JP4698178B2 - 被研磨物保持用キャリア - Google Patents
被研磨物保持用キャリア Download PDFInfo
- Publication number
- JP4698178B2 JP4698178B2 JP2004205737A JP2004205737A JP4698178B2 JP 4698178 B2 JP4698178 B2 JP 4698178B2 JP 2004205737 A JP2004205737 A JP 2004205737A JP 2004205737 A JP2004205737 A JP 2004205737A JP 4698178 B2 JP4698178 B2 JP 4698178B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- silicon wafer
- thickness
- holding
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 108
- 229910052710 silicon Inorganic materials 0.000 claims description 108
- 239000010703 silicon Substances 0.000 claims description 108
- 238000005498 polishing Methods 0.000 claims description 73
- 239000000463 material Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 230000000737 periodic effect Effects 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 5
- 150000004767 nitrides Chemical class 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 109
- 239000002585 base Substances 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 15
- 238000012360 testing method Methods 0.000 description 11
- 239000004744 fabric Substances 0.000 description 9
- 239000011247 coating layer Substances 0.000 description 8
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 6
- 238000005299 abrasion Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 229920002978 Vinylon Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 229920006231 aramid fiber Polymers 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004205737A JP4698178B2 (ja) | 2004-07-13 | 2004-07-13 | 被研磨物保持用キャリア |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004205737A JP4698178B2 (ja) | 2004-07-13 | 2004-07-13 | 被研磨物保持用キャリア |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006026760A JP2006026760A (ja) | 2006-02-02 |
| JP2006026760A5 JP2006026760A5 (cg-RX-API-DMAC7.html) | 2007-08-30 |
| JP4698178B2 true JP4698178B2 (ja) | 2011-06-08 |
Family
ID=35893703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004205737A Expired - Fee Related JP4698178B2 (ja) | 2004-07-13 | 2004-07-13 | 被研磨物保持用キャリア |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4698178B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1852900B1 (en) * | 2005-02-25 | 2011-09-21 | Shin-Etsu Handotai Co., Ltd. | Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method |
| JP4904960B2 (ja) * | 2006-07-18 | 2012-03-28 | 信越半導体株式会社 | 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法 |
| JP5452984B2 (ja) * | 2009-06-03 | 2014-03-26 | 不二越機械工業株式会社 | ウェーハの両面研磨方法 |
| JP4605564B1 (ja) * | 2009-09-28 | 2011-01-05 | 株式会社白崎製作所 | 脆性薄板研磨装置用ホルダ、およびその製造方法 |
| JP5807648B2 (ja) | 2013-01-29 | 2015-11-10 | 信越半導体株式会社 | 両面研磨装置用キャリア及びウェーハの両面研磨方法 |
| JP7435436B2 (ja) * | 2020-12-24 | 2024-02-21 | 株式会社Sumco | キャリアプレートの研磨方法 |
| JP7613413B2 (ja) * | 2022-04-19 | 2025-01-15 | 株式会社Sumco | 両面研磨用キャリア及びこれを用いたシリコンウェーハの両面研磨方法及び装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0426117A (ja) * | 1990-05-22 | 1992-01-29 | Kawasaki Steel Corp | 半導体素子ウエハのラッピング装置 |
| JPH0671556A (ja) * | 1992-08-24 | 1994-03-15 | Murata Mfg Co Ltd | ラッピング装置 |
| JPH0941199A (ja) * | 1995-08-02 | 1997-02-10 | Sumitomo Metal Mining Co Ltd | 表面被覆膜の剥離方法 |
| JPH10330123A (ja) * | 1997-05-27 | 1998-12-15 | Asahi Glass Co Ltd | ガラス成形用金型及びガラス成形方法 |
| JPH1190817A (ja) * | 1997-09-18 | 1999-04-06 | Oputonikusu Seimitsu:Kk | ラッピングキャリアおよびその製造方法 |
| JP3909619B2 (ja) * | 1998-05-19 | 2007-04-25 | 独立行政法人理化学研究所 | 磁気ディスク基板の鏡面加工装置及び方法 |
| JP2000015565A (ja) * | 1998-06-30 | 2000-01-18 | Toshiba Ceramics Co Ltd | キャリア |
| JP2001105303A (ja) * | 1999-10-04 | 2001-04-17 | U T K Syst:Kk | 両面研磨用キャリア |
| DE10023002B4 (de) * | 2000-05-11 | 2006-10-26 | Siltronic Ag | Satz von Läuferscheiben sowie dessen Verwendung |
| JP2002018707A (ja) * | 2000-07-03 | 2002-01-22 | Puroshiido:Kk | ディスク研磨機のワークキャリア |
| US20070184662A1 (en) * | 2004-06-23 | 2007-08-09 | Komatsu Denshi Kinzoku Kabushiki Kaisha | Double-side polishing carrier and fabrication method thereof |
-
2004
- 2004-07-13 JP JP2004205737A patent/JP4698178B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006026760A (ja) | 2006-02-02 |
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