JP4642610B2 - 基板位置合わせ装置および基板収容ユニット - Google Patents
基板位置合わせ装置および基板収容ユニット Download PDFInfo
- Publication number
- JP4642610B2 JP4642610B2 JP2005257165A JP2005257165A JP4642610B2 JP 4642610 B2 JP4642610 B2 JP 4642610B2 JP 2005257165 A JP2005257165 A JP 2005257165A JP 2005257165 A JP2005257165 A JP 2005257165A JP 4642610 B2 JP4642610 B2 JP 4642610B2
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- substrate
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- 239000000758 substrate Substances 0.000 title claims description 267
- 230000004308 accommodation Effects 0.000 title claims description 11
- 230000007246 mechanism Effects 0.000 claims description 148
- 238000003825 pressing Methods 0.000 claims description 125
- 238000006243 chemical reaction Methods 0.000 claims description 26
- 239000000872 buffer Substances 0.000 claims description 23
- 238000003860 storage Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 description 30
- 230000008569 process Effects 0.000 description 27
- 230000007723 transport mechanism Effects 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 238000004380 ashing Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000002783 friction material Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005257165A JP4642610B2 (ja) | 2005-09-05 | 2005-09-05 | 基板位置合わせ装置および基板収容ユニット |
TW095132616A TWI421969B (zh) | 2005-09-05 | 2006-09-04 | A substrate alignment device and a substrate storage unit |
CNB2006101289635A CN100446215C (zh) | 2005-09-05 | 2006-09-05 | 基板定位装置和基板收纳单元 |
KR1020060085136A KR100860143B1 (ko) | 2005-09-05 | 2006-09-05 | 기판 위치 맞춤 장치 및 기판 수용 유닛 |
KR1020080042242A KR100952524B1 (ko) | 2005-09-05 | 2008-05-07 | 기판 수용 유닛 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005257165A JP4642610B2 (ja) | 2005-09-05 | 2005-09-05 | 基板位置合わせ装置および基板収容ユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007073646A JP2007073646A (ja) | 2007-03-22 |
JP4642610B2 true JP4642610B2 (ja) | 2011-03-02 |
Family
ID=37859001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005257165A Active JP4642610B2 (ja) | 2005-09-05 | 2005-09-05 | 基板位置合わせ装置および基板収容ユニット |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4642610B2 (zh) |
KR (2) | KR100860143B1 (zh) |
CN (1) | CN100446215C (zh) |
TW (1) | TWI421969B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5501688B2 (ja) * | 2009-07-30 | 2014-05-28 | 東京エレクトロン株式会社 | 基板位置合わせ機構、それを用いた真空予備室および基板処理システム |
JP5582895B2 (ja) * | 2010-07-09 | 2014-09-03 | キヤノンアネルバ株式会社 | 基板ホルダーストッカ装置及び基板処理装置並びに該基板ホルダーストッカ装置を用いた基板ホルダー移動方法 |
TW201514502A (zh) * | 2013-10-03 | 2015-04-16 | Chips Best Technology Co Ltd | 晶片檢測座 |
TW201514516A (zh) * | 2013-10-03 | 2015-04-16 | Chips Best Technology Co Ltd | 晶片自動檢測系統 |
US9929029B2 (en) * | 2015-10-15 | 2018-03-27 | Applied Materials, Inc. | Substrate carrier system |
CN106773157B (zh) * | 2016-12-06 | 2018-08-31 | 友达光电(昆山)有限公司 | 位置校正装置及位置校正方法 |
JP2019102721A (ja) * | 2017-12-06 | 2019-06-24 | エスペック株式会社 | 基板用位置決め装置 |
KR102186594B1 (ko) * | 2020-04-08 | 2020-12-03 | 백철호 | 인쇄회로기판의 자동정렬장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0460636U (zh) * | 1990-09-29 | 1992-05-25 | ||
JPH0927536A (ja) * | 1995-07-10 | 1997-01-28 | Nissin Electric Co Ltd | ロ−ドロック室内に基板位置合わせ機構を有するイオン注入装置 |
JP2000306980A (ja) * | 1993-02-26 | 2000-11-02 | Tokyo Electron Ltd | Lcd用ガラス基板の位置合わせ機構及び真空処理装置 |
JP2001291758A (ja) * | 2000-11-27 | 2001-10-19 | Tokyo Electron Ltd | 真空処理装置 |
JP2002057205A (ja) * | 1991-09-10 | 2002-02-22 | Tokyo Electron Ltd | ロードロック室内の位置合わせ機構及び処理装置及び位置合わせ方法及び搬送方法 |
JP2005116878A (ja) * | 2003-10-09 | 2005-04-28 | Toshiba Corp | 基板支持方法および基板支持装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3260427B2 (ja) * | 1991-09-10 | 2002-02-25 | 東京エレクトロン株式会社 | 真空処理装置及び真空処理装置における基板搬送方法 |
JP3468430B2 (ja) * | 1994-02-15 | 2003-11-17 | 東京エレクトロン株式会社 | 位置検出案内装置、位置検出案内方法及び真空処理装置 |
JPH08288368A (ja) * | 1995-04-14 | 1996-11-01 | Tokyo Electron Ltd | 基板の整列装置および方法 |
JP4030654B2 (ja) * | 1998-06-02 | 2008-01-09 | 大日本スクリーン製造株式会社 | 基板搬送装置 |
JP2003086659A (ja) * | 2001-09-11 | 2003-03-20 | Hirata Corp | 基板の移載装置 |
US20030072639A1 (en) * | 2001-10-17 | 2003-04-17 | Applied Materials, Inc. | Substrate support |
JP2003282684A (ja) * | 2002-03-22 | 2003-10-03 | Olympus Optical Co Ltd | ガラス基板保持具 |
KR101018909B1 (ko) * | 2002-10-25 | 2011-03-02 | 도쿄엘렉트론가부시키가이샤 | 기판 얼라이먼트장치, 기판처리장치 및 기판반송장치 |
TWI226298B (en) * | 2002-11-21 | 2005-01-11 | Hitachi Int Electric Inc | Method for positioning a substrate and inspecting apparatus using same |
JP4479881B2 (ja) * | 2003-09-19 | 2010-06-09 | 株式会社日立ハイテクノロジーズ | 基板スピン処理装置及び基板スピン処理方法 |
-
2005
- 2005-09-05 JP JP2005257165A patent/JP4642610B2/ja active Active
-
2006
- 2006-09-04 TW TW095132616A patent/TWI421969B/zh not_active IP Right Cessation
- 2006-09-05 KR KR1020060085136A patent/KR100860143B1/ko active IP Right Grant
- 2006-09-05 CN CNB2006101289635A patent/CN100446215C/zh active Active
-
2008
- 2008-05-07 KR KR1020080042242A patent/KR100952524B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0460636U (zh) * | 1990-09-29 | 1992-05-25 | ||
JP2002057205A (ja) * | 1991-09-10 | 2002-02-22 | Tokyo Electron Ltd | ロードロック室内の位置合わせ機構及び処理装置及び位置合わせ方法及び搬送方法 |
JP2000306980A (ja) * | 1993-02-26 | 2000-11-02 | Tokyo Electron Ltd | Lcd用ガラス基板の位置合わせ機構及び真空処理装置 |
JPH0927536A (ja) * | 1995-07-10 | 1997-01-28 | Nissin Electric Co Ltd | ロ−ドロック室内に基板位置合わせ機構を有するイオン注入装置 |
JP2001291758A (ja) * | 2000-11-27 | 2001-10-19 | Tokyo Electron Ltd | 真空処理装置 |
JP2005116878A (ja) * | 2003-10-09 | 2005-04-28 | Toshiba Corp | 基板支持方法および基板支持装置 |
Also Published As
Publication number | Publication date |
---|---|
KR100952524B1 (ko) | 2010-04-12 |
CN100446215C (zh) | 2008-12-24 |
TW200721361A (en) | 2007-06-01 |
KR20080059118A (ko) | 2008-06-26 |
TWI421969B (zh) | 2014-01-01 |
CN1929109A (zh) | 2007-03-14 |
KR100860143B1 (ko) | 2008-09-24 |
KR20070026274A (ko) | 2007-03-08 |
JP2007073646A (ja) | 2007-03-22 |
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