JP4730275B2 - 薄膜トランジスタおよび薄膜トランジスタの製造方法 - Google Patents
薄膜トランジスタおよび薄膜トランジスタの製造方法 Download PDFInfo
- Publication number
- JP4730275B2 JP4730275B2 JP2006272643A JP2006272643A JP4730275B2 JP 4730275 B2 JP4730275 B2 JP 4730275B2 JP 2006272643 A JP2006272643 A JP 2006272643A JP 2006272643 A JP2006272643 A JP 2006272643A JP 4730275 B2 JP4730275 B2 JP 4730275B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- layer
- forming
- thin film
- film transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 36
- 239000010409 thin film Substances 0.000 title claims description 15
- 238000000034 method Methods 0.000 claims description 74
- 239000012212 insulator Substances 0.000 claims description 30
- 239000004065 semiconductor Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 23
- 238000007641 inkjet printing Methods 0.000 claims description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 14
- 238000007639 printing Methods 0.000 claims description 12
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 claims description 6
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229940005642 polystyrene sulfonic acid Drugs 0.000 claims description 5
- 239000000725 suspension Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 33
- 239000010408 film Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- 229910052709 silver Inorganic materials 0.000 description 11
- 239000004332 silver Substances 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 8
- 238000000206 photolithography Methods 0.000 description 7
- 238000011161 development Methods 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 5
- -1 polymethylsiloxane Polymers 0.000 description 5
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000002508 contact lithography Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 150000003384 small molecules Chemical class 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- DZUNDTRLGXGTGU-UHFFFAOYSA-N 2-(3-dodecylthiophen-2-yl)-5-[5-(3-dodecylthiophen-2-yl)thiophen-2-yl]thiophene Chemical compound C1=CSC(C=2SC(=CC=2)C=2SC(=CC=2)C2=C(C=CS2)CCCCCCCCCCCC)=C1CCCCCCCCCCCC DZUNDTRLGXGTGU-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007687 exposure technique Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002070 nanowire Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/481—Insulated gate field-effect transistors [IGFETs] characterised by the gate conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823487—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of vertical transistor structures, i.e. with channel vertical to the substrate surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7827—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78642—Vertical transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having a potential-jump barrier or a surface barrier
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
Description
本発明の一態様によれば、市販の電子デバイスおよび回路を製造するための方法を提供する。本発明に係る方法は、印刷とセルフアライン式写真露光またはエッチングとを組み合わせて、両技法の利点を活用する。本発明に係る方法において、第2の電極は、印刷技法に起因して解像度が比較的低くなっているが、このように低解像度であることが結果として得られる薄膜トランジスタに対して及ぼす悪影響は、続けてこの第2の電極をマスクとして使用することによって最小限に押さえられる。その結果、本発明によって、ロール・トゥ・ロール工程を用いて、以前可能であったよりも大規模に高解像度エレクトロニクスを製造することができるようになる。
Claims (6)
- 薄膜トランジスタの製造方法であって、
基板の上に絶縁体を含む第2の層を形成する工程と、
前記第2の層の上に透明な第1の電極を形成する工程と、
前記第1の電極の上に絶縁体を含む第1の層を形成する工程と、
前記第1の層の上にインクジェット印刷技法を用いて、前記第1の電極と平面視で重なり偏心する第2の電極を形成する工程と、
前記第2の電極をマスクとして使用することにより前記第1の層の一部、前記第1の電極の一部及び前記第2の層の一部を除去する工程と、
半導体層を、前記基板の上、前記第2の層の端面の一部、前記第1の電極の端面の一部、前記第1の層の端面の一部、及び前記第2の電極の上に形成する工程と、
誘電層を前記半導体層の上に形成する工程と、
ゲート電極を、前記誘電層の上から前記第1の電極の端面の一部、前記第2の層の端面の一部、及び前記第2の電極の端面の一部とを覆うように形成する工程とを含み、
前記第1の電極の一部は、前記第2の電極側から平面視して、前記第2の電極からはみ出していることを特徴とする薄膜トランジスタの製造方法。 - 前記ゲート電極はインクジェット印刷によって形成されることを特徴とする請求項1に記載の薄膜トランジスタの製造方法。
- 前記ゲート電極は、ポリ(3,4エチレンジオキシチオフェン)−ポリスチレンスルホン酸(PEDOT−PSS)または金属コロイド懸濁液を印刷することによって形成されることを特徴とする請求項2に記載の薄膜トランジスタの製造方法。
- 前記第2の電極は、銀コロイドインクまたは金コロイドインクをインクジェット印刷することによって形成されることを特徴とする請求項1乃至3のいずれか1項に記載の薄膜トランジスタの製造方法。
- 前記第1の層の膜厚は1μm以下であることを特徴とする請求項1乃至4のいずれか1項に記載の薄膜トランジスタの製造方法。
- 請求項1乃至5のいずれか一項に記載された方法で製造された薄膜トランジスタ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0520350.0 | 2005-10-06 | ||
GB0520350A GB2432714A (en) | 2005-10-06 | 2005-10-06 | Thin film transistor and method for fabricating an electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007103947A JP2007103947A (ja) | 2007-04-19 |
JP4730275B2 true JP4730275B2 (ja) | 2011-07-20 |
Family
ID=35429932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006272643A Expired - Fee Related JP4730275B2 (ja) | 2005-10-06 | 2006-10-04 | 薄膜トランジスタおよび薄膜トランジスタの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20070082438A1 (ja) |
JP (1) | JP4730275B2 (ja) |
GB (1) | GB2432714A (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7459400B2 (en) * | 2005-07-18 | 2008-12-02 | Palo Alto Research Center Incorporated | Patterned structures fabricated by printing mask over lift-off pattern |
US20070254402A1 (en) * | 2006-04-27 | 2007-11-01 | Robert Rotzoll | Structure and fabrication of self-aligned high-performance organic fets |
US20090004368A1 (en) * | 2007-06-29 | 2009-01-01 | Weyerhaeuser Co. | Systems and methods for curing a deposited layer on a substrate |
US8463116B2 (en) * | 2008-07-01 | 2013-06-11 | Tap Development Limited Liability Company | Systems for curing deposited material using feedback control |
EP2924754B1 (en) * | 2014-03-28 | 2021-10-20 | Novaled GmbH | Method for producing an organic transistor and organic transistor |
JP6448311B2 (ja) * | 2014-10-30 | 2019-01-09 | 株式会社ジャパンディスプレイ | 半導体装置 |
GB2552488A (en) | 2016-07-25 | 2018-01-31 | Saralon Gmbh | Field-effect transistor and method for the production thereof |
KR20200115753A (ko) | 2019-03-25 | 2020-10-08 | 삼성디스플레이 주식회사 | 박막 트랜지스터 기판, 표시 장치 및 이의 제조 방법 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003347552A (ja) * | 2002-05-29 | 2003-12-05 | Konica Minolta Holdings Inc | 有機トランジスタ及びその製造方法 |
JP2004304182A (ja) * | 2003-03-19 | 2004-10-28 | Semiconductor Energy Lab Co Ltd | 薄膜トランジスタ及びその作製方法 |
JP2005159329A (ja) * | 2003-10-28 | 2005-06-16 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
JP2005190992A (ja) * | 2003-11-14 | 2005-07-14 | Semiconductor Energy Lab Co Ltd | 表示装置及びその作製方法 |
JP2005202194A (ja) * | 2004-01-16 | 2005-07-28 | Seiko Epson Corp | 電気光学装置用基板、電気光学装置用基板の製造方法、電気光学装置、及び電子機器 |
WO2005091376A1 (ja) * | 2004-03-17 | 2005-09-29 | Japan Science And Technology Agency | 有機縦形トランジスタおよびその製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2587124B2 (ja) * | 1990-08-09 | 1997-03-05 | 株式会社ジーティシー | 薄膜トランジスタ回路の製造方法 |
US5259799A (en) * | 1992-03-02 | 1993-11-09 | Micron Technology, Inc. | Method to form self-aligned gate structures and focus rings |
KR970006260B1 (ko) * | 1994-01-07 | 1997-04-25 | 금성일렉트론 주식회사 | 박막트랜지스터 제조방법 |
KR100343222B1 (ko) * | 1995-01-28 | 2002-11-23 | 삼성에스디아이 주식회사 | 전계방출표시소자의제조방법 |
US6492232B1 (en) * | 1998-06-15 | 2002-12-10 | Motorola, Inc. | Method of manufacturing vertical semiconductor device |
KR20000027776A (ko) * | 1998-10-29 | 2000-05-15 | 김영환 | 액정 표시 장치의 제조방법 |
KR100401130B1 (ko) * | 2001-03-28 | 2003-10-10 | 한국전자통신연구원 | 수직형 채널을 가지는 초미세 mos 트랜지스터 제조방법 |
GB0111424D0 (en) * | 2001-05-10 | 2001-07-04 | Koninkl Philips Electronics Nv | Electronic devices comprising thin film transistors |
US6664576B1 (en) * | 2002-09-25 | 2003-12-16 | International Business Machines Corporation | Polymer thin-film transistor with contact etch stops |
ZA200506095B (en) * | 2003-01-30 | 2006-10-25 | Univ Cape Town | A thin film semiconductor device and method of manufacturing a thin film semiconductor device |
-
2005
- 2005-10-06 GB GB0520350A patent/GB2432714A/en not_active Withdrawn
-
2006
- 2006-10-02 US US11/540,729 patent/US20070082438A1/en not_active Abandoned
- 2006-10-04 JP JP2006272643A patent/JP4730275B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003347552A (ja) * | 2002-05-29 | 2003-12-05 | Konica Minolta Holdings Inc | 有機トランジスタ及びその製造方法 |
JP2004304182A (ja) * | 2003-03-19 | 2004-10-28 | Semiconductor Energy Lab Co Ltd | 薄膜トランジスタ及びその作製方法 |
JP2005159329A (ja) * | 2003-10-28 | 2005-06-16 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
JP2005190992A (ja) * | 2003-11-14 | 2005-07-14 | Semiconductor Energy Lab Co Ltd | 表示装置及びその作製方法 |
JP2005202194A (ja) * | 2004-01-16 | 2005-07-28 | Seiko Epson Corp | 電気光学装置用基板、電気光学装置用基板の製造方法、電気光学装置、及び電子機器 |
WO2005091376A1 (ja) * | 2004-03-17 | 2005-09-29 | Japan Science And Technology Agency | 有機縦形トランジスタおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
GB0520350D0 (en) | 2005-11-16 |
GB2432714A (en) | 2007-05-30 |
US20070082438A1 (en) | 2007-04-12 |
JP2007103947A (ja) | 2007-04-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4730275B2 (ja) | 薄膜トランジスタおよび薄膜トランジスタの製造方法 | |
US7271098B2 (en) | Method of fabricating a desired pattern of electronically functional material | |
US8592820B2 (en) | Layers and patterns of nanowire or carbon nanotube using chemical self assembly and fabricating method in liquid crystal display device thereby | |
JP2010525381A (ja) | 基板上のパターン形成方法およびそれによって形成された電子素子 | |
CN101154712B (zh) | 有机半导体元件及其制造方法、有机晶体管阵列及显示器 | |
US20150147854A1 (en) | Method of fabricating electronic circuit | |
JP2009200315A (ja) | 半導体装置の製造方法 | |
US20170236706A1 (en) | Orthogonal patterning method | |
US8413576B2 (en) | Method of fabricating a structure | |
JP6887806B2 (ja) | 薄膜トランジスタおよびその製造方法 | |
JP2008258608A (ja) | 両極性トランジスタ設計 | |
JP4984416B2 (ja) | 薄膜トランジスタの製造方法 | |
WO2014015627A1 (zh) | 有机薄膜晶体管阵列基板及其制备方法和显示装置 | |
US20080029833A1 (en) | Transistor, an electronic circuit and an electronic device | |
JP2004349292A (ja) | 電界効果型トランジスタ及びその製造方法 | |
KR101050588B1 (ko) | 유기절연막 패턴형성 방법 | |
KR20140047133A (ko) | 탑 게이트 트랜지스터 형성 방법 | |
JP5332145B2 (ja) | 積層構造体、電子素子、電子素子アレイ及び表示装置 | |
US20160141530A1 (en) | Semiconductor element and semiconductor element manufacturing method | |
US8153512B2 (en) | Patterning techniques | |
US20090117686A1 (en) | Method of fabricating organic semiconductor device | |
TWI469224B (zh) | 有機薄膜電晶體及其製造方法 | |
US20060024859A1 (en) | Reverse printing | |
JP2008288239A (ja) | パターニング方法、およびtftの製造方法 | |
US7737489B2 (en) | Printed electronic device and transistor device and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20070406 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090924 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091006 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091204 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100720 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100913 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110322 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110404 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140428 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |