JP4708497B1 - Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法 - Google Patents
Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法 Download PDFInfo
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- JP4708497B1 JP4708497B1 JP2010127943A JP2010127943A JP4708497B1 JP 4708497 B1 JP4708497 B1 JP 4708497B1 JP 2010127943 A JP2010127943 A JP 2010127943A JP 2010127943 A JP2010127943 A JP 2010127943A JP 4708497 B1 JP4708497 B1 JP 4708497B1
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- JP
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- mass
- plating
- copper alloy
- rolling
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229910045601 alloy Inorganic materials 0.000 title abstract description 21
- 239000000956 alloy Substances 0.000 title abstract description 21
- 229910020711 Co—Si Inorganic materials 0.000 title abstract description 14
- 239000013078 crystal Substances 0.000 claims abstract description 52
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 45
- 238000005096 rolling process Methods 0.000 claims abstract description 34
- 239000012776 electronic material Substances 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 9
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 238000005098 hot rolling Methods 0.000 claims description 22
- 230000032683 aging Effects 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 238000005266 casting Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910052748 manganese Inorganic materials 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 229910052787 antimony Inorganic materials 0.000 claims description 6
- 229910052785 arsenic Inorganic materials 0.000 claims description 6
- 229910052790 beryllium Inorganic materials 0.000 claims description 6
- 229910052796 boron Inorganic materials 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000007747 plating Methods 0.000 abstract description 54
- 239000000243 solution Substances 0.000 description 21
- 239000002245 particle Substances 0.000 description 20
- 230000000694 effects Effects 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 239000002344 surface layer Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 238000005452 bending Methods 0.000 description 10
- 239000006104 solid solution Substances 0.000 description 10
- 238000005097 cold rolling Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 238000001816 cooling Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000001771 impaired effect Effects 0.000 description 5
- 238000000879 optical micrograph Methods 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- 229910018598 Si-Co Inorganic materials 0.000 description 4
- 229910008453 Si—Co Inorganic materials 0.000 description 4
- 239000011362 coarse particle Substances 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 229910018098 Ni-Si Inorganic materials 0.000 description 3
- 229910018529 Ni—Si Inorganic materials 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 3
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- 238000004881 precipitation hardening Methods 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000010731 rolling oil Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010127943A JP4708497B1 (ja) | 2010-06-03 | 2010-06-03 | Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法 |
| EP11789514.4A EP2578708A4 (fr) | 2010-06-03 | 2011-03-24 | Tôle en un alliage à base de cu-co-si et son procédé de production |
| US13/581,715 US20130092297A1 (en) | 2010-06-03 | 2011-03-24 | Cu-Co-Si System Alloy Sheet and Method for Manufacturing Same |
| PCT/JP2011/057216 WO2011152104A1 (fr) | 2010-06-03 | 2011-03-24 | Tôle en un alliage à base de cu-co-si et son procédé de production |
| CN201180003593.1A CN102666890B (zh) | 2010-06-03 | 2011-03-24 | Cu-Co-Si系合金板及其制造方法 |
| TW100113320A TWI422693B (zh) | 2010-06-03 | 2011-04-18 | Cu-Co-Si alloy sheet and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010127943A JP4708497B1 (ja) | 2010-06-03 | 2010-06-03 | Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP4708497B1 true JP4708497B1 (ja) | 2011-06-22 |
| JP2011252216A JP2011252216A (ja) | 2011-12-15 |
Family
ID=44292620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010127943A Active JP4708497B1 (ja) | 2010-06-03 | 2010-06-03 | Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20130092297A1 (fr) |
| EP (1) | EP2578708A4 (fr) |
| JP (1) | JP4708497B1 (fr) |
| CN (1) | CN102666890B (fr) |
| TW (1) | TWI422693B (fr) |
| WO (1) | WO2011152104A1 (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5437519B1 (ja) | 2013-07-31 | 2014-03-12 | Ｊｘ日鉱日石金属株式会社 | Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法 |
| JP5437520B1 (ja) * | 2013-07-31 | 2014-03-12 | Ｊｘ日鉱日石金属株式会社 | Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法 |
| JP6294037B2 (ja) * | 2013-09-18 | 2018-03-14 | 株式会社Maruwa | 複合型ノイズフィルタ |
| JP6615093B2 (ja) | 2014-05-30 | 2019-12-04 | 古河電気工業株式会社 | 電気接点材、電気接点材の製造方法および端子 |
| JP6306632B2 (ja) | 2016-03-31 | 2018-04-04 | Ｊｘ金属株式会社 | 電子材料用銅合金 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7182823B2 (en) | 2002-07-05 | 2007-02-27 | Olin Corporation | Copper alloy containing cobalt, nickel and silicon |
| CN100439530C (zh) * | 2004-12-24 | 2008-12-03 | 株式会社神户制钢所 | 具有弯曲性和应力弛豫性能的铜合金 |
| WO2006101172A1 (fr) * | 2005-03-24 | 2006-09-28 | Nippon Mining & Metals Co., Ltd. | Alliage de cuivre pour materiel electronique |
| JP2007169765A (ja) | 2005-12-26 | 2007-07-05 | Furukawa Electric Co Ltd:The | 銅合金とその製造方法 |
| JP5085908B2 (ja) * | 2006-10-03 | 2012-11-28 | Ｊｘ日鉱日石金属株式会社 | 電子材料用銅合金及びその製造方法 |
| JP4937815B2 (ja) * | 2007-03-30 | 2012-05-23 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
| CN101952465B (zh) * | 2008-01-31 | 2012-09-19 | 古河电气工业株式会社 | 电气电子零件用铜合金材料及其制造方法 |
| JP4596490B2 (ja) * | 2008-03-31 | 2010-12-08 | Ｊｘ日鉱日石金属株式会社 | 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
| KR101570555B1 (ko) * | 2008-07-31 | 2015-11-19 | 후루카와 덴키 고교 가부시키가이샤 | 전기전자부품용 동합금 재료와 그 제조방법 |
| EP2333127A4 (fr) * | 2008-08-05 | 2012-07-04 | Furukawa Electric Co Ltd | Matière d'alliage de cuivre pour un composant électrique/électronique |
| JP5619389B2 (ja) * | 2008-08-05 | 2014-11-05 | 古河電気工業株式会社 | 銅合金材料 |
| JP5261161B2 (ja) * | 2008-12-12 | 2013-08-14 | Ｊｘ日鉱日石金属株式会社 | Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法 |
-
2010
- 2010-06-03 JP JP2010127943A patent/JP4708497B1/ja active Active
-
2011
- 2011-03-24 CN CN201180003593.1A patent/CN102666890B/zh active Active
- 2011-03-24 WO PCT/JP2011/057216 patent/WO2011152104A1/fr active Application Filing
- 2011-03-24 EP EP11789514.4A patent/EP2578708A4/fr not_active Withdrawn
- 2011-03-24 US US13/581,715 patent/US20130092297A1/en not_active Abandoned
- 2011-04-18 TW TW100113320A patent/TWI422693B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201200606A (en) | 2012-01-01 |
| EP2578708A1 (fr) | 2013-04-10 |
| WO2011152104A1 (fr) | 2011-12-08 |
| JP2011252216A (ja) | 2011-12-15 |
| TWI422693B (zh) | 2014-01-11 |
| US20130092297A1 (en) | 2013-04-18 |
| CN102666890A (zh) | 2012-09-12 |
| CN102666890B (zh) | 2014-05-07 |
| EP2578708A4 (fr) | 2014-04-09 |
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