JP4648706B2 - 殊に、自動車のルーフ領域内、又は、車外リアビューミラー内に組み込むための、画像形成装置 - Google Patents
殊に、自動車のルーフ領域内、又は、車外リアビューミラー内に組み込むための、画像形成装置 Download PDFInfo
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- JP4648706B2 JP4648706B2 JP2004561175A JP2004561175A JP4648706B2 JP 4648706 B2 JP4648706 B2 JP 4648706B2 JP 2004561175 A JP2004561175 A JP 2004561175A JP 2004561175 A JP2004561175 A JP 2004561175A JP 4648706 B2 JP4648706 B2 JP 4648706B2
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/51—Housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
Description
図1は、本発明のモノ画像形成装置の略図、
図2は、本発明の3D画像形成装置の略図、
図3は、ハウジングパーツなしの角度を付けられた基板を有する図2の3D画像形成装置の略図、
図4は、図3の場合よりも大きな照射モジュールを有する、図3の3D画像形成装置の略図
を示す。
Claims (22)
- 車両内部の対象乃至要素の検出のために自動車のルーフ領域内に組み込むため、乃至、隣りの車線上の対象物乃至他の車両の検出のために自動車の車外のリアビューミラー内に組み込むための、画像形成装置(1)において、
第1のプリント配線板(10)と第2のプリント配線板(20)とを有しており、
前記第1のプリント配線板(10)は、少なくとも1つの光学撮像センサを有する第1の半導体を有する第1の構成部品用に設けられており、
前記第2のプリント配線板(20)は、第2の構成部品(21,22)用に設けられており、
前記第1のプリント配線板(10)及び前記第2のプリント配線板(20)は、堅牢な金属製基板(40)上に設けられており、
前記金属製基板(40)は、前記第1のプリント配線板(10)及び前記第2のプリント配線板(20)が任意の角度αで相互に傾けられるように曲げられている
ことを特徴とする画像形成装置(1)。 - 第1のプリント配線板(10)の第1の構成部品の、1つ又は複数のマイクロコントローラ及びメモリである第1の半導体(11,12)は、前記第1のプリント配線板(10)上に取り付けられている請求項1記載の画像形成装置(1)。
- 第1の構成部品の寸法に較べて大きな寸法の、1つ又は複数のコンデンサ、トランジスタ、抵抗、コイル及びプラグである第2の構成部品は、第2のプリント配線板(20)上に取り付けられている請求項1記載の画像形成装置(1)。
- 第1のプリント配線板(10)及び第2のプリント配線板(20)は、金属製基板(40)上に接着されている請求項1記載の画像形成装置(1)。
- 少なくとも第1のプリント配線板(10)、サーマルパッド、ビア又は所謂ペルチェ素子(13)を有している
請求項1記載の画像形成装置(1)。 - 更に第2のプリント配線板(20)、サーマルパッド、ビア又は所謂ペルチェ素子(13)を有している
請求項1記載の画像形成装置(1)。 - 光学撮像センサ(50)上にまん中にセンタリングして、光学系(51)が固定して設けられている
請求項1から6迄の何れか1記載の画像形成装置(1)。 - 光学系(51)は、ハウジング(53)又は保持部(32)と共に予め組み込まれている
請求項7記載の画像形成装置(1)。 - 少なくとも第1のプリント配線板(10)は、チップオンボード及び/又はフリップチップ技術により製造乃至装着されている請求項1から8迄の何れか1記載の画像形成装置(1)。
- 第1のプリント配線板(10)は、コネクション及び所定のインピーダンス用の複数の層を有している請求項1から9迄の何れか1記載の画像形成装置(1)。
- 第3のプリント配線板(30)が、照射ユニットと共に設けられている請求項1から10迄の何れか1記載の画像形成装置(1)。
- 第3のプリント配線板(30)が、各光学系(51)間及び/又は各光学系(51)の側方に設けられている請求項11記載の画像形成装置(1)。
- 第3のプリント配線板(30)は、光学系(51)用のハウジング(53)及び/又は別個の保持部(32)によって保持されており、前記光学系用のハウジング(53)及び/又は前記保持部(32)は、照射ユニット(31)と第1のプリント配線板(10)との間で電気接続部を形成している請求項11又は12記載の画像形成装置(1)。
- 光学系(51)用のハウジング(53)及び/又は保持部(32)は、金属化部によって少なくとも当該金属化部の表面に、照射ユニット(31)と第1のプリント配線板(10)との間で電気接続部を形成している請求項13記載の画像形成装置(1)。
- 第1のプリント配線板(10)と第3のプリント配線板(30)との間に、熱絶縁媒体(60)が設けられている請求項11から14迄の何れか1記載の画像形成装置(1)。
- 第1のプリント配線板(10)と第3のプリント配線板(30)との間に、サーマルシールド(60)が設けられている請求項11から15迄の何れか1記載の画像形成装置(1)。
- 第2のプリント配線板(20)及び/又は第3のプリント配線板(30)は、FR4又はメタルサーキットボードである請求項1から16迄の何れか1記載の画像形成装置(1)。
- チップ端子は、プリント配線板(10;20;30)と接続され、第1のプリント配線板(10)及び/又は第2のプリント配線板(20)及び/又は第3のプリント配線板(30)は、相互にボンディングワイヤ(70)を用いて相互に接続されている請求項1から17迄の何れか1記載の画像形成装置(1)。
- ボンディングワイヤ(70)及び/又は当該ボンディングワイヤ(70)に対して隣りの構成部品(11;12)は、シーリングコンパウンド(80)を用いて外部の影響から保護されている請求項1から18迄の何れか1記載の画像形成装置(1)。
- 第1のプリント配線板(10)及び第2のプリント配線板(20)は、共通のハウジング(41)内に設けられている請求項1から19迄の何れか1記載の画像形成装置(1)。
- 請求項1〜請求項20迄の何れか1記載の画像形成装置(1)を備えた自動車の車外のリアビューミラー。
- 請求項1〜請求項20迄の何れか1記載の画像形成装置(1)を備えた自動車。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10259795A DE10259795A1 (de) | 2002-12-19 | 2002-12-19 | Bilderzeugungsvorrichtung zum Einbau im Dachbereich oder im Aussenspiegel eines Kraftfahrzeuges |
PCT/EP2003/013096 WO2004057857A1 (de) | 2002-12-19 | 2003-11-21 | Bilderzeugungsvorrichtung, insbesondere zum einbau im dachbereich oder im aussenspiegel eines kraftfahrzeuges |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006510322A JP2006510322A (ja) | 2006-03-23 |
JP4648706B2 true JP4648706B2 (ja) | 2011-03-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004561175A Expired - Fee Related JP4648706B2 (ja) | 2002-12-19 | 2003-11-21 | 殊に、自動車のルーフ領域内、又は、車外リアビューミラー内に組み込むための、画像形成装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7208716B2 (ja) |
EP (1) | EP1574044B1 (ja) |
JP (1) | JP4648706B2 (ja) |
KR (1) | KR100984882B1 (ja) |
AU (1) | AU2003285343A1 (ja) |
DE (1) | DE10259795A1 (ja) |
WO (1) | WO2004057857A1 (ja) |
Families Citing this family (29)
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DE10210723A1 (de) * | 2002-03-12 | 2003-09-25 | Bosch Gmbh Robert | Spurwechselassistent für Kraftfahrzeuge |
DE202005004675U1 (de) | 2005-03-22 | 2006-08-03 | Mekra Lang Gmbh & Co. Kg | Kamera für den Außenbereich |
CN1937055A (zh) * | 2005-09-20 | 2007-03-28 | 鸿富锦精密工业(深圳)有限公司 | 电路板组件 |
DE102006014247B4 (de) | 2006-03-28 | 2019-10-24 | Robert Bosch Gmbh | Bildaufnahmesystem und Verfahren zu dessen Herstellung |
TWM298226U (en) * | 2006-04-14 | 2006-09-21 | Lite On Semiconductor Corp | Encapsulation structure of optically movement detection |
DE102007057172B4 (de) * | 2007-11-26 | 2009-07-02 | Silicon Micro Sensors Gmbh | Stereokamera zur Umgebungserfassung |
US9350976B2 (en) | 2007-11-26 | 2016-05-24 | First Sensor Mobility Gmbh | Imaging unit of a camera for recording the surroundings with optics uncoupled from a circuit board |
DE102010030960B4 (de) * | 2010-07-06 | 2020-12-10 | Robert Bosch Gmbh | Verfahren zur Herstellung eines schwingungsgedämpften Bauteils |
DE102010031055B4 (de) * | 2010-07-07 | 2023-02-23 | Robert Bosch Gmbh | Sensormodul und Verfahren zum Herstellen eines Sensormoduls |
DE102010062759A1 (de) * | 2010-12-09 | 2012-06-14 | Zf Friedrichshafen Ag | Leiterplattenanordnung |
DE102010062758A1 (de) * | 2010-12-09 | 2012-06-14 | Zf Friedrichshafen Ag | Leiterplattenanordnung |
DE102012019647B4 (de) * | 2012-10-06 | 2021-08-19 | Volkswagen Aktiengesellschaft | Kamera für einen digitalen Rückspiegel, digitaler Rückspiegel und dessen Verwendung in einem Kraftfahrzeug |
DE102012024855A1 (de) * | 2012-12-19 | 2014-06-26 | Connaught Electronics Ltd. | Fahrzeugkamera mit verbesserten thermischen Eigenschaften, Kraftfahrzeug und Verfahren zum Herstellen einer Kamera |
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-
2002
- 2002-12-19 DE DE10259795A patent/DE10259795A1/de not_active Withdrawn
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2003
- 2003-11-21 JP JP2004561175A patent/JP4648706B2/ja not_active Expired - Fee Related
- 2003-11-21 KR KR1020057011494A patent/KR100984882B1/ko active IP Right Grant
- 2003-11-21 WO PCT/EP2003/013096 patent/WO2004057857A1/de active Application Filing
- 2003-11-21 AU AU2003285343A patent/AU2003285343A1/en not_active Abandoned
- 2003-11-21 US US10/538,406 patent/US7208716B2/en not_active Expired - Fee Related
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DE10259795A1 (de) | 2004-07-08 |
KR20050085817A (ko) | 2005-08-29 |
EP1574044A1 (de) | 2005-09-14 |
WO2004057857A1 (de) | 2004-07-08 |
JP2006510322A (ja) | 2006-03-23 |
US7208716B2 (en) | 2007-04-24 |
AU2003285343A1 (en) | 2004-07-14 |
EP1574044B1 (de) | 2017-01-11 |
KR100984882B1 (ko) | 2010-10-01 |
US20060038108A1 (en) | 2006-02-23 |
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