JP5040007B2 - 印刷回路基板 - Google Patents
印刷回路基板 Download PDFInfo
- Publication number
- JP5040007B2 JP5040007B2 JP2008220259A JP2008220259A JP5040007B2 JP 5040007 B2 JP5040007 B2 JP 5040007B2 JP 2008220259 A JP2008220259 A JP 2008220259A JP 2008220259 A JP2008220259 A JP 2008220259A JP 5040007 B2 JP5040007 B2 JP 5040007B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible
- substrate
- printed circuit
- optical wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Description
一方、軟性光配線基板は、光信号が移動するコアと、コアを取り囲むクラッディングとを含むことができ、クラッディングには電気的信号を伝送する回路パターンが埋め込まれることができる。
12,22 ホール
14 ビア
20 第2基板部
30,30' 軟性光配線基板
32 コア
34 クラッディング
35,48 パッド
36 反射面
37,44 ソルダレジスト
39,46 カバーレイ
40,40' 軟性電気配線基板
41 絶縁層
42 回路パターン
51,52 光電変換素子
Claims (4)
- 互いに離隔して配置される第1基板部及び第2基板部と、
前記第1基板部と前記第2基板部とを同一面上における両端部のそれぞれに積層し、光信号を伝送する軟性光配線基板と、
前記軟性光配線基板に実装される光電変換素子と
を備え、
前記軟性光配線基板は、
前記光信号が移動するコア(core)と、
前記コアを取り囲むクラッディング(cladding)と、
前記クラッディングに埋め込まれて電気的信号を伝送する回路パターン及びパッドと
を備え、
前記パッドは前記クラッディングの表面に露出し、
前記光電変換素子は露出した前記パッド上に実装され、前記パッドと直接接続されることを特徴とする印刷回路基板。 - 前記軟性光配線基板が、前記第1基板部の最外郭に積層されることを特徴とする請求項1に記載の印刷回路基板。
- 両端部が前記第1基板部及び前記第2基板部にそれぞれ積層される軟性電気配線基板をさらに備え、
前記軟性電気配線基板は前記軟性光配線基板と離隔することを特徴とする請求項1または2に記載の印刷回路基板。 - 前記クラッディングが、透明な材質からなることを特徴とする請求項1から3のいずれか1項に記載の印刷回路基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0098385 | 2007-09-28 | ||
KR1020070098385A KR100948635B1 (ko) | 2007-09-28 | 2007-09-28 | 인쇄회로기판 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009088487A JP2009088487A (ja) | 2009-04-23 |
JP5040007B2 true JP5040007B2 (ja) | 2012-10-03 |
Family
ID=40506895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008220259A Expired - Fee Related JP5040007B2 (ja) | 2007-09-28 | 2008-08-28 | 印刷回路基板 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8159824B2 (ja) |
JP (1) | JP5040007B2 (ja) |
KR (1) | KR100948635B1 (ja) |
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US9536815B2 (en) | 2009-05-28 | 2017-01-03 | Hsio Technologies, Llc | Semiconductor socket with direct selective metalization |
US9276336B2 (en) | 2009-05-28 | 2016-03-01 | Hsio Technologies, Llc | Metalized pad to electrical contact interface |
US8955215B2 (en) | 2009-05-28 | 2015-02-17 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
WO2011153298A1 (en) | 2010-06-03 | 2011-12-08 | Hsio Technologies, Llc | Electrical connector insulator housing |
WO2010141313A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit socket diagnostic tool |
WO2011002709A1 (en) | 2009-06-29 | 2011-01-06 | Hsio Technologies, Llc | Compliant printed circuit semiconductor tester interface |
WO2013036565A1 (en) | 2011-09-08 | 2013-03-14 | Hsio Technologies, Llc | Direct metalization of electrical circuit structures |
US9196980B2 (en) | 2009-06-02 | 2015-11-24 | Hsio Technologies, Llc | High performance surface mount electrical interconnect with external biased normal force loading |
WO2012074963A1 (en) | 2010-12-01 | 2012-06-07 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
US8610265B2 (en) | 2009-06-02 | 2013-12-17 | Hsio Technologies, Llc | Compliant core peripheral lead semiconductor test socket |
US9318862B2 (en) | 2009-06-02 | 2016-04-19 | Hsio Technologies, Llc | Method of making an electronic interconnect |
US9054097B2 (en) | 2009-06-02 | 2015-06-09 | Hsio Technologies, Llc | Compliant printed circuit area array semiconductor device package |
WO2014011226A1 (en) | 2012-07-10 | 2014-01-16 | Hsio Technologies, Llc | Hybrid printed circuit assembly with low density main core and embedded high density circuit regions |
WO2010141303A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Resilient conductive electrical interconnect |
WO2010141318A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit peripheral lead semiconductor test socket |
US8988093B2 (en) | 2009-06-02 | 2015-03-24 | Hsio Technologies, Llc | Bumped semiconductor wafer or die level electrical interconnect |
WO2012061008A1 (en) | 2010-10-25 | 2012-05-10 | Hsio Technologies, Llc | High performance electrical circuit structure |
WO2010141297A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit wafer level semiconductor package |
US8912812B2 (en) | 2009-06-02 | 2014-12-16 | Hsio Technologies, Llc | Compliant printed circuit wafer probe diagnostic tool |
WO2012078493A1 (en) | 2010-12-06 | 2012-06-14 | Hsio Technologies, Llc | Electrical interconnect ic device socket |
US9414500B2 (en) * | 2009-06-02 | 2016-08-09 | Hsio Technologies, Llc | Compliant printed flexible circuit |
US9930775B2 (en) | 2009-06-02 | 2018-03-27 | Hsio Technologies, Llc | Copper pillar full metal via electrical circuit structure |
US8970031B2 (en) | 2009-06-16 | 2015-03-03 | Hsio Technologies, Llc | Semiconductor die terminal |
WO2010141266A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit peripheral lead semiconductor package |
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US8525346B2 (en) | 2009-06-02 | 2013-09-03 | Hsio Technologies, Llc | Compliant conductive nano-particle electrical interconnect |
US8987886B2 (en) | 2009-06-02 | 2015-03-24 | Hsio Technologies, Llc | Copper pillar full metal via electrical circuit structure |
WO2011002712A1 (en) | 2009-06-29 | 2011-01-06 | Hsio Technologies, Llc | Singulated semiconductor device separable electrical interconnect |
US9184145B2 (en) | 2009-06-02 | 2015-11-10 | Hsio Technologies, Llc | Semiconductor device package adapter |
US9276339B2 (en) | 2009-06-02 | 2016-03-01 | Hsio Technologies, Llc | Electrical interconnect IC device socket |
US9277654B2 (en) | 2009-06-02 | 2016-03-01 | Hsio Technologies, Llc | Composite polymer-metal electrical contacts |
US9613841B2 (en) | 2009-06-02 | 2017-04-04 | Hsio Technologies, Llc | Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection |
US8803539B2 (en) | 2009-06-03 | 2014-08-12 | Hsio Technologies, Llc | Compliant wafer level probe assembly |
WO2010147782A1 (en) | 2009-06-16 | 2010-12-23 | Hsio Technologies, Llc | Simulated wirebond semiconductor package |
US9320144B2 (en) | 2009-06-17 | 2016-04-19 | Hsio Technologies, Llc | Method of forming a semiconductor socket |
US8758067B2 (en) | 2010-06-03 | 2014-06-24 | Hsio Technologies, Llc | Selective metalization of electrical connector or socket housing |
US9689897B2 (en) | 2010-06-03 | 2017-06-27 | Hsio Technologies, Llc | Performance enhanced semiconductor socket |
US10159154B2 (en) | 2010-06-03 | 2018-12-18 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer circuit structure |
US9350093B2 (en) | 2010-06-03 | 2016-05-24 | Hsio Technologies, Llc | Selective metalization of electrical connector or socket housing |
US8708576B2 (en) * | 2011-01-20 | 2014-04-29 | Harris Corporation | Electro-optical device having an elastomeric body and related methods |
US8879276B2 (en) * | 2011-06-15 | 2014-11-04 | Power Gold LLC | Flexible circuit assembly and method thereof |
US9761520B2 (en) | 2012-07-10 | 2017-09-12 | Hsio Technologies, Llc | Method of making an electrical connector having electrodeposited terminals |
KR101361069B1 (ko) * | 2012-09-19 | 2014-02-11 | 주식회사 옵토웰 | 광 서브어셈블리 |
US9081137B2 (en) | 2013-01-21 | 2015-07-14 | International Business Machines Corporation | Implementing embedded hybrid electrical-optical PCB construct |
US10667410B2 (en) | 2013-07-11 | 2020-05-26 | Hsio Technologies, Llc | Method of making a fusion bonded circuit structure |
US10506722B2 (en) | 2013-07-11 | 2019-12-10 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer electrical circuit structure |
US9559447B2 (en) | 2015-03-18 | 2017-01-31 | Hsio Technologies, Llc | Mechanical contact retention within an electrical connector |
JP6882030B2 (ja) * | 2017-03-23 | 2021-06-02 | 京セラ株式会社 | 電子装置 |
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-
2007
- 2007-09-28 KR KR1020070098385A patent/KR100948635B1/ko not_active IP Right Cessation
-
2008
- 2008-08-28 JP JP2008220259A patent/JP5040007B2/ja not_active Expired - Fee Related
- 2008-09-03 US US12/230,700 patent/US8159824B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20090032834A (ko) | 2009-04-01 |
JP2009088487A (ja) | 2009-04-23 |
US20090084584A1 (en) | 2009-04-02 |
KR100948635B1 (ko) | 2010-03-24 |
US8159824B2 (en) | 2012-04-17 |
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