47 is provided on the downstream side of each of these components.
On the downstream side of the glass coating stage 47, a post-coating pallet standby unit 49 at the post-coating pallet standby position, a post-coating pallet supply unit 51 at the post-coating pallet supply position, and a setter standby unit 53 at the setter standby position, And a setter supply unit 55 located at the setter supply position. The post-application pallet standby part 49, the post-application pallet supply part 51, the setter standby part 53, and the setter supply part 55 are arranged in a line along the Y-axis direction.

Further, a belt conveyor 57, a drying oven 59, a post-coating pallet discharging section 61 at a post-coating pallet discharging position, and a setter discharging section 63 at a setter discharging position are provided on the downstream side of each of these components. The post-application pallet discharging section 61 and the setter discharging section 63 are arranged in a line along the Y-axis direction.

In addition to the above respective configurations, the first robot 71, the glass coating unit 73, the second robot 75, the third robot 77, and the fourth robot 79 are arranged from the upstream side along the X-axis direction. Equipped with.

(2) Hereinafter, each of the above-mentioned configurations will be described in detail.
<Pallet standby section before coating>
As shown in FIG. 4, the pre-coating pallet standby unit 41 is a part that causes the pallet 81 on which a plurality of work substrates 31 are mounted to stand by at a predetermined position (pre-coating pallet standby position). The pallet 81 can be stacked in a plurality of stages.

As shown in FIG. 5A, the pallet 81 has a rectangular shape in a plan view as seen from the thickness direction and is a plastic member. On the surface of the pallet 81, a plurality of (for example, 20) recesses 81a for accommodating the work substrate 31 are formed. The shape of the recess 81a in plan view is a strip shape along the outer shape of the work substrate 31 (the strip shape shown by the one-dot chain line in FIG. 10A) so that one work substrate 31 can be just fitted. is there.

<Pre-coating pallet supply unit>
The pre-coating pallet supply unit 43 is a part that makes the pallet 81 on which the plurality of work substrates 31 are mounted stand by at a predetermined position (pre-coating pallet supply position). The pre-coating pallet supply unit 43 is provided on the upstream side of the glass coating stage 47 in the X-axis direction.

As will be described later, the work substrate 31 is taken out from the pallet 81 at the pre-coating pallet supply position and placed on the glass coating stage 47.
<Before application pallet discharge part>
The pre-coating pallet discharging section 45 is a part for waiting the empty pallet 81 from which all the work substrates 31 have been taken out at a predetermined position (pre-coating pallet discharging position).

The pallet 81 is transported by the transport device 83 from the pre-coating pallet standby position to the pre-coating pallet discharging position via the pre-coating pallet supplying position.
<Glass coating stage>
As shown in FIGS. 6 and 7, the glass coating stage 47 is a stage on which the work substrate 31 is placed (that is, a stage having a circular plan view when viewed from the vertical direction), and is provided above the base member 85. There is. The glass coating stage 47 has a two-layer structure including an upper portion 47a and a lower portion 47b.

The lower portion 47b is movable in the Y-axis direction, and the upper portion 47a is rotatable about the center of the circle as an axis (for example, rotatable in a range of an angle θ between 0 degrees and 180 degrees). As a configuration for moving in the axial direction, for example, a configuration such as a well-known actuator can be adopted (the same applies hereinafter). The movement in the rotation direction can be realized by, for example, a stepping motor or the like.

Further, the glass coating stage 47 is provided with a suction mechanism (not shown) for sucking air downward from the surface of the upper portion 47a. Therefore, the work substrate 31 placed on the surface of the upper portion 47a can be fixed by suction.

<Palette standby section after coating>
As shown in FIG. 4, the post-coating pallet standby unit 49 is a part that makes an empty pallet 81 on which the work substrate 31 is not mounted stand by at a predetermined position (post-coating pallet standby position). The pallet 81 can be stacked in a plurality of stages.

<Palette supply section after coating>
In the post-application pallet supply unit 51, the pallet 81 that accommodates the work substrate 31 to which the glass paste has been applied once by the glass application stage 47, that is, the first application unit T1 (see FIG. 12A) is formed by the glass paste. The pallet 81 accommodating the work substrate 31 is a part to stand by at a predetermined position (post-application pallet supply position).

The pallet 81 is transported from the post-application pallet standby position to the post-application pallet supply position by the transport device 87.
<Setter standby unit>
The setter standby part 53 is a part which makes an empty setter 89 on which the work substrate 31 is not mounted stand by at a predetermined position (setter standby position).

As shown in FIG. 5B, the setter 89 is a substantially square member made of ceramics when viewed in a plan view from the thickness direction. That is, the setter 89 is a member having higher heat resistance than the pallet 81. Therefore, in a later step, the work substrate 31 coated with the glass paste can be placed on the setter 89 and the glass can be fired.

<Setter supply unit>
The setter supply unit 55 is a setter 89 on which the work substrate 31 to which the glass paste is applied twice by the glass application stage 47 is placed, that is, a work in which the second application unit T2 (see FIG. 12C) is formed by the glass paste. The setter 89 on which the substrate 31 is placed is made to stand by at a predetermined position (setter supply position).

The setter 89 is transported from the setter standby position to the setter supply position by a transport device (not shown).
<Belt conveyor>
The belt conveyor 57 includes a pallet 81 accommodating the work substrate 31 on which the first coating portion T1 is formed, or a setter 89 on which the work substrate 31 on which the second coating portion T2 is formed is placed in a drying oven. It is a transport device that transports from the right side to the left side in FIG.

<Drying oven>
In the drying oven 59, the first coating section T1 is dried on the work substrate 31 having the first coating section T1 housed in the pallet 81. Similarly, in the drying furnace 59, the second coating section T2 is dried on the work substrate 31 having the second coating section T2 placed on the setter 89.

<Palette discharging section after coating>
The post-coating pallet discharging section 61 is a part for holding the pallet 81 discharged from the drying furnace 59 by the belt conveyor 57 at a predetermined position (post-coating pallet discharging position).

<Setter discharge part>
The setter discharge part 63 is a part that holds the setter 89 discharged from the drying furnace 59 by the belt conveyor 57 at a predetermined position (setter discharge position).

<First robot>
The first robot 71 is movable in the X-axis direction and the Y-axis direction like a known two-axis robot. The head portion 71a at the tip of the first robot 71 is provided with a nozzle (not shown) that can move up and down and can suck and hold the work substrate 31.

<Glass coating unit>
As shown in FIG. 6A, the glass coating unit 73 is configured to be movable in the X axis direction and the Z axis direction. The structure capable of moving in a fixed direction is the same as the well-known structure for moving the lower portion 47b of the glass coating stage 47.

As shown in FIG. 6B, the glass coating unit 73 is provided with a camera (for example, a CCD camera) 95 for taking an image of the upper surface of the glass coating stage 47 on one side of a base 93 fixed to the support portion 91. ..

Further, on the other side of the base 93, a coating mechanism 97 for coating the work substrate 31 with the glass paste is provided. The coating mechanism 97 is provided with a needle 97a for ejecting the glass paste on the front end side thereof, and a syringe 97b for supplying the glass paste to the needle 97a on the rear end side thereof.

<Second robot>
The second robot 75 has the same configuration as the first robot 71. That is, like a well-known two-axis robot, it can move in the X-axis direction and the Y-axis direction. The head portion 75a at the tip of the second robot 75 is provided with a nozzle (not shown) that can move up and down and can suck and hold the work substrate 31.

<Third robot>
The third robot 77 is movable in the X-axis direction and the Y-axis direction like a well-known two-axis robot. The head portion 77a at the tip of the third robot 77 is provided with a holding portion (not shown) that can move up and down and detachably holds the pallet 81 or the setter 89.

<4th robot>
The fourth robot 79 has the same configuration as the third robot 77. That is, like a well-known two-axis robot, it can move in the X-axis direction and the Y-axis direction. The head portion 79a at the tip of the fourth robot 79 is provided with a holding portion (not shown) that can move up and down and detachably holds the pallet 81 or the setter 89.

(3) Next, the electronic control unit 35 will be briefly described.
As is well known, the electronic control unit 35 is a control unit including a microcomputer and the like, and controls the operation of the coating unit 37 by the electronic control unit 35.

As shown in FIG. 8, the electronic control device 35 functionally includes a first coating control unit 35a, a second coating control unit 35b, a photographing control unit 35c, a determination unit 35d, and a post-processing unit 35e. ..
The first application controller 35a controls the operation of first applying the glass paste to the work substrate 31.

The second application control unit 35b controls the operation of applying the glass paste again to the place where the glass paste was first applied.
The imaging control unit 35c drives the camera 95 to perform control for imaging the surface of the work substrate 31 on which the output lines 9 and the like are arranged.

The determination unit 35d analyzes the image captured by the camera 95 and determines whether or not the surface of the work substrate 31 has a portion coated with the glass paste.
The post-processing unit 35e changes the transport path of the work substrate 31 thereafter, depending on whether the surface of the work substrate 31 is coated with the glass paste or not, based on the determination result.

In addition to the coating system 33 described above, the glass can be baked using a baking furnace 99 (see FIG. 4) as described later.
[1-5. Glass paste application method]
Next, a method for applying the glass paste will be described with reference to FIGS.

As shown in FIG. 4, first, the pallet 81 accommodating the work substrate 31 is arranged at the position of the pre-coating pallet standby section 41, and then is transferred to the position of the pre-coating pallet supply section 43 by the transfer device 83. It

Next, the nozzle of the first robot 71 sucks, holds and moves the work substrate 31 from the pallet 81 at the position of the pre-coating pallet supply unit 43, and the work substrate 31 is mounted on the glass coating stage 47. (S300).

Next, the work substrate 31 on the glass coating stage 47 is photographed by the camera 95 (S310).
Next, the position of the glass coating stage 47 is adjusted based on the image taken by the camera 95 (S320). That is, the glass coating stage 47 is moved in the rotational direction or the Y-axis direction so that the glass paste can be applied to the work substrate 31, that is, the work substrate 31 is at the target position.

For example, when the work substrate 31 is in the position shown in FIG. 7A, first, the upper portion 47a of the glass coating stage 47 is rotated to make the work substrate 31 parallel to the X-axis direction.
Specifically, as shown in FIG. 10A, the work substrate 31 is provided with alignment marks AR at the right end and the left end in the longitudinal direction (the left-right direction in FIG. 10A). Therefore, based on the left and right alignment marks AR, it is possible to know how much the work substrate 31 is rotated with respect to the X-axis direction from the images taken as described above, as shown in FIG. 7A. .. That is, it is possible to know how much the line segment connecting the left and right alignment marks AR is inclined with respect to the X-axis direction. Therefore, the upper portion 47a is rotated so that the line segment (and thus the work substrate 31) and the X-axis direction are parallel to each other.

After that, the work substrate 31 in which the line segment and the X-axis direction are parallel to each other is moved in the Y-axis direction as shown in FIG. 7B (for example, moved upward in FIG. 7B). That is, since the needle 97a that applies the glass paste moves along the alternate long and short dash line (that is, the application line TL) in FIG. 7, the position where the glass paste is applied on the work substrate 31 (that is, the application region TR: see FIG. 10B). The glass coating stage 47 (more specifically, the lower portion 47b) on which the work substrate 31 is placed is moved in the Y-axis direction so as to be positioned along the coating line TL.

Here, since the glass coating unit 73 (and therefore the needle 97a) is configured to move along the X-axis direction, not the Y-axis direction, the glass coating stage 47 moves in the Y-axis direction as described above. Let me do it.

The position of the needle 97a may be, for example, the center in the application region TR (the center in the vertical direction of FIG. 10B) in plan view.
Next, the work substrate 31 on the glass coating stage 47 is photographed again by the camera 95 (S330).

Next, it is determined whether the glass paste is applied to the work substrate 31 based on the image captured again (S340).
Here, the determination method will be described.

Examples of the image captured by the camera 95 include the images shown in FIG. 11A or 11C. The image in FIG. 11A shows a state in which the glass paste is not applied to the work substrate 31, and the image in FIG. 11C shows an image in which the glass paste is applied to the work substrate 31 (specifically, an image after drying). .. The glass paste is applied in a strip shape that is long in the left-right direction in FIGS. 11A and 11C so as to cover the root portions of the many output lines 9.

As is clear from FIGS. 11A and 11C, the portion where the glass paste is applied (that is, the light gray portion extending in the left-right direction in FIG. 11C) is the portion where it is not applied (that is, the large number of output lines 9 in FIG. 11A). The brightness is higher (that is, brighter) than the area in which the root parts of the are arranged in the left-right direction.

Therefore, in the area where the above-mentioned glass paste is applied, a strip-shaped image processing area GR is set as shown in FIGS. 11B and 11D, and the image processing area GR is set in accordance with the degree of brightness (level) in the image processing area GR. , It is possible to determine whether or not the glass paste is applied.

For example, as shown in FIG. 11B, when the glass paste is not applied, the degree of brightness in the image processing region GR is low, while, for example, as shown in FIG. 11D, when the glass paste is applied. In particular, the degree of brightness in the image processing area GR is high. Therefore, it is possible to determine whether or not the glass paste is applied by distinguishing the degree of brightness of the image processing area GR with a predetermined threshold value.

If it is determined that the glass paste has not been applied, the first glass paste application process is executed (S350).
Specifically, since the position of the work substrate 31 in the X-axis direction is known from the alignment mark AR, the glass coating unit 73 is driven to perform coating under the first glass paste coating condition.

That is, the height of the tip of the needle 97a is set to a predetermined height according to the first application, and the glass coating unit is supplied while the glass paste is supplied from the needle 97a at a predetermined supply rate (discharge amount per unit time). 73 (hence needle 97a) is moved from the coating start position to the coating end position along the X-axis direction.

As a result, as shown in FIG. 12A, a strip-shaped thin first coating portion T1 is formed in the coating region TR on the surface of the work substrate 31.
Next, the second robot 75 is driven to hold and move the work substrate 31 on the glass coating stage 47, that is, the work substrate 31 on which the first coating portion T1 is formed, to move the post-coating pallet supplying portion 51. It is stored in the pallet 81 located at the position (S360). It should be noted that, as a result, the work substrate 31 is thereafter transported from the common route K0 along the first route K1.

Next, the third robot 77 is driven to hold the pallet 81 at the position of the pallet supply unit 51 after coating and place it on the belt conveyor 57 (S370).
Next, the pallet 81 is conveyed into the drying oven 59 by the belt conveyor 57, and the first coating section T1 of the work substrate 31 is dried in the drying oven 59. As a result, the first drying portion Ka1 (see FIG. 12B) obtained by drying the first coating portion T1 is formed on the work substrate 31 (S380).

Next, the fourth robot 79 is driven to hold the pallet 81 on the belt conveyor 57 discharged from the drying furnace 59, and conveys it to the pallet discharging section 61 after coating.
After that, the pallet 81 is transferred to the pre-application pallet standby part 41 on the post-application pallet discharging part 61, but it may be automatically transferred by a device such as a robot.

On the other hand, as a result of determining whether or not the glass paste is applied to the work substrate 31 based on the image captured again, if it is determined that the glass paste is applied, the second glass paste is applied. Execute the coating process (S400)
That is, the glass coating unit 73 is driven again to perform the second glass paste coating so as to cover the entire surface of the first drying section Ka1 under the second glass paste coating conditions. Specifically, the height of the tip of the needle 97a is set to a predetermined height according to the second application. In the second time, the tip of the needle 97a is made higher than in the first time. Other conditions are the same as those of the first time, but may be changed appropriately.

As a result, as shown in FIG. 12C, a strip-shaped second coating portion T2 having a thickness larger than that of the first coating portion T1 is formed in the coating region TR on the surface of the work substrate 31. That is, the second coating section T2 is formed on the surface of the first drying section Ka1.

Next, the second robot 75 is driven to hold and move the work substrate 31 on the glass coating stage 47, that is, the work substrate 31 on which the second coating unit T2 is formed, to the position of the setter supply unit 55. It is placed on a setter 89 (S410). In addition, as a result, the work substrate 31 is thereafter transported from the common route K0 along the second route K2.

Next, the third robot 77 is driven to hold the setter 89 at the position of the setter supply unit 55 and place it on the belt conveyor 57 (S420).
Next, the setter 89 is conveyed into the drying furnace 59 by the belt conveyor 57, and the first coating part T2 of the work substrate 31 is dried in the drying furnace 59. As a result, the second drying portion Ka2 (see FIG. 12D) obtained by drying the second coating portion T2 is formed on the work substrate 31 (S430).

As a result, the application section T made of the material of the glass paste in which the second application section T2 (after drying) is laminated on the first application section T1 (after drying), more specifically, the first drying section Ka1. A drying section Ka having the second drying section Ka2 laminated thereon is obtained (see FIG. 12D).

Next, the fourth robot 79 is driven to grip the setter 89 on the belt conveyor 57 discharged from the drying furnace 59 and convey it to the setter discharging unit 63.
In addition, after that, the setter 89 on the setter discharge part 63 is conveyed to the firing furnace 99 by the operator, and the glass is fired. That is, the glass in the first drying section Ka1 and the second drying section Ka2 is fired.

By this firing, a strip-shaped glass layer GS (see FIG. 12E) is formed on the surface of the work substrate 31.
After that, as described above, the work substrate 31 is cut to complete the individual temperature sensitive elements 5 as surrounded by the broken line in FIG. 12E.
[1-6. effect]
(1) In the present embodiment, an image of the surface of the work substrate 31 (that is, the work substrate 31 to which the output lines 9 are joined) photographed by the camera 95 is analyzed, and the application region TR (details) Determines whether or not there is a portion to which the glass paste is applied in the image processing area GR). Then, when the glass paste is applied to the application region TR, the subsequent processing contents for the work substrate 31 are changed.

Specifically, when the glass paste is applied to the application region TR, the first application is performed on the work substrate 31 according to the first application condition for applying the glass paste (first application step). ). On the other hand, when the glass paste is applied to the application region TR, the second application is performed according to the second application condition for applying the glass paste (second application step).

As a result, a sufficient amount of glass paste can be surely applied so as to cover the pad portion 17 and the output line 9 with no space therebetween. That is, on the surface of the work substrate 31, a coating section T having a two-layer structure made of a glass material, more specifically, a drying section Ka having a two-layer structure in which a second drying section Ka2 is laminated on the first drying section Ka1. Can be formed.

Therefore, by baking the work substrate 31 on which the coating portion T (specifically, the drying portion Ka) is formed, the insulating coating portion 21 having preferable characteristics can be formed. That is, by covering the pad portion 17 and the output line 9 with the insulating coating portion 21, it is possible to sufficiently secure the bonding strength and the electric insulation of the output line 9.

(2) In the present embodiment, the height of the needle 97a of the glass coating unit 73 is changed depending on whether the glass paste is applied to the work substrate 31 or not.
Specifically, when the glass paste is not applied to the work substrate 31, the height of the needle 97a is set lower than that in the second applying step. Thereby, the supply amount of the glass paste is reduced, so that the glass paste can be applied in the first application step so that the thickness of the glass paste is thinner than that in the second application step. As a result, the glass paste can be filled around the output line 9 and the like without any gap.

On the other hand, when the glass paste is applied to the work substrate 31, the height of the needle 97a is made higher than that of the first application. Thereby, the supply amount of the glass paste is increased, and thus the glass paste can be applied thicker than in the first application step. As a result, the glass paste can be sufficiently supplied to the periphery of the output line 9 and the like, so that the bonding strength of the output line 9 and the like and the electrical insulation can be enhanced.

(3) In the present embodiment, the work substrate 31 that has been subjected to the first coating step is transported to the first position on the first path K1. That is, the work substrate 31 is accommodated in the pallet 81, and the pallet 81 is placed on the position for the pallet 81 on the belt conveyor 57 and conveyed.

Further, the work substrate 31 that has been subjected to the second coating step is transported to the second position on the second path K2. That is, the work substrate 31 is placed on the setter 89, and the setter 89 is placed on the position of the setter 89 on the belt conveyor 57 and conveyed.

In this way, by transporting the work substrates 31 having different coating processes to different positions, it is possible to easily and without fail perform necessary processing (processing such as coating and drying) at different positions.
[1-7. Correspondence of wording]
The ceramic substrate 11, the pad portion 17, the output line 9, the work substrate 31, the coating portion T, the camera 95, the first path K1, the second path K2, the pallet 81, the setter 89, and the coating system 33 of the present embodiment, The first coating control unit 35a, the second coating control unit 35b, the imaging control unit 35c, the determination unit 35d, the post-processing unit 35e, the drying furnace 59, the baking furnace 99, and the insulating coating unit 21 are each the insulating substrate of the present disclosure. , Wiring layer, conductive wire, wiring board, coating section, camera, first path, second path, first transport member, second transport member, wiring board manufacturing apparatus, first coating control section It corresponds to an example of the second coating control unit, the imaging control unit, the determination unit, the post-processing unit, the drying unit, the baking unit, and the insulating coating unit.
[2. Other Embodiments]
Although one embodiment of the present disclosure has been described above, the present disclosure is not limited to the above embodiment, and various modifications can be implemented.

(1) For example, the material of the temperature sensitive element (for example, the material of glass), the shape of the temperature sensitive element, the shape of the work substrate, and the like are not limited to those in the above embodiment.
(2) Further, for example, the configurations and operations of the coating device, the coating unit, the glass coating stage, etc. are not limited to those in the above embodiment.

(3) Furthermore, the function of one component in the above-described embodiment may be shared by a plurality of components, or the function of a plurality of components may be performed by one component. Moreover, you may omit a part of structure of the said embodiment. Further, at least a part of the configuration of the above-described embodiment may be added to or replaced with the configuration of each of the other above-described embodiments. It should be noted that all aspects included in the technical idea specified by the wording recited in the claims are embodiments of the present disclosure.

DESCRIPTION OF SYMBOLS 1... Temperature sensor 9... Output line 11... Ceramic substrate 17... Pad part 21... Insulation coating part 31... Work substrate 33... Coating system 35... Electronic control device 35a... 1st coating control part 35b... 2nd coating control part 35c... Imaging control unit 35d... Judgment unit 35e... Post-processing unit 37... Coating device 59... Drying furnace 81... Pallet 89... Setter 95... Camera 99... Baking furnace T... Coating unit K1... First path K2... Second path

Claims (8)

An insulating paste is applied to the surface side of the insulating substrate so as to cover the wiring layer and the conductive lines, and a coating portion is formed on the wiring substrate in which the conductive lines are joined to the wiring layer formed on the surface of the insulating substrate. In the method of manufacturing a wiring board,
A first applying step of first applying the insulating paste to the front surface side of the insulating substrate;
A second applying step of applying the insulating paste again to the place where the insulating paste was first applied;
A photographing step of photographing the surface of the wiring board provided with the wiring layer and the conductive wire using a camera;
A determination step of analyzing the captured image to determine whether or not the coating portion is present on the surface of the wiring board;
Have
Based on the determination result, the content of the process performed on the wiring board is changed depending on whether the coating section is provided on the surface of the wiring board or not.
Wiring board manufacturing method. Changing the coating conditions for coating the insulating paste depending on whether the coating portion is provided on the surface of the wiring board or not.
The method for manufacturing a wiring board according to claim 1. The wiring board that has been subjected to the first coating step is conveyed to a first position through a first path,
The wiring board that has been subjected to the second coating step is conveyed to a second position through a second path,
The method for manufacturing a wiring board according to claim 1. When the wiring board is transported through the first path, the wiring board is placed on the first transport member, transported through the first path, and the insulating paste is dried. A first drying step,
When the wiring board is transported through the second route, the wiring board is placed on the second transporting member for firing, which has higher heat resistance than the first transporting member, A second drying step of transporting the insulating paste by the route of
And a firing step of firing the insulating paste to form an insulating coating portion after the second drying step.
The method for manufacturing a wiring board according to claim 3. For a wiring board in which a conductive wire is bonded to a wiring layer formed on the surface of the insulating substrate, drive an applicator to apply an insulating paste on the surface side of the insulating substrate so as to cover the wiring layer and the conductive wire. In a wiring board manufacturing apparatus for coating to form a coating portion,
A first coating control unit that controls an operation of first coating the insulating paste on the front surface side of the insulating substrate;
A second coating control unit that controls the operation of coating the insulating paste again at the location where the insulating paste was first coated;
An image capturing control unit that captures an image of the surface of the wiring board provided with the wiring layer and the conductive lines using a camera;
A determination unit that analyzes the captured image and determines whether or not the coating unit is present on the surface of the wiring board;
Based on the determination result, a post-processing unit that changes the content of post-processing performed on the wiring substrate depending on whether the coating unit is provided on the surface of the wiring substrate or not.
An apparatus for manufacturing a wiring board, comprising: Changing the coating conditions for coating the insulating paste depending on whether the coating portion is provided on the surface of the wiring board or not.
The wiring board manufacturing apparatus according to claim 5. The wiring board after the operation of the first coating control unit is conveyed to a first position on a first path,
The wiring board after the operation of the second coating controller is conveyed to a second position through a second path,
The wiring board manufacturing apparatus according to claim 5. A drying unit for drying the insulating paste, and a baking unit for baking the dried insulating paste,
When the wiring board is transferred through the first path, the wiring board is placed on a first transfer member and transferred to the drying section through the first path to remove the insulation. Dry the paste,
When the wiring board is transported through the second route, the wiring board is placed on a second transporting member for firing which has higher heat resistance than the first transporting member, and It is conveyed to the drying section through the route 2 to dry the insulating paste,
In the firing unit, the insulating paste after drying on the wiring substrate on the second transport member is fired to form an insulating coating unit.
The wiring board manufacturing apparatus according to claim 7.