JP4718466B2 - 高効率蛍光体 - Google Patents
高効率蛍光体 Download PDFInfo
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- JP4718466B2 JP4718466B2 JP2006527272A JP2006527272A JP4718466B2 JP 4718466 B2 JP4718466 B2 JP 4718466B2 JP 2006527272 A JP2006527272 A JP 2006527272A JP 2006527272 A JP2006527272 A JP 2006527272A JP 4718466 B2 JP4718466 B2 JP 4718466B2
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- phosphor
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- oxynitridosilicate
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims description 51
- 230000009466 transformation Effects 0.000 claims description 32
- 238000001228 spectrum Methods 0.000 claims description 19
- 230000005855 radiation Effects 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 10
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 9
- 230000005284 excitation Effects 0.000 claims description 9
- 229910052693 Europium Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000002243 precursor Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims description 3
- 230000009257 reactivity Effects 0.000 claims description 3
- 150000001768 cations Chemical class 0.000 claims description 2
- 230000004048 modification Effects 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- 241000254158 Lampyridae Species 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000012071 phase Substances 0.000 description 31
- 239000011575 calcium Substances 0.000 description 14
- 229910052791 calcium Inorganic materials 0.000 description 12
- 238000002441 X-ray diffraction Methods 0.000 description 8
- 238000000295 emission spectrum Methods 0.000 description 8
- 206010001497 Agitation Diseases 0.000 description 6
- 239000007858 starting material Substances 0.000 description 5
- 238000000844 transformation Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910004122 SrSi Inorganic materials 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- GTDCAOYDHVNFCP-UHFFFAOYSA-N chloro(trihydroxy)silane Chemical class O[Si](O)(O)Cl GTDCAOYDHVNFCP-UHFFFAOYSA-N 0.000 description 1
- 230000003081 coactivator Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002964 excitative effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000008241 heterogeneous mixture Substances 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- -1 nitride silicate Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000000985 reflectance spectrum Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000005049 silicon tetrachloride Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/55—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing beryllium, magnesium, alkali metals or alkaline earth metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Luminescent Compositions (AREA)
Description
オキシニトリドシリケート(Oxinitridosilikat)のタイプの蛍光体は、短縮式MSiONのもとで自体公知であり、これは例えば、"On new rare-earth doped M-Si-AI-O-N materials"、J. van Krevel著、TU Eindhoven 2000, ISBN 90-386-2711-4,第6章に記載されている。これは、この場合Tbでドープされている。発光は365nm又は254nmによる励起で達成される。
本発明の課題は、できる限り効率が高い請求項1の上位概念に記載の蛍光体を提供することであった。更なる課題は、前記蛍光体を有する光源並びにこの有効な蛍光体の製造方法を提供することであった。
次に、2つの実施例に基づき本発明について詳しく説明する。
図1は第1のオキシニトリドシリケートの発光スペクトルを表す。
本発明による蛍光体についての具体的な例を図1に示した。これはHT変態の形の蛍光体SrSi2N2O2:(5%Eu2+)の発光であり、この場合Eu割合はSrが配置される格子位置の5mol%である。この発光極大は540nmにあり、平均波長(主波長)は560nmにある。この色度座標はx=0.357;y=0.605である。励起は460nmで行った。FWHMは76nmである。
Claims (17)
- カチオンMを有し、かつ基本式M(1−c)Si2O2N2:Dc(式中、Mは主成分としてSrを有し、その際、Dはユーロピウムを有する二価のドーピングである)で示されるオキシニトリドシリケートの種類からなる蛍光体において、MについてSr単独であるか又はM=Sr(1−x−y)BayCax、x+y<0.5が使用され、その際、前記オキシニトリドシリケートは完全に又は70%より多くが、変態HTからなり、かつW及びCoの不純物の割合が前駆体物質に対して50ppmを下回ることを特徴とする、蛍光体。
- Euの割合がMの0.1〜20mol%であることを特徴とする、請求項1記載の蛍光体。
- Mの30mol%までがBa及び/又はCaに置き換えられていることを特徴とする、請求項1記載の蛍光体。
- Mの30mol%までがLi及び/又はLa及び/又はZnに置き換えられていることを特徴とする、請求項1記載の蛍光体。
- 式MSi2O2N2のオキシニトリドシリケート中の基SiNの30mol%までが基AlOに置き換えられていることを特徴とする、請求項1記載の蛍光体。
- Euの30mol%までがMnに置き換えられていることを特徴とする、請求項1記載の蛍光体。
- オキシニトリドシリケートは85%より多くがHT変態からなることを特徴とする、請求項1記載の蛍光体。
- オキシニトリドシリケートは主にHT変態からなり、異質相の割合は15%より低いことを特徴とする、請求項1記載の蛍光体。
- 50〜480nmの間でピーク発光を有する領域から由来する光励起での蛍光体の発光の半値幅(FWHM)は、90nmより低いことを特徴とする、請求項1記載の蛍光体。
- XRDスペクトルにおいて、25〜32°の範囲内のXRD偏向角2θで全ての異質相の強度が、31.8°でHT変態に特徴的な主ピークの強度の1/3より小さいとする規定に従って、異質相の割合が最少化されていることを特徴とする、請求項1記載の蛍光体。
- XRDスペクトルにおいて、28.2°でのXRDスペクトルにおけるNT変態に特徴的なピークが、25〜27°でXRDスペクトルにあるHT変態の3つの反射グループからなる最も高い強度を有するピークと比較して、1:1より低い強度を有するとする規定に従って、NT相の割合が最少化されていることを特徴とする、請求項1記載の蛍光体。
- 波長領域50〜480nmで光学スペクトル領域の短波長領域で放射線を発光する一次光源を有し、前記放射線は、請求項1から11までのいずれか1項記載の少なくとも1種の第1の蛍光体により完全に又は部分的に、より長波長の二次放射線に変換される光源。
- 一次放射線源としてInGaN系の発光ダイオードを使用することを特徴とする、請求項12記載の光源。
- さらに、一次放射線の一部を他の第2の蛍光体により、より長波長の放射線に変換し、両方の、つまり第1と第2の蛍光体は適切に選択されかつ混色されて、白色光を製造することを特徴とする、請求項12記載の光源。
- 一次放射線の一部を、さらに第3の蛍光体により、より長波長の放射線に変換し、前記第3の蛍光体は、赤色領域で発光することを特徴とする、請求項12記載の光源。
- 次の方法工程:
a) 出発生成物のSiO2、Si3N4、残りMCO3、並びにEu前駆体を、相違が理想的な化学量論的バッチの10%を上回らない化学量論的割合で準備しかつ前記生成物を混合する工程;
b) 前記混合物を1300〜1600℃で焼成する工程
を有し、かつ出発生成物が、W及びCoの不純物に関して、50ppmよりも低い高純度を有することを特徴とする、請求項1記載の蛍光体の製造方法。 - 出発生成物はBET表面積少なくとも6m2/gの高い反応性を有することを特徴とする、請求項16記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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DE10344330 | 2003-09-24 | ||
DE10344330.4 | 2003-09-24 | ||
PCT/DE2004/002137 WO2005030905A1 (de) | 2003-09-24 | 2004-09-24 | Hocheffizienter leuchtstoff |
Publications (2)
Publication Number | Publication Date |
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JP2007506815A JP2007506815A (ja) | 2007-03-22 |
JP4718466B2 true JP4718466B2 (ja) | 2011-07-06 |
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JP2006527272A Expired - Lifetime JP4718466B2 (ja) | 2003-09-24 | 2004-09-24 | 高効率蛍光体 |
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Country | Link |
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US (1) | US7550095B2 (ja) |
EP (1) | EP1670876B1 (ja) |
JP (1) | JP4718466B2 (ja) |
KR (1) | KR20060094528A (ja) |
CN (1) | CN1886482A (ja) |
TW (1) | TW200523340A (ja) |
WO (1) | WO2005030905A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2003221442A1 (en) * | 2002-03-22 | 2003-10-08 | Nichia Corporation | Nitride phosphor and method for preparation thereof, and light emitting device |
US7965031B2 (en) * | 2003-09-24 | 2011-06-21 | Osram Gesellschaft mit beschränkter Haftung | White-emitting LED having a defined color temperature |
EP1664238B1 (de) * | 2003-09-24 | 2015-11-18 | OSRAM Opto Semiconductors GmbH | Grün emittierende led |
JP2005298721A (ja) * | 2004-04-14 | 2005-10-27 | Nichia Chem Ind Ltd | 酸窒化物蛍光体及びそれを用いた発光装置 |
JP2006257385A (ja) * | 2004-09-09 | 2006-09-28 | Showa Denko Kk | 酸窒化物系蛍光体及びその製造法 |
DE102004051395A1 (de) | 2004-10-21 | 2006-04-27 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Hocheffizienter stabiler Oxinitrid-Leuchtstoff |
US7901592B2 (en) | 2005-02-17 | 2011-03-08 | Koninklijke Philips Electronics N.V. | Illumination system comprising a green-emitting ceramic luminescence converter |
JP4238269B2 (ja) * | 2006-02-02 | 2009-03-18 | 三菱化学株式会社 | 複合酸窒化物蛍光体、それを用いた発光装置、画像表示装置、照明装置及び蛍光体含有組成物、並びに、複合酸窒化物 |
DE102006008300A1 (de) * | 2006-02-22 | 2007-08-30 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff sowie Herstellverfahren für den Leuchtstoff |
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Also Published As
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EP1670876A1 (de) | 2006-06-21 |
TW200523340A (en) | 2005-07-16 |
JP2007506815A (ja) | 2007-03-22 |
EP1670876B1 (de) | 2020-04-29 |
US7550095B2 (en) | 2009-06-23 |
KR20060094528A (ko) | 2006-08-29 |
WO2005030905A1 (de) | 2005-04-07 |
US20070080326A1 (en) | 2007-04-12 |
CN1886482A (zh) | 2006-12-27 |
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