JP4727249B2 - リペア用具、及び電子部品のリペア装置 - Google Patents

リペア用具、及び電子部品のリペア装置 Download PDF

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Publication number
JP4727249B2
JP4727249B2 JP2005037133A JP2005037133A JP4727249B2 JP 4727249 B2 JP4727249 B2 JP 4727249B2 JP 2005037133 A JP2005037133 A JP 2005037133A JP 2005037133 A JP2005037133 A JP 2005037133A JP 4727249 B2 JP4727249 B2 JP 4727249B2
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Japan
Prior art keywords
side wall
hot air
wall surface
main body
cylindrical main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005037133A
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English (en)
Japanese (ja)
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JP2006228771A5 (https=
JP2006228771A (ja
Inventor
浩史 前川
嗣久 石井
高章 佐伯
聡治 渡辺
朋宏 武藤
譲司 成井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Ten Ltd
Original Assignee
Denso Ten Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Denso Ten Ltd filed Critical Denso Ten Ltd
Priority to JP2005037133A priority Critical patent/JP4727249B2/ja
Publication of JP2006228771A publication Critical patent/JP2006228771A/ja
Publication of JP2006228771A5 publication Critical patent/JP2006228771A5/ja
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Publication of JP4727249B2 publication Critical patent/JP4727249B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2005037133A 2005-02-15 2005-02-15 リペア用具、及び電子部品のリペア装置 Expired - Fee Related JP4727249B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005037133A JP4727249B2 (ja) 2005-02-15 2005-02-15 リペア用具、及び電子部品のリペア装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005037133A JP4727249B2 (ja) 2005-02-15 2005-02-15 リペア用具、及び電子部品のリペア装置

Publications (3)

Publication Number Publication Date
JP2006228771A JP2006228771A (ja) 2006-08-31
JP2006228771A5 JP2006228771A5 (https=) 2008-04-03
JP4727249B2 true JP4727249B2 (ja) 2011-07-20

Family

ID=36989906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005037133A Expired - Fee Related JP4727249B2 (ja) 2005-02-15 2005-02-15 リペア用具、及び電子部品のリペア装置

Country Status (1)

Country Link
JP (1) JP4727249B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100847109B1 (ko) 2006-11-14 2008-07-18 이종애 비지에이 패키지의 리페어링 장치
WO2008120299A1 (ja) * 2007-03-28 2008-10-09 Fujitsu Limited 電子装置の製造装置及び製造方法
WO2012127536A1 (ja) * 2011-03-24 2012-09-27 富士通テレコムネットワークス株式会社 はんだ付け部品取り外し方法および装置
JP6179287B2 (ja) * 2013-09-09 2017-08-16 富士通株式会社 半導体装置の製造方法
US10520219B2 (en) 2016-05-18 2019-12-31 Hakko Corporation Hot air nozzle and its production method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002204062A (ja) * 2000-12-27 2002-07-19 Nec Corp Ｂｇａはんだ付け装置
JP2002353610A (ja) * 2001-05-22 2002-12-06 Nec Saitama Ltd 半導体装置のリペア方法およびリペア装置

Also Published As

Publication number Publication date
JP2006228771A (ja) 2006-08-31

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