JP4698654B2 - 印刷回路基板 - Google Patents
印刷回路基板 Download PDFInfo
- Publication number
- JP4698654B2 JP4698654B2 JP2007291164A JP2007291164A JP4698654B2 JP 4698654 B2 JP4698654 B2 JP 4698654B2 JP 2007291164 A JP2007291164 A JP 2007291164A JP 2007291164 A JP2007291164 A JP 2007291164A JP 4698654 B2 JP4698654 B2 JP 4698654B2
- Authority
- JP
- Japan
- Prior art keywords
- optical waveguide
- substrate
- printed circuit
- circuit board
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Optical Integrated Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
一方、前に提示した本発明の複数の実施例に係る印刷回路基板100、200、300及び400において、光電変換素子114、124、244および254が光導波路に直接実装できる構造を提示したが、このような構造により光損失を最小化することができる。
120 第2基板部
112、122 溝
114、124 光電変換素子
116、126 ビア
130 軟性基板部
132 光導波路
134 電気配線層
136 パッド
138 再配線ランド
Claims (1)
- 第1基板部と、
一端が前記第1基板部に結合され、電気信号と光信号とを共に伝送するように電気配線層と光導波路とを含む軟性(flexible)基板部と、
前記軟性基板部の他端と結合される第2基板部とを含み、
前記電気配線層と前記光導波路は、互いに離隔して配置され、
前記第1基板部には光電変換素子を実装するように前記光導波路に通じ、外部に露出する溝が形成され、
前記第1基板部及び第2基板部にはそれぞれステップ(Step)が形成され、前記光導波路の両端部が前記ステップに載置され、前記光導波路の両側面が前記ステップによりそれぞれカバーされ、
前記溝に接する前記光導波路の所定位置には、前記光電変換素子が載置されるようにパッドが形成され、
前記パッドは前記光導波路に埋め込まれ、
前記光導波路には前記パッドと電気的に接続された再配線ランドがさらに形成され、
前記再配線ランドは前記光導波路に埋め込まれ、
前記第1基板部は層間導通のためのビアを含み、
前記再配線ランドは前記ビアと電気的に接続されることを特徴とする印刷回路基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060115391A KR100796982B1 (ko) | 2006-11-21 | 2006-11-21 | 인쇄회로기판 및 그 제조방법 |
KR10-2006-0115391 | 2006-11-21 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010211622A Division JP4939638B2 (ja) | 2006-11-21 | 2010-09-22 | 印刷回路基板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008131040A JP2008131040A (ja) | 2008-06-05 |
JP4698654B2 true JP4698654B2 (ja) | 2011-06-08 |
Family
ID=39218878
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007291164A Expired - Fee Related JP4698654B2 (ja) | 2006-11-21 | 2007-11-08 | 印刷回路基板 |
JP2010211622A Expired - Fee Related JP4939638B2 (ja) | 2006-11-21 | 2010-09-22 | 印刷回路基板及びその製造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010211622A Expired - Fee Related JP4939638B2 (ja) | 2006-11-21 | 2010-09-22 | 印刷回路基板及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (3) | US7489839B2 (ja) |
JP (2) | JP4698654B2 (ja) |
KR (1) | KR100796982B1 (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100796982B1 (ko) * | 2006-11-21 | 2008-01-22 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US7729570B2 (en) * | 2007-05-18 | 2010-06-01 | Ibiden Co., Ltd. | Photoelectric circuit board and device for optical communication |
KR100948635B1 (ko) * | 2007-09-28 | 2010-03-24 | 삼성전기주식회사 | 인쇄회로기판 |
US7627204B1 (en) * | 2007-11-02 | 2009-12-01 | National Semiconductor Corporation | Optical-electrical flex interconnect using a flexible waveguide and flexible printed circuit board substrate |
US7684663B2 (en) * | 2007-11-02 | 2010-03-23 | National Semiconductor Corporation | Coupling of optical interconnect with electrical device |
KR100952478B1 (ko) | 2008-02-19 | 2010-04-13 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
KR100969436B1 (ko) * | 2008-06-09 | 2010-07-14 | 삼성전기주식회사 | 광 리지드-플렉서블 인쇄회로기판 |
JP4911130B2 (ja) * | 2008-07-08 | 2012-04-04 | 日立電線株式会社 | 光電気複合配線 |
WO2010013366A1 (ja) * | 2008-07-30 | 2010-02-04 | イビデン株式会社 | フレックスリジッド配線板及びその製造方法 |
KR101012757B1 (ko) | 2009-05-14 | 2011-02-08 | 전자부품연구원 | 인쇄 회로 기판에 형성되는 광전 변환 모듈 및 이를 포함하는 lsi 패키지 |
US8867871B2 (en) * | 2009-10-08 | 2014-10-21 | Lg Innotek Co., Ltd. | Optical printed circuit board and method of fabricating the same |
US7949211B1 (en) | 2010-02-26 | 2011-05-24 | Corning Incorporated | Modular active board subassemblies and printed wiring boards comprising the same |
US9405064B2 (en) * | 2012-04-04 | 2016-08-02 | Texas Instruments Incorporated | Microstrip line of different widths, ground planes of different distances |
CN103118489B (zh) * | 2013-01-24 | 2015-12-23 | 宁波舜宇光电信息有限公司 | 一种下沉式软硬结合板及其制造方法 |
JP6043246B2 (ja) * | 2013-07-11 | 2016-12-14 | 株式会社アドバンテスト | デバイスインターフェイス装置、試験装置、および試験方法 |
US9804639B2 (en) * | 2013-08-15 | 2017-10-31 | Apple Inc. | Hinged portable electronic device with display circuitry located in base |
US9681558B2 (en) * | 2014-08-12 | 2017-06-13 | Infineon Technologies Ag | Module with integrated power electronic circuitry and logic circuitry |
US10211158B2 (en) | 2014-10-31 | 2019-02-19 | Infineon Technologies Ag | Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module |
JP6810346B2 (ja) * | 2016-12-07 | 2021-01-06 | 富士通株式会社 | 発光素子接合基板 |
US10319690B2 (en) * | 2017-04-28 | 2019-06-11 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
US11262605B2 (en) * | 2017-08-31 | 2022-03-01 | Lightwave Logic Inc. | Active region-less polymer modulator integrated on a common PIC platform and method |
US11002927B2 (en) * | 2019-02-21 | 2021-05-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure |
US11076491B2 (en) * | 2019-10-16 | 2021-07-27 | Compass Technology Company Limited | Integrated electro-optical flexible circuit board |
US11768338B2 (en) * | 2021-05-27 | 2023-09-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Optical interconnect structure, package structure and fabricating method thereof |
Citations (3)
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JP2003227951A (ja) * | 2002-02-05 | 2003-08-15 | Canon Inc | 光導波装置、その製造方法、およびそれを用いた光電気混載基板 |
JP2006140233A (ja) * | 2004-11-10 | 2006-06-01 | Ibiden Co Ltd | 光電気配線板、および、光通信用デバイス |
JP2006243467A (ja) * | 2005-03-04 | 2006-09-14 | Fuji Xerox Co Ltd | 光送受信モジュール |
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KR100770853B1 (ko) * | 2006-02-09 | 2007-10-26 | 삼성전자주식회사 | 광 모듈 |
KR100796982B1 (ko) * | 2006-11-21 | 2008-01-22 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
-
2006
- 2006-11-21 KR KR1020060115391A patent/KR100796982B1/ko not_active IP Right Cessation
-
2007
- 2007-11-08 JP JP2007291164A patent/JP4698654B2/ja not_active Expired - Fee Related
- 2007-11-13 US US11/984,114 patent/US7489839B2/en not_active Expired - Fee Related
-
2008
- 2008-12-10 US US12/314,450 patent/US8056220B2/en not_active Expired - Fee Related
- 2008-12-10 US US12/314,449 patent/US8457450B2/en not_active Expired - Fee Related
-
2010
- 2010-09-22 JP JP2010211622A patent/JP4939638B2/ja not_active Expired - Fee Related
Patent Citations (3)
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JP2003227951A (ja) * | 2002-02-05 | 2003-08-15 | Canon Inc | 光導波装置、その製造方法、およびそれを用いた光電気混載基板 |
JP2006140233A (ja) * | 2004-11-10 | 2006-06-01 | Ibiden Co Ltd | 光電気配線板、および、光通信用デバイス |
JP2006243467A (ja) * | 2005-03-04 | 2006-09-14 | Fuji Xerox Co Ltd | 光送受信モジュール |
Also Published As
Publication number | Publication date |
---|---|
US7489839B2 (en) | 2009-02-10 |
US8457450B2 (en) | 2013-06-04 |
US8056220B2 (en) | 2011-11-15 |
JP4939638B2 (ja) | 2012-05-30 |
US20090100671A1 (en) | 2009-04-23 |
US20080118200A1 (en) | 2008-05-22 |
US20090103860A1 (en) | 2009-04-23 |
JP2011043835A (ja) | 2011-03-03 |
KR100796982B1 (ko) | 2008-01-22 |
JP2008131040A (ja) | 2008-06-05 |
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