CN102666890B - Cu-Co-Si系合金板及其制造方法 - Google Patents

Cu-Co-Si系合金板及其制造方法 Download PDF

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Publication number
CN102666890B
CN102666890B CN201180003593.1A CN201180003593A CN102666890B CN 102666890 B CN102666890 B CN 102666890B CN 201180003593 A CN201180003593 A CN 201180003593A CN 102666890 B CN102666890 B CN 102666890B
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copper alloy
quality
rolling
electronic material
plating
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CN102666890A (zh
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桑垣宽
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JX Nippon Mining and Metals Corp
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
CN201180003593.1A 2010-06-03 2011-03-24 Cu-Co-Si系合金板及其制造方法 Active CN102666890B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-127943 2010-06-03
JP2010127943A JP4708497B1 (ja) 2010-06-03 2010-06-03 Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法
PCT/JP2011/057216 WO2011152104A1 (fr) 2010-06-03 2011-03-24 Tôle en un alliage à base de cu-co-si et son procédé de production

Publications (2)

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CN102666890A CN102666890A (zh) 2012-09-12
CN102666890B true CN102666890B (zh) 2014-05-07

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CN201180003593.1A Active CN102666890B (zh) 2010-06-03 2011-03-24 Cu-Co-Si系合金板及其制造方法

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Country Link
US (1) US20130092297A1 (fr)
EP (1) EP2578708A4 (fr)
JP (1) JP4708497B1 (fr)
CN (1) CN102666890B (fr)
TW (1) TWI422693B (fr)
WO (1) WO2011152104A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5437519B1 (ja) 2013-07-31 2014-03-12 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
JP5437520B1 (ja) 2013-07-31 2014-03-12 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
JP6294037B2 (ja) * 2013-09-18 2018-03-14 株式会社Maruwa 複合型ノイズフィルタ
WO2015182786A1 (fr) * 2014-05-30 2015-12-03 古河電気工業株式会社 Matériau de contact électrique, procédé de fabrication de matériau de contact électrique et borne
JP6306632B2 (ja) 2016-03-31 2018-04-04 Ｊｘ金属株式会社 電子材料用銅合金

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1793394A (zh) * 2004-12-24 2006-06-28 株式会社神户制钢所 具有弯曲性和应力弛豫性能的铜合金
CN101146920A (zh) * 2005-03-24 2008-03-19 日矿金属株式会社 电子材料用铜合金
CN101646791A (zh) * 2007-03-30 2010-02-10 日矿金属株式会社 电子材料用Cu-Ni-Si-Co系铜合金及其制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7182823B2 (en) 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon
JP2007169765A (ja) 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The 銅合金とその製造方法
JP5085908B2 (ja) * 2006-10-03 2012-11-28 Ｊｘ日鉱日石金属株式会社 電子材料用銅合金及びその製造方法
CN101952465B (zh) * 2008-01-31 2012-09-19 古河电气工业株式会社 电气电子零件用铜合金材料及其制造方法
JP4596490B2 (ja) * 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
KR101570555B1 (ko) * 2008-07-31 2015-11-19 후루카와 덴키 고교 가부시키가이샤 전기전자부품용 동합금 재료와 그 제조방법
EP2333127A4 (fr) * 2008-08-05 2012-07-04 Furukawa Electric Co Ltd Matière d'alliage de cuivre pour un composant électrique/électronique
JP5619389B2 (ja) * 2008-08-05 2014-11-05 古河電気工業株式会社 銅合金材料
JP5261161B2 (ja) * 2008-12-12 2013-08-14 Ｊｘ日鉱日石金属株式会社 Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1793394A (zh) * 2004-12-24 2006-06-28 株式会社神户制钢所 具有弯曲性和应力弛豫性能的铜合金
CN101146920A (zh) * 2005-03-24 2008-03-19 日矿金属株式会社 电子材料用铜合金
CN101646791A (zh) * 2007-03-30 2010-02-10 日矿金属株式会社 电子材料用Cu-Ni-Si-Co系铜合金及其制造方法

Also Published As

Publication number Publication date
TWI422693B (zh) 2014-01-11
EP2578708A4 (fr) 2014-04-09
WO2011152104A1 (fr) 2011-12-08
EP2578708A1 (fr) 2013-04-10
JP4708497B1 (ja) 2011-06-22
TW201200606A (en) 2012-01-01
JP2011252216A (ja) 2011-12-15
US20130092297A1 (en) 2013-04-18
CN102666890A (zh) 2012-09-12

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Address after: Tokyo, Japan, Japan

Patentee after: JX NIPPON MINING & METALS CORPORATION

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Patentee before: JX Nippon Mining & Metals Co., Ltd.

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Address after: Tokyo, Japan, Japan

Patentee after: JX NIPPON MINING & METALS CORPORATION

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Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan

Patentee after: JKS Metal Co.,Ltd.

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Patentee before: JKS Metal Co.,Ltd.