JP4699177B2 - 基板巻取装置および基板巻取方法 - Google Patents

基板巻取装置および基板巻取方法 Download PDF

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Publication number
JP4699177B2
JP4699177B2 JP2005319137A JP2005319137A JP4699177B2 JP 4699177 B2 JP4699177 B2 JP 4699177B2 JP 2005319137 A JP2005319137 A JP 2005319137A JP 2005319137 A JP2005319137 A JP 2005319137A JP 4699177 B2 JP4699177 B2 JP 4699177B2
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JP
Japan
Prior art keywords
substrate
spacer
reel
take
supply reel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005319137A
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English (en)
Japanese (ja)
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JP2007129005A (ja
Inventor
誠 小松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Athlete FA Corp
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Athlete FA Corp
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Publication date
Application filed by Athlete FA Corp filed Critical Athlete FA Corp
Priority to JP2005319137A priority Critical patent/JP4699177B2/ja
Priority to KR1020060083669A priority patent/KR20070047686A/ko
Priority to CN2006101320587A priority patent/CN1960621B/zh
Priority to TW095139521A priority patent/TW200719781A/zh
Publication of JP2007129005A publication Critical patent/JP2007129005A/ja
Application granted granted Critical
Publication of JP4699177B2 publication Critical patent/JP4699177B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Controlling Rewinding, Feeding, Winding, Or Abnormalities Of Webs (AREA)
  • Coating Apparatus (AREA)
JP2005319137A 2005-11-02 2005-11-02 基板巻取装置および基板巻取方法 Expired - Fee Related JP4699177B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005319137A JP4699177B2 (ja) 2005-11-02 2005-11-02 基板巻取装置および基板巻取方法
KR1020060083669A KR20070047686A (ko) 2005-11-02 2006-08-31 기판공급장치, 기판권취장치, 기판처리 시스템,기판공급방법 및 기판권취방법
CN2006101320587A CN1960621B (zh) 2005-11-02 2006-10-23 电路板供给装置、电路板卷绕装置、电路板处理系统、电路板供给方法及电路板卷绕方法
TW095139521A TW200719781A (en) 2005-11-02 2006-10-26 Substrate feeder, substrate take-up device, substrate processing system, substrate supplying method, and substrate take-up method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005319137A JP4699177B2 (ja) 2005-11-02 2005-11-02 基板巻取装置および基板巻取方法

Publications (2)

Publication Number Publication Date
JP2007129005A JP2007129005A (ja) 2007-05-24
JP4699177B2 true JP4699177B2 (ja) 2011-06-08

Family

ID=38072042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005319137A Expired - Fee Related JP4699177B2 (ja) 2005-11-02 2005-11-02 基板巻取装置および基板巻取方法

Country Status (4)

Country Link
JP (1) JP4699177B2 (zh)
KR (1) KR20070047686A (zh)
CN (1) CN1960621B (zh)
TW (1) TW200719781A (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101511584B1 (ko) 2008-09-25 2015-04-13 해성디에스 주식회사 롤 투 롤 반도체부품 제조장치 및 그에 적용되는 이송방법
CN108963799A (zh) * 2018-08-20 2018-12-07 芜湖易测自动化设备有限公司 一种方便安装电气配件的配电柜
KR102571257B1 (ko) * 2021-06-11 2023-08-25 주식회사 로티 조명용 유기 발광소자 및 그 제조 방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04343240A (ja) * 1991-05-20 1992-11-30 Shinkawa Ltd テープ搬送装置
JPH0536757A (ja) * 1991-07-29 1993-02-12 Asahi Optical Co Ltd 膜体の平面度矯正方法
JP2000204478A (ja) * 1998-11-11 2000-07-25 Canon Inc 基板処理装置及び基板処理方法
JP2003282638A (ja) * 2002-03-22 2003-10-03 Hitachi Cable Ltd テープ剥離装置
JP2004122753A (ja) * 2002-08-08 2004-04-22 Asuriito Fa Kk 樹脂硬化システム
JP2005093959A (ja) * 2003-09-19 2005-04-07 Hitachi Cable Ltd 半導体装置用テープキャリアの編集装置および編集方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04343240A (ja) * 1991-05-20 1992-11-30 Shinkawa Ltd テープ搬送装置
JPH0536757A (ja) * 1991-07-29 1993-02-12 Asahi Optical Co Ltd 膜体の平面度矯正方法
JP2000204478A (ja) * 1998-11-11 2000-07-25 Canon Inc 基板処理装置及び基板処理方法
JP2003282638A (ja) * 2002-03-22 2003-10-03 Hitachi Cable Ltd テープ剥離装置
JP2004122753A (ja) * 2002-08-08 2004-04-22 Asuriito Fa Kk 樹脂硬化システム
JP2005093959A (ja) * 2003-09-19 2005-04-07 Hitachi Cable Ltd 半導体装置用テープキャリアの編集装置および編集方法

Also Published As

Publication number Publication date
KR20070047686A (ko) 2007-05-07
TW200719781A (en) 2007-05-16
JP2007129005A (ja) 2007-05-24
CN1960621B (zh) 2010-10-13
CN1960621A (zh) 2007-05-09

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