TW200721361A - Substrate positioner and substrate containing unit - Google Patents
Substrate positioner and substrate containing unitInfo
- Publication number
- TW200721361A TW200721361A TW095132616A TW95132616A TW200721361A TW 200721361 A TW200721361 A TW 200721361A TW 095132616 A TW095132616 A TW 095132616A TW 95132616 A TW95132616 A TW 95132616A TW 200721361 A TW200721361 A TW 200721361A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- press
- positioner
- pair
- positioners
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a substrate positioner which positions a substrate while making a space around the substrate as small as possible in a container for containing the substrate such as a load lock chamber or the like. The substrate positioner comprises: a pair of positioners 7 which press a pair of ends S1 perpendicular to a transfer direction of a substrate S; and a pair of positioners 8 which press a pair of ends S2 along the transfer direction of the substrate S. The first and second positioners 7, 8 have pressers 70, 80 which press the ends S1, S2 by advance of cylinder mechanisms 71, 81 and pistons 74, 84 of the cylinder mechanisms 71, 81. The first positioner 7 further comprises a driving force conversion mechanism 72 which moves the presser 70 between an evacuation position of evacuating the presser 70 to an outside of a transfer route of the substrate S, and a press position to press the substrate S by advance of the piston 74, and also moves the presser 70 to a press direction at the press position.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005257165A JP4642610B2 (en) | 2005-09-05 | 2005-09-05 | Substrate alignment device and substrate accommodation unit |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200721361A true TW200721361A (en) | 2007-06-01 |
TWI421969B TWI421969B (en) | 2014-01-01 |
Family
ID=37859001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095132616A TWI421969B (en) | 2005-09-05 | 2006-09-04 | A substrate alignment device and a substrate storage unit |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4642610B2 (en) |
KR (2) | KR100860143B1 (en) |
CN (1) | CN100446215C (en) |
TW (1) | TWI421969B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5501688B2 (en) * | 2009-07-30 | 2014-05-28 | 東京エレクトロン株式会社 | Substrate alignment mechanism, vacuum prechamber and substrate processing system using the same |
JP5582895B2 (en) * | 2010-07-09 | 2014-09-03 | キヤノンアネルバ株式会社 | Substrate holder stocker apparatus, substrate processing apparatus, and substrate holder moving method using the substrate holder stocker apparatus |
TW201514516A (en) * | 2013-10-03 | 2015-04-16 | Chips Best Technology Co Ltd | Automatic chip inspection system |
TW201514502A (en) * | 2013-10-03 | 2015-04-16 | Chips Best Technology Co Ltd | Chip inspection base |
WO2017066418A1 (en) * | 2015-10-15 | 2017-04-20 | Applied Materials, Inc. | Substrate carrier system |
CN106773157B (en) * | 2016-12-06 | 2018-08-31 | 友达光电(昆山)有限公司 | Position correction apparatus and method for correcting position |
JP2019102721A (en) * | 2017-12-06 | 2019-06-24 | エスペック株式会社 | Substrate positioning device |
KR102186594B1 (en) * | 2020-04-08 | 2020-12-03 | 백철호 | Automatic alignment device for PCB |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3260427B2 (en) * | 1991-09-10 | 2002-02-25 | 東京エレクトロン株式会社 | Vacuum processing apparatus and substrate transfer method in vacuum processing apparatus |
JPH0751229Y2 (en) * | 1990-09-29 | 1995-11-22 | 大日本スクリーン製造株式会社 | Substrate alignment device |
JP3426222B2 (en) * | 1991-09-10 | 2003-07-14 | 東京エレクトロン株式会社 | Alignment mechanism, processing device and alignment method in load lock chamber |
JP3468430B2 (en) * | 1994-02-15 | 2003-11-17 | 東京エレクトロン株式会社 | Position detection guide device, position detection guide method, and vacuum processing device |
JP3335983B2 (en) * | 1993-02-26 | 2002-10-21 | 東京エレクトロン株式会社 | LCD glass substrate alignment mechanism and vacuum processing device |
JPH08288368A (en) * | 1995-04-14 | 1996-11-01 | Tokyo Electron Ltd | Substrate aligning device and method therefor |
JPH0927536A (en) * | 1995-07-10 | 1997-01-28 | Nissin Electric Co Ltd | Ion implanting device with substrate-aligning mechanism in load-lock room |
JP4030654B2 (en) * | 1998-06-02 | 2008-01-09 | 大日本スクリーン製造株式会社 | Substrate transfer device |
JP4841035B2 (en) * | 2000-11-27 | 2011-12-21 | 東京エレクトロン株式会社 | Vacuum processing equipment |
JP2003086659A (en) * | 2001-09-11 | 2003-03-20 | Hirata Corp | Substrate transfer device |
US20030072639A1 (en) * | 2001-10-17 | 2003-04-17 | Applied Materials, Inc. | Substrate support |
JP2003282684A (en) * | 2002-03-22 | 2003-10-03 | Olympus Optical Co Ltd | Glass board supporting jig |
KR101018909B1 (en) * | 2002-10-25 | 2011-03-02 | 도쿄엘렉트론가부시키가이샤 | Substrate alignment apparatus, substrate processing apparatus and substrate transfer apparatus |
KR100582695B1 (en) * | 2002-11-21 | 2006-05-23 | 가부시키가이샤 히다치 고쿠사이 덴키 | Method for positioning a substrate and inspecting apparatus using same |
JP4479881B2 (en) * | 2003-09-19 | 2010-06-09 | 株式会社日立ハイテクノロジーズ | Substrate spin processing apparatus and substrate spin processing method |
JP2005116878A (en) * | 2003-10-09 | 2005-04-28 | Toshiba Corp | Method and device for supporting substrate |
-
2005
- 2005-09-05 JP JP2005257165A patent/JP4642610B2/en active Active
-
2006
- 2006-09-04 TW TW095132616A patent/TWI421969B/en not_active IP Right Cessation
- 2006-09-05 CN CNB2006101289635A patent/CN100446215C/en active Active
- 2006-09-05 KR KR1020060085136A patent/KR100860143B1/en active IP Right Grant
-
2008
- 2008-05-07 KR KR1020080042242A patent/KR100952524B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI421969B (en) | 2014-01-01 |
JP4642610B2 (en) | 2011-03-02 |
JP2007073646A (en) | 2007-03-22 |
KR100860143B1 (en) | 2008-09-24 |
KR20070026274A (en) | 2007-03-08 |
KR20080059118A (en) | 2008-06-26 |
KR100952524B1 (en) | 2010-04-12 |
CN1929109A (en) | 2007-03-14 |
CN100446215C (en) | 2008-12-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |