JP4646557B2 - 通信装置 - Google Patents
通信装置 Download PDFInfo
- Publication number
- JP4646557B2 JP4646557B2 JP2004190457A JP2004190457A JP4646557B2 JP 4646557 B2 JP4646557 B2 JP 4646557B2 JP 2004190457 A JP2004190457 A JP 2004190457A JP 2004190457 A JP2004190457 A JP 2004190457A JP 4646557 B2 JP4646557 B2 JP 4646557B2
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- piezoelectric substrate
- wave device
- annular conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
Description
2・・・伝熱性部材
3・・・弾性部材
4・・・圧電基板
5・・・導体バンプ
6・・・配線基板
7・・・弾性表面波装置
Claims (2)
- 筺体と、前記筺体に実装され、送信電力増幅器とアンテナとの間に接続される弾性表面波装置と、を備えた通信装置であって、
前記弾性表面波装置は、タンタル酸リチウムからなる圧電基板の一主面に一対の共通電極を含んで構成されるIDT電極及び前記IDT電極を取り囲む環状導体を有する弾性表面波素子と、前記環状導体に対応して形成された配線基板側環状導体を有し、前記環状導体を前記配線基板側環状導体に接合させることにより前記弾性表面波素子がフリップチップ実装された配線基板と、を含み、
前記環状導体がアース電位とされているとともに、前記一対の共通電極のうち一方の共通電極と前記環状導体とが一体的に形成されており、
前記筺体は、前記圧電基板の幅より大きい幅を有する凸部を有し、
前記圧電基板の他主面全面が前記凸部に当接していることを特徴とする通信装置。 - 前記弾性表面波装置がデュープレクサであることを特徴とする通信装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004190457A JP4646557B2 (ja) | 2004-06-28 | 2004-06-28 | 通信装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004190457A JP4646557B2 (ja) | 2004-06-28 | 2004-06-28 | 通信装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006014095A JP2006014095A (ja) | 2006-01-12 |
JP4646557B2 true JP4646557B2 (ja) | 2011-03-09 |
Family
ID=35780752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004190457A Expired - Fee Related JP4646557B2 (ja) | 2004-06-28 | 2004-06-28 | 通信装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4646557B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4868124B2 (ja) * | 2006-02-22 | 2012-02-01 | セイコーエプソン株式会社 | 弾性表面波共振子 |
JP4881971B2 (ja) * | 2009-03-26 | 2012-02-22 | 株式会社豊田自動織機 | 半導体装置 |
KR101987712B1 (ko) * | 2014-12-04 | 2019-06-11 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치의 제조 방법 및 탄성파 장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04293310A (ja) * | 1991-03-22 | 1992-10-16 | Murata Mfg Co Ltd | 弾性表面波装置 |
JP2000059174A (ja) * | 1998-08-14 | 2000-02-25 | Hitachi Media Electoronics Co Ltd | 弾性表面波分波器及びそれを用いた移動体通信機器 |
JP2000077970A (ja) * | 1998-09-02 | 2000-03-14 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
JP2002353388A (ja) * | 2001-05-30 | 2002-12-06 | Hitachi Ltd | 半導体装置 |
JP2003087093A (ja) * | 2001-09-14 | 2003-03-20 | Matsushita Electric Ind Co Ltd | 弾性表面波フィルタ |
JP2004031854A (ja) * | 2002-06-28 | 2004-01-29 | Matsushita Electric Works Ltd | 放熱構造 |
-
2004
- 2004-06-28 JP JP2004190457A patent/JP4646557B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04293310A (ja) * | 1991-03-22 | 1992-10-16 | Murata Mfg Co Ltd | 弾性表面波装置 |
JP2000059174A (ja) * | 1998-08-14 | 2000-02-25 | Hitachi Media Electoronics Co Ltd | 弾性表面波分波器及びそれを用いた移動体通信機器 |
JP2000077970A (ja) * | 1998-09-02 | 2000-03-14 | Murata Mfg Co Ltd | 電子部品及びその製造方法 |
JP2002353388A (ja) * | 2001-05-30 | 2002-12-06 | Hitachi Ltd | 半導体装置 |
JP2003087093A (ja) * | 2001-09-14 | 2003-03-20 | Matsushita Electric Ind Co Ltd | 弾性表面波フィルタ |
JP2004031854A (ja) * | 2002-06-28 | 2004-01-29 | Matsushita Electric Works Ltd | 放熱構造 |
Also Published As
Publication number | Publication date |
---|---|
JP2006014095A (ja) | 2006-01-12 |
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