JP4734134B2 - 半田付け用フラックス及び半田付け用フラックスを用いた実装構造を有する半導体装置 - Google Patents

半田付け用フラックス及び半田付け用フラックスを用いた実装構造を有する半導体装置 Download PDF

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Publication number
JP4734134B2
JP4734134B2 JP2006031316A JP2006031316A JP4734134B2 JP 4734134 B2 JP4734134 B2 JP 4734134B2 JP 2006031316 A JP2006031316 A JP 2006031316A JP 2006031316 A JP2006031316 A JP 2006031316A JP 4734134 B2 JP4734134 B2 JP 4734134B2
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Japan
Prior art keywords
electrode
copper
zinc
soldering
solder
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Japanese (ja)
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JP2007209999A5 (enrdf_load_stackoverflow
JP2007209999A (ja
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誠樹 作山
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Fujitsu Ltd
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Fujitsu Ltd
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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2006031316A 2006-02-08 2006-02-08 半田付け用フラックス及び半田付け用フラックスを用いた実装構造を有する半導体装置 Expired - Fee Related JP4734134B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006031316A JP4734134B2 (ja) 2006-02-08 2006-02-08 半田付け用フラックス及び半田付け用フラックスを用いた実装構造を有する半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006031316A JP4734134B2 (ja) 2006-02-08 2006-02-08 半田付け用フラックス及び半田付け用フラックスを用いた実装構造を有する半導体装置

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JP2007209999A JP2007209999A (ja) 2007-08-23
JP2007209999A5 JP2007209999A5 (enrdf_load_stackoverflow) 2008-12-11
JP4734134B2 true JP4734134B2 (ja) 2011-07-27

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JP2006031316A Expired - Fee Related JP4734134B2 (ja) 2006-02-08 2006-02-08 半田付け用フラックス及び半田付け用フラックスを用いた実装構造を有する半導体装置

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JP (1) JP4734134B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4389112B2 (ja) * 2008-01-17 2009-12-24 ホライゾン技術研究所株式会社 半導体装置およびその製造方法
JP5083000B2 (ja) * 2008-04-07 2012-11-28 富士通株式会社 電子部品装置及び電子部品装置の製造方法
JP6281468B2 (ja) * 2014-10-30 2018-02-21 トヨタ自動車株式会社 半導体装置とその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6072696A (ja) * 1983-09-30 1985-04-24 Toshiba Corp 軟ろうフラックス
JPS6160266A (ja) * 1984-08-31 1986-03-27 Kemikooto:Kk フレオン洗浄性の良いはんだ付け法
JP4231157B2 (ja) * 1998-07-02 2009-02-25 パナソニック株式会社 はんだ粉末とその製造方法、およびソルダーペースト
JP2000252380A (ja) * 1999-02-25 2000-09-14 Mitsui Chemicals Inc はんだ接続用パッドおよびそのはんだ接続用パッドを用いた半導体搭載用基板
JP2001001180A (ja) * 1999-06-21 2001-01-09 Tanaka Electronics Ind Co Ltd 半田材料及びそれを用いた電子部品
JP2004306092A (ja) * 2003-04-08 2004-11-04 Tamura Kaken Co Ltd 回路基板はんだ付用フラックス及びソルダーペースト

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JP2007209999A (ja) 2007-08-23

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