TWI421969B - A substrate alignment device and a substrate storage unit - Google Patents
A substrate alignment device and a substrate storage unit Download PDFInfo
- Publication number
- TWI421969B TWI421969B TW095132616A TW95132616A TWI421969B TW I421969 B TWI421969 B TW I421969B TW 095132616 A TW095132616 A TW 095132616A TW 95132616 A TW95132616 A TW 95132616A TW I421969 B TWI421969 B TW I421969B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- pressing
- pushable
- piston
- sliding member
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本發明是有關在處理顯示器(FPD)用的玻璃基板等的基板時,將此基板對位的基板對位裝置、及具備該基板對位裝置的基板收容單元。The present invention relates to a substrate alignment device for aligning a substrate such as a glass substrate for a display (FPD), and a substrate storage unit including the substrate alignment device.
在FPD的製造過程中,於真空狀態下對玻璃基板進行蝕刻或灰化(ashing)、成膜等的處理之真空處理裝置,為使用所謂多處理室型的真空處理裝置,亦即配備用以進行上述處理的複數個真空處理室。In the manufacturing process of the FPD, a vacuum processing apparatus for etching, ashing, or forming a glass substrate in a vacuum state is a vacuum processing apparatus using a so-called multi-processing chamber type, that is, A plurality of vacuum processing chambers that perform the above processing.
在如此的真空處理裝置中,是以在進行真空處理室內的基板的裝載/卸載時不必使真空處理室內回到常壓之方式,利用閘閥經由開閉自如的開口來連接預備真空室的裝載鎖定室至真空處理室。上述處理前的基板是藉由搬送拾取器等的搬送機構,往真空處理室搬送前一旦搬送至裝載鎖定室,在裝載鎖定室內形成與真空處理室同様的真空狀態之後搬送至真空處理室。因此,在裝載鎖定室是以利用搬送機構來將基板搬送至真空處理室內的處理位置能夠正確地進行之方式,將基板對位於所定的位置。In such a vacuum processing apparatus, it is not necessary to return the vacuum processing chamber to normal pressure during loading/unloading of the substrate in the vacuum processing chamber, and the load lock chamber of the preliminary vacuum chamber is connected via the opening and closing opening of the gate valve by the gate valve. To the vacuum processing chamber. The substrate before the above-described processing is transported to the load lock chamber by the transport mechanism such as the transport pick-up device, and is transported to the vacuum processing chamber after being placed in the load lock chamber in a vacuum state in the same manner as the vacuum processing chamber. Therefore, in the load lock chamber, the processing position at which the substrate is transported to the vacuum processing chamber by the transport mechanism can be accurately performed, and the substrate is positioned at a predetermined position.
就利用於如此的基板對位之對位裝置而言,例如有提案具備一對的定位器者,其係可分別推壓裝載鎖定室內的緩衝器(buffer)上所被支持的基板的對向的角部(例如參照專利文獻1)。在此技術中,各定位器(positioner)是具有一對的滾輪(roller)及支持該等的滾輪之支持體,移動於基板的對角線方向,以一對的滾輪來夾持基板的角部之狀態下推壓基板,藉此進行基板的對位。並且,各定位器可退避至下方,使能夠不妨礙基板的搬送。In the case of a positioning device for aligning such a substrate, for example, it is proposed to provide a pair of positioners for respectively pressing the substrates supported on the buffer in the lock chamber. The corner portion (for example, refer to Patent Document 1). In this technique, each positioner is a pair of rollers and a support for supporting the rollers, moving in a diagonal direction of the substrate, and holding the corners of the substrate by a pair of rollers In the state of the portion, the substrate is pressed, thereby aligning the substrate. Further, each of the positioners can be retracted to the lower side so as not to hinder the conveyance of the substrate.
[專利文獻1]特開2000-306980號公報[Patent Document 1] JP-A-2000-306980
但,最近LCD基板有大型化傾向,甚至有一邊為2m的巨大者出現,若配合基板的巨大化來使以往的裝載鎖定室等的處理室大型化,則裝置本身會顯著地巨大化,因此以壓縮處理室內的基板周圍的空間,極力使處理室小型化為方針。但,上述專利文獻1的技術,由於定位器是一對的滾輪被支持於支持體,因此本身不得不形成較大者,且因為移動於對角線方向及上下方向,所以必須要該部份的空間,裝載鎖定室的小型化會受限。However, recently, the LCD substrate has a tendency to increase in size, and even a large one of them has a size of 2 m. When the processing chamber of a conventional load lock chamber or the like is enlarged in accordance with the increase in the size of the substrate, the device itself is significantly enlarged. In order to compress the space around the substrate in the processing chamber, the processing chamber is miniaturized as a guide. However, in the technique of Patent Document 1, since the positioner is a pair of rollers that are supported by the support, it has to be formed larger, and since it is moved in the diagonal direction and the up and down direction, the part is necessary. The space, the miniaturization of the load lock chamber is limited.
本發明是有鑑於上述情事而研發者,其目的是在於提供一種在裝載鎖定室等收容基板的容器內,可極力縮小基板周圍的空間來進行基板的對位之基板對位裝置、及具備該基板對位裝置之基板收容單元。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate alignment device capable of performing alignment of a substrate by minimizing a space around a substrate in a container for housing a substrate such as a lock chamber, and A substrate housing unit of the substrate alignment device.
為了解決上述課題,本發明之基板對位裝置,係使從設置於容器的側壁的開口來搬送於水平方向,且在上述容器內載置於基板載置部的矩形狀基板對位於上述基板載置部上,其特徵為具備:一對的第1推壓機構,其係推壓與基板的搬送方向正交的一對第1端面;及一對的第2推壓機構,其係推壓沿著基板的搬送方向的一對第2端面,上述第1推壓機構及第2推壓機構係分別具有驅動機構、及藉由上述驅動機構的驅動來推壓上述第1端面及第2端面的推壓子,上述一對的第1推壓機構的其中至少一方更具有驅動力變換機構部,其係藉由上述驅動機構的驅動來使上述推壓子移動於使退避至基板的搬送路徑外的退避位置與可推壓基板的可推壓位置之間,且在上述可推壓位置使移動於推壓方向。In order to solve the above problems, the substrate alignment device of the present invention is carried in a horizontal direction from an opening provided in a side wall of the container, and a rectangular substrate pair placed on the substrate mounting portion in the container is located on the substrate. The first portion is provided with a pair of first pressing mechanisms for pressing a pair of first end faces orthogonal to the conveying direction of the substrate, and a pair of second pressing mechanisms for pushing The first pressing mechanism and the second pressing mechanism each have a driving mechanism along the pair of second end faces in the conveying direction of the substrate, and the first end face and the second end face are pressed by driving of the driving mechanism At least one of the pair of first pressing mechanisms further includes a driving force conversion mechanism that moves the pusher to a transport path that is retracted to the substrate by driving of the drive mechanism The outer retracted position is between the pushable position of the pushable substrate, and is moved in the pressing direction at the pushable position.
在本發明的基板對位裝置中,最好上述驅動機構係設置於上述容器外。又,最好上述驅動力變換機構部係設置於基板的搬送路徑的上方或下方,藉由上述驅動機構的驅動,使上述推壓子在基板的搬送路徑的上方或下方移動於在和上述搬送路徑平行的狀態下使退避的退避位置與可推壓基板的可推壓位置之間,且在上述可推壓位置使移動於推壓方向。又,最好上述一對的第1推壓機構的其中至少一方係上述驅動機構為水平且驅動於與基板的搬送方向正交的方向。此情況,最好上述一對的第1推壓機構的其中至少一方係上述驅動機構為具有水平且進退於與基板的搬送方向正交的方向的活塞之汽缸機構,上述驅動力變換機構部,若上述汽缸機構的上述活塞以所定衝程進出,則使上述退避位置的上述推壓子移動於上述可推壓位置,若上述汽缸機構的上述活塞更以所定衝程進出,則使上述可推壓位置的上述推壓子移動於推壓方向,而使上述第1端面能夠被推壓,在該狀態下,若上述汽缸機構的上述活塞以所定衝程退避,則使推壓上述第1端面狀態的上述推壓子移動至上述可推壓位置,若上述汽缸機構的上述活塞更以所定衝程退避,則使上述可推壓位置的上述推壓子移動至上述退避位置。又,此情況,最好上述驅動力變換機構部係具有:引導構件,其係被固定於上述容器內;主動滑動構件,其係與上述汽缸機構的上述活塞的進退一起沿著上述引導構件來滑移於上述活塞的進退方向;從動滑動構件,其係隨著上述主動滑動構件的所定衝程的滑移,沿著上述引導構件來水平且滑移於與主動滑動構件的移動方向正交的方向;及連結構件,其係一端部可轉動地設置於上述從動滑動構件,且在另一端部上述推壓子可轉動地被設置,隨著上述主動滑動構件的所定衝程的滑移,以上述一端部為中心來轉動成傾倒及立起,藉由上述連結構件轉動成傾倒及立起,使上述推壓子移動於上述退避位置與上述可推壓位置之間,藉由上述從動滑動構件滑移,使上述推壓子以上述可推壓位置作為始點及終點來移動於推壓方向及與推壓方向相反的方向。In the substrate alignment device of the present invention, it is preferable that the drive mechanism is provided outside the container. Further, it is preferable that the driving force conversion mechanism is provided above or below the transport path of the substrate, and the pusher moves the upper or lower side of the transport path of the substrate to and from the transport by the drive mechanism. In a state in which the paths are parallel, the retracted retracted position and the pushable position of the pushable substrate are moved, and the pushable position is moved in the pressing direction. Further, it is preferable that at least one of the pair of first pressing mechanisms is horizontal and driven in a direction orthogonal to a conveying direction of the substrate. In this case, it is preferable that at least one of the pair of first pressing mechanisms is a cylinder mechanism having a piston that is horizontal and moves forward and backward in a direction orthogonal to a conveying direction of the substrate, and the driving force conversion mechanism unit When the piston of the cylinder mechanism moves in and out with a predetermined stroke, the pressing force at the retracted position is moved to the pushable position, and when the piston of the cylinder mechanism moves in and out of a predetermined stroke, the pushable position is made The pressing force is moved in the pressing direction, and the first end surface can be pressed. In this state, when the piston of the cylinder mechanism is retracted by a predetermined stroke, the above-mentioned first end surface state is pressed. The pusher moves to the pushable position, and when the piston of the cylinder mechanism is retracted by the predetermined stroke, the pusher at the pushable position is moved to the retracted position. Further, in this case, it is preferable that the driving force conversion mechanism portion includes a guiding member that is fixed in the container, and an active sliding member that is along the guiding member along with the advancement and retreat of the piston of the cylinder mechanism. Sliding in the advancing and retracting direction of the piston; the driven sliding member is horizontally and slid along the guiding member to be orthogonal to the moving direction of the active sliding member along with the slip of the predetermined stroke of the active sliding member And a connecting member rotatably provided at the one end portion of the driven sliding member, and the pressing member is rotatably provided at the other end portion, with the sliding of the predetermined stroke of the active sliding member, The one end portion is pivoted to be tilted and raised, and the connecting member is rotated to be tilted and raised to move the pusher between the retracted position and the pushable position by the driven sliding The member is slid so that the pusher moves in the pressing direction and the direction opposite to the pressing direction by using the pushable position as the start point and the end point.
在以上的本發明之基板對位裝置中,最好上述第1推壓機構及第2推壓機構係分別更具有緩衝手段,其係緩衝上述推壓子在推壓上述第1端面及第2端面時的衝撃。In the above-described substrate alignment device of the present invention, it is preferable that each of the first pressing mechanism and the second pressing mechanism further has a buffering means for buffering the pressing member to press the first end face and the second pressing portion Punching at the end face.
又,本發明係提供一種基板收容單元,係具備:容器,其係具有於側壁設置開口,從上述開口來收容搬送於水平方向的矩形狀基板之基板收容部;基板載置部,其係設置於上述基板收容部,載置被收容於上述基板收容部的基板;及基板對位裝置,其係將載置於上述基板載置部的基板對位於上述基板載置部上,其特徵為:上述基板對位裝置係具備:一對的第1推壓機構,其係推壓與基板的搬送方向正交的一對第1端面;及一對的第2推壓機構,其係推壓沿著基板的搬送方向的一對第2端面,上述第1推壓機構及第2推壓機構係分別具有驅動機構、及藉由上述驅動機構的驅動來推壓上述第1端面及第2端面的推壓子,上述一對的第1推壓機構的其中至少一方更具有驅動力變換機構部,其係藉由上述驅動機構的驅動來使上述推壓子移動於使退避至基板的搬送路徑外的退避位置與可推壓基板的可推壓位置之間,且在上述可推壓位置使移動於推壓方向。Moreover, the present invention provides a substrate storage unit including a container having an opening provided in a side wall, and a substrate housing portion for transporting a rectangular substrate in a horizontal direction from the opening; and a substrate mounting portion a substrate accommodating the substrate accommodating portion is placed on the substrate accommodating portion, and a substrate aligning device is disposed on the substrate placing portion on a substrate pair placed on the substrate mounting portion. The substrate alignment device includes a pair of first pressing mechanisms that press a pair of first end faces orthogonal to the conveying direction of the substrate, and a pair of second pressing mechanisms that push the pressing edge a pair of second end faces in the transport direction of the substrate, the first pressing mechanism and the second pressing mechanism each having a drive mechanism and pressing the first end face and the second end face by driving of the drive mechanism At least one of the pair of first pressing mechanisms further includes a driving force conversion mechanism that moves the pressing member to a path that is retracted to the substrate by the driving of the driving mechanism. of Between a retracted position and the pressing position can be pressed against the substrate, and the moving position of the above may be pressed to the pressing direction.
在本發明的基板收容單元中,最好上述基板載置部係具有抵接於所被搬送的基板背面之可旋轉的球狀滾子。又,最好上述容器係於上下具有2段以上的上述基板收容部。又,最好上述容器為裝載鎖定處理室,其係上述開口分別可開閉地設置於互相對向的側壁,經由各個的上述開口,在真空狀態下對基板施以所定的處理之真空處理處理室內與大氣側可內部連通,在與大氣側進行基板的交接時,內部會被保持於大氣壓附近,且在與上述真空處理處理室進行基板的交接時,內部會被保持於真空狀態。In the substrate housing unit of the present invention, it is preferable that the substrate mounting portion has a rotatable spherical roller that abuts against a back surface of the substrate to be conveyed. Further, it is preferable that the container is a substrate housing portion having two or more stages on the upper and lower sides. Further, it is preferable that the container is a load lock processing chamber in which the openings are openably and closably provided on the opposite side walls, and the vacuum processing chamber is subjected to a predetermined treatment in a vacuum state via the respective openings. The inside of the atmosphere can communicate with the atmosphere. When the substrate is transferred to the atmosphere side, the inside is held near the atmospheric pressure, and when the substrate is transferred to the vacuum processing chamber, the inside is held in a vacuum state.
若利用本發明,則因為是藉由各一對的第1及第2推壓機構來推壓基板的各端面,所以可正確地進行基板的對位,且將第1及第2推壓機構分別藉由個別的驅動機構的驅動,使推壓子能夠推壓基板的端面,並針對推壓基板的搬送路徑亦即與基板的搬送方向正交的第1端面之至少一方的第l推壓機構設置驅動力變換機構部,其係使推壓子移動於使退避至基板的搬送路徑外的退避位置與可推壓基板的可推壓位置之間,且在可推壓位置使移動於推壓方向,而使推壓子能夠從基板的搬送路徑迴避移動,因此可顯著地縮小容器內的對位用構件的設置空間及用以從基板的搬送路徑迴避移動的空間。因此,可極力縮小容器內的基板周圍的空間,進而能夠極力使容器小型化。According to the present invention, since the respective end faces of the substrate are pressed by the pair of first and second pressing mechanisms, the alignment of the substrate can be accurately performed, and the first and second pressing mechanisms can be used. By the driving of the individual drive mechanisms, the pusher can push the end surface of the substrate, and the first push of at least one of the first end faces orthogonal to the transport path of the substrate, that is, the transfer path of the substrate. The mechanism is provided with a driving force conversion mechanism that moves the pusher between the retracted position outside the transport path that is retracted to the substrate and the pushable position of the pushable substrate, and moves to the pushable position at the pushable position. In the pressing direction, the pusher can be prevented from moving from the transport path of the substrate, so that the installation space of the alignment member in the container and the space for avoiding movement from the transport path of the substrate can be remarkably reduced. Therefore, the space around the substrate in the container can be minimized, and the container can be miniaturized as much as possible.
特別是將本發明適用於多處理室型的真空處理裝置中所使用的裝載鎖定處理室時,可極力使裝載鎖定處理室小型化,可迴避隨著基板的大型化而導致真空處理裝置本身顯著巨大化。In particular, when the present invention is applied to a load lock processing chamber used in a multi-processing chamber type vacuum processing apparatus, the load lock processing chamber can be miniaturized as much as possible, and the vacuum processing apparatus itself can be prevented from being significantly increased as the substrate is enlarged. Huge.
以下,一邊參照圖面一邊說明有關本發明的較佳形態。在此,說明有關將本發明的基板對位裝置利用於構成用以對FPD用玻璃基板(以下簡稱為「基板」)S進行電漿處理的多處理室型的電漿處理裝置之裝載鎖定裝置的例子。在此,就FPD而言,例如液晶顯示器(LCD)、發光二極體(LED)顯示器、電激發光(Electro Luminescence;EL)顯示器、螢光顯示管(Vacuum Fluorescent Display;VFD)、電漿顯示器面板(PDP)等。Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Here, a description will be given of a load lock device for a multi-chamber type plasma processing apparatus that is configured to perform plasma treatment on a FPD glass substrate (hereinafter simply referred to as "substrate") S by using the substrate alignment device of the present invention. example of. Here, in terms of the FPD, for example, a liquid crystal display (LCD), a light emitting diode (LED) display, an electroluminescence (EL) display, a fluorescent display (VFD), a plasma display Panel (PDP), etc.
圖1是概略表示本發明之一實施形態的基板對位裝置被適用於裝載鎖定處理室的電漿處理裝置的立體圖,圖2是概略表示其內部的水平剖面圖。1 is a perspective view schematically showing a plasma processing apparatus in which a substrate alignment device according to an embodiment of the present invention is applied to a load lock processing chamber, and FIG. 2 is a horizontal cross-sectional view schematically showing the inside.
此電漿處理裝置1是在其中央部連設有搬送室20及裝載鎖定處理室30。在搬送室20的周圍配設有3個的製程處理室10a、10b、10c。In the plasma processing apparatus 1, a transfer chamber 20 and a load lock processing chamber 30 are connected to a central portion thereof. Three process chambers 10a, 10b, and 10c are disposed around the transfer chamber 20.
在搬送室20與各製程處理室10a、10b、10c之間、搬送室20與裝載鎖定處理室30之間、及連通裝載鎖定處理室30與外側的大氣環境的開口,分別介插有將該等之間予以氣密地密封,且構成可開閉的閘閥22(在此僅圖示搬送室20與各製程處理室10a、10b、10c之間、搬送室20與裝載鎖定處理室30之間)。Openings between the transfer chamber 20 and each of the process chambers 10a, 10b, and 10c, between the transfer chamber 20 and the load lock processing chamber 30, and between the load lock processing chamber 30 and the outside atmosphere are respectively inserted. The airtight seal is provided between the two, and the gate valve 22 is opened and closed (here, only between the transfer chamber 20 and each of the process chambers 10a, 10b, and 10c, and between the transfer chamber 20 and the load lock processing chamber 30) .
在裝載鎖定處理室30的外側設有2個的卡匣索引構件(cassette indexer)41,在其上分別設有收容基板S的卡匣40。在該等卡匣40的一方,例如收容未處理基板,在另一方可收容處理完成基板。Two cassette indexers 41 are provided on the outer side of the load lock processing chamber 30, and cassettes 40 for accommodating the substrate S are respectively provided thereon. For example, one of the cassettes 40 accommodates an unprocessed substrate, and the other substrate can accommodate the processed substrate.
在該等2個卡匣40之間,於支持台44上設有搬送機構43,該搬送機構43具備:上下2段設置的拾取器45、45,及使該等的拾取器45、45能夠個別地進退,且可一起旋轉及昇降地支持的基座47。Between the two cassettes 40, a transfer mechanism 43 is provided on the support table 44. The transfer mechanism 43 includes pickers 45 and 45 provided in two stages, and enables the pickers 45 and 45. The base 47 that is advanced and retracted individually and can be rotated and lifted together.
上述製程處理室10a、10b、10c是其內部空間可保持於所定的減壓環境,在其內部進行電漿處理、例如蝕刻處理或灰化處理。由於具有3個製程處理室,因此例如其中2個的製程處理室可作為蝕刻處理室,剩下的1個製程處理室可作為灰化處理室,或者3個製程處理室全作為進行同一處理的蝕刻處理室或灰化處理室。另外,製程處理室的數量並非限於3個,亦可為4個以上。The process chambers 10a, 10b, and 10c have their internal spaces maintained in a predetermined reduced pressure environment, and are subjected to plasma treatment, for example, etching treatment or ashing treatment. Since there are three processing chambers, for example, two of the processing chambers can be used as an etching processing chamber, and the remaining one processing chamber can be used as an ashing processing chamber, or three processing chambers are all used for the same processing. Etching the processing chamber or the ashing chamber. Further, the number of process chambers is not limited to three, and may be four or more.
搬送室20是與真空處理室同様可保持於所定的減壓環境,其中如圖2所示,配設有搬送裝置50。然後,藉由此搬送裝置50,在裝載鎖定處理室30及3個製程處理室10a、10b、10c之間搬送基板S。搬送機構50是具備:上下2段設置的拾取器51、51(圖2中僅顯示上段)、及使該等的拾取器51、51能夠個別地進退,且可一起旋轉及昇降地支持的基座52。The transfer chamber 20 can be held in a predetermined reduced pressure environment in the same manner as the vacuum processing chamber. As shown in Fig. 2, a transfer device 50 is disposed. Then, the substrate S is transferred between the load lock processing chamber 30 and the three process chambers 10a, 10b, and 10c by the transport device 50. The transport mechanism 50 includes pickers 51 and 51 (only the upper stage is shown in FIG. 2) provided in the upper and lower stages, and a base that allows the pickers 51 and 51 to advance and retreat individually and can be rotated and lifted together. Block 52.
裝載鎖定處理室30是與各製程處理室10及搬送室20同様可保持於所定的減壓環境。並且,裝載鎖定處理室30是用以在處於大氣環境的卡匣40與減壓環境的製程處理室10a、10b、10c之間進行基板S的收受者,基於重複大氣環境及減壓環境的關係,其內容積會被極力地構成小。The load lock processing chamber 30 can be held in a predetermined reduced pressure environment in the same manner as each of the processing chamber 10 and the transfer chamber 20. Further, the load lock processing chamber 30 is for accepting the substrate S between the cassette 40 in the atmospheric environment and the processing chambers 10a, 10b, and 10c in the decompression environment, based on the relationship between the repeated atmospheric environment and the decompression environment. The content of the product will be composed as small as possible.
裝載鎖定處理室30是基板收容部31為設成上下2段(圖2中僅顯示上段),在各基板收容部31中設有載置基板S予以支持的複數個緩衝器(基板載置部)32。在該等緩衝器32之間形成有搬送基板S時之拾取器45、51的逃離溝32a。又,以能夠對應於各基板收容部31之方式,在裝載鎖定處理室30中設有在矩形狀基板S的互相對向的角部附近進行對位的第1及第2定位器(第1及第2推壓機構)7、8。有關裝載鎖定處理室30及第1及第2定位器7、8會在往後詳細説明。In the load lock processing chamber 30, the substrate accommodating portion 31 is provided in two stages (only the upper stage is shown in FIG. 2), and each of the board accommodating portions 31 is provided with a plurality of buffers (substrate mounting portions) for supporting the substrate S. ) 32. An escape groove 32a of the pickups 45, 51 when the substrate S is conveyed is formed between the buffers 32. In addition, the first and second positioners that are aligned in the vicinity of the corner portions of the rectangular substrate S that face each other are provided in the load lock processing chamber 30 so as to be able to correspond to the respective substrate housing portions 31 (first And the second pressing mechanism 7 and 8. The load lock processing chamber 30 and the first and second positioners 7 and 8 will be described in detail later.
電漿處理裝置1的各構成部是形成連接至控制部60來控制的構成(圖1中圖示省略)。圖3是表示控制部60的概要。控制部60是具有具備CPU的製程控制器61,在此製程控制器61連接有由鍵盤或顯示器等所構成的使用者介面62,該鍵盤是為了工程管理者管理電漿處理裝置1而進行指令的輸入操作等者,該顯示器是使電漿處理裝置1的作動狀況可視化而顯示者。Each component of the plasma processing apparatus 1 is configured to be connected to the control unit 60 and controlled (not shown in FIG. 1). FIG. 3 is an outline showing the control unit 60. The control unit 60 has a process controller 61 including a CPU, and the process controller 61 is connected to a user interface 62 composed of a keyboard or a display for instructing the project manager to manage the plasma processing apparatus 1. In the input operation or the like, the display is displayed by visualizing the operation state of the plasma processing apparatus 1.
又,控制部60具有儲存方法(recipe)的記憶部63,該方法記錄有以製程控制器61的控制來實現執行於電漿處理裝置1的各種處理之控制程式(軟體)或處理條件資料等,此記憶部63是被連接至製程控制器61。Further, the control unit 60 has a storage unit 63 that stores a control program (software) or processing condition data that is executed by the process controller 61 to perform various processes performed by the plasma processing device 1. This memory portion 63 is connected to the process controller 61.
然後,因應所需,以來自使用者介面62的指示等,從記憶部63來叫出任意的方法(recipe),而使執行於製程控制器61,在製程控制器61的控制下進行電漿處理裝置1的所望處理。Then, in response to an instruction from the user interface 62, an arbitrary method is called from the memory unit 63, and is executed in the process controller 61 to perform plasma under the control of the process controller 61. The desired processing of the processing device 1.
上述控制程式或處理條件資料等的方法(recipe)可利用儲存於電腦可讀取的記憶媒體,例如CD-ROM、硬碟、軟碟、快閃記憶體等的狀態者,或從其他的裝置,例如經由專用線路來隨時傳送以連線利用者。The above-mentioned control program or processing condition data (recipe) may be stored in a computer-readable memory medium such as a CD-ROM, a hard disk, a floppy disk, a flash memory, or the like, or from another device. For example, it is transmitted at any time via a dedicated line to connect users.
其次,詳細說明有關本實施形態的基板對位裝置、及具備基板對位裝置的裝載鎖定處理室30。Next, the substrate alignment device of the present embodiment and the load lock processing chamber 30 including the substrate alignment device will be described in detail.
圖4是表示裝載鎖定處理室30的一部份切開的立體圖。4 is a perspective view showing a portion of the load lock processing chamber 30 cut away.
裝載鎖定處理室30的各基板收容部31是在對向於基板S的搬送方向(Y方向)的側壁分別具有可藉由閘閥22來與搬送室20連通的開口33、及與外側的大氣環境連通的開口34,至少在開口34的閉塞時,內部可減壓至所定的減壓環境,例如可減壓至真空狀態。在各基板收容部31,藉由搬送機構43或50來搬送於水平或大致水平的基板S會經由開口34或33來收容至各基板收容部31內,以能夠跨越複數個緩衝器32上的方式載置。Each of the substrate accommodating portions 31 of the load lock processing chamber 30 has an opening 33 that can communicate with the transfer chamber 20 via the gate valve 22, and an atmosphere surrounding the outside, in the side wall facing the substrate S in the transport direction (Y direction). The communicating opening 34, at least when the opening 34 is closed, can be internally decompressed to a predetermined reduced pressure environment, for example, can be depressurized to a vacuum state. In each of the substrate accommodating portions 31, the substrate S that is transported to the horizontal or substantially horizontal by the transport mechanism 43 or 50 is accommodated in each of the substrate accommodating portions 31 via the openings 34 or 33 so as to be able to span the plurality of buffers 32. The method is placed.
在複數個緩衝器32中,例如設置於與基板的搬送方向正交的水平方向(X方向)的中央部之緩衝器32的上端部,抵接於所被搬送的基板S的背面之可旋轉的球狀滾子35會具有所定的間隔來設置複數個,例如在X方向外側的緩衝器32的上端部,抵接於所被搬送的基板S的角部的背面之支持銷36會被設置於Y方向兩端部。藉此,被載置於複數個緩衝器32上的基板可藉由球狀滾子35的旋轉來移動於緩衝器32上的同時,可藉由與支持銷36的摩擦來靜止於緩衝器32上。In the plurality of dampers 32, for example, the upper end portion of the damper 32 provided at the center portion in the horizontal direction (X direction) orthogonal to the transport direction of the substrate is in contact with the back surface of the substrate S to be transported. The spherical rollers 35 are provided at a predetermined interval, for example, at the upper end portion of the buffer 32 on the outer side in the X direction, and the support pin 36 abutting on the back surface of the corner portion of the substrate S to be conveyed is set. At both ends of the Y direction. Thereby, the substrate placed on the plurality of buffers 32 can be moved on the buffer 32 by the rotation of the spherical roller 35, and can be stationary at the buffer 32 by friction with the support pin 36. on.
第1定位器7是用以推壓與收容於基板收容部31內的基板S的Y方向正交或大致正交的端面S1者,具備:推壓端面S1的推壓子70、及用以使推壓子70移動的汽缸機構(驅動機構)71、及介於推壓子70與汽缸機構71之間,將汽缸機構71的驅動力予以方向變換而傳達至推壓子70的驅動力變換機構部72。第2定位器8是用以推壓與收容於基板收容部31內的基板S的X方向正交或大致正交的端面S2者,具備:推壓端面S2的推壓子80、及用以使推壓子80移動的汽缸機構(驅動機構)81。第1定位器7及第2定位器8是分別設置於基板收容部31的對向之2個的角部附近,且設置於上下的基板收容部31,31間相異的角部附近。第1及第2定位器7、8是構成基板對位裝置,裝載鎖定處理室30、設置於裝載鎖定處理室30內的基板收容部31的緩衝器32、及基板對位裝置是構成基板收容單元。The first positioner 7 is for pressing the end surface S1 orthogonal to or substantially perpendicular to the Y direction of the substrate S accommodated in the substrate housing portion 31, and includes a pressing member 70 for pressing the end surface S1, and The cylinder mechanism (drive mechanism) 71 that moves the pusher 70 and the driving force that is transmitted between the pusher 70 and the cylinder mechanism 71 to change the driving force of the cylinder mechanism 71 to the pusher 70 Mechanism unit 72. The second positioner 8 is for pressing the end surface S2 orthogonal to or substantially orthogonal to the X direction of the substrate S accommodated in the substrate housing portion 31, and includes a pressing member 80 for pressing the end surface S2, and A cylinder mechanism (drive mechanism) 81 that moves the pusher 80. The first positioner 7 and the second positioner 8 are provided in the vicinity of the opposite corner portions of the substrate accommodating portion 31, and are provided in the vicinity of the corner portions of the upper and lower substrate accommodating portions 31 and 31. The first and second positioners 7 and 8 constitute a substrate aligning device, and the load lock processing chamber 30, the damper 32 provided in the substrate accommodating portion 31 in the load lock processing chamber 30, and the substrate aligning device constitute a substrate accommodating device. unit.
汽缸機構71是被載置於裝載鎖定處理室30的基板收容部31外,更具體而言,以能夠和載置於緩衝器32上的基板S大致同高的方式,從與裝載鎖定處理室30或基板收容部31的X方向正交的側壁來突出至裝載鎖定處理室30外而設置之具有延伸於X方向的汽缸本體73及可進退於該汽缸本體73的活塞74之電動汽缸所構成(亦參照圖5~8、10~12),藉由步進馬達來將電氣能量變換成力學能量,使活塞74對汽缸本體73進退所定量者。The cylinder mechanism 71 is placed outside the substrate housing portion 31 of the load lock processing chamber 30, and more specifically, from the load lock processing chamber so as to be substantially at the same height as the substrate S placed on the buffer 32. 30 or an electric cylinder in which the side wall of the substrate accommodating portion 31 orthogonal to the X direction protrudes to the outside of the load lock processing chamber 30 and is provided with a cylinder main body 73 extending in the X direction and a piston 74 retractable from the cylinder main body 73. (See also FIGS. 5-8, 10-12), the electric energy is converted into mechanical energy by a stepping motor, and the piston 74 is allowed to advance or retreat to the cylinder body 73.
如圖5~9所示(圖5是表示驅動力變換機構部72的分解立體圖,圖6是用以說明驅動力變換機構部72的作動之第1階段的立體圖,圖7是用以說明驅動力變換機構部72的作動之第2階段的立體圖,圖8是用以說明驅動力變換機構部72的作動之第3階段的立體圖,圖9是表示驅動力變換機構部72的一部份切開的平面圖),驅動力變換機構部72具備:被固定於基板收容部31內的底面之板狀的引導構件75、及可滑移於X方向安裝於引導構件75的主動滑動構件76、及可滑移於Y方向安裝於引導構件75的從動滑動構件77、及一端部以Y方向作為軸可轉動地設置於從動滑動構件77,在另一端部推壓子70可轉動地設置之一對的連結構件78、79。5 to 9 (Fig. 5 is an exploded perspective view showing the driving force conversion mechanism unit 72, Fig. 6 is a perspective view for explaining the first stage of the actuation of the driving force conversion mechanism unit 72, and Fig. 7 is a view for explaining the driving. FIG. 8 is a perspective view for explaining the third stage of the actuation of the driving force conversion mechanism unit 72, and FIG. 9 is a partial cut showing the driving force conversion mechanism unit 72. FIG. In the plan view, the driving force conversion mechanism unit 72 includes a plate-shaped guide member 75 fixed to the bottom surface of the substrate housing portion 31, and an active sliding member 76 that is slidably attached to the guiding member 75 in the X direction, and The driven sliding member 77 that is attached to the guiding member 75 in the Y direction and one end portion are rotatably provided to the driven sliding member 77 in the Y direction as a shaft, and the pusher 70 is rotatably provided at the other end portion. Pair of connecting members 78, 79.
主動滑動構件76具有延伸於X方向的形狀,在Y方向具一間隔一對的滑動部760會被設置於X方向中間部。在滑動部760的底面分別形成有延伸於X方向的滑動溝761(僅圖示一方),滑動溝761可滑動嵌入形成於引導構件75之延伸於X方向的X方向引導部751,藉此主動滑動構件76是安裝於可滑移於X方向的引導構件75。至少滑動溝761部份會以低摩擦材料所形成,使滑動部760能夠容易沿著X方向引導部751滑動。在X方向引導部751的兩端部分別設有規制滑動部760的滑動之阻擋部753。The active sliding member 76 has a shape extending in the X direction, and a sliding portion 760 having a pair in the Y direction is provided in the intermediate portion in the X direction. A sliding groove 761 (only one of which is shown) extending in the X direction is formed on the bottom surface of the sliding portion 760, and the sliding groove 761 is slidably fitted into the X-direction guiding portion 751 formed in the guiding direction of the guiding member 75 in the X direction. The sliding member 76 is attached to the guiding member 75 that is slidable in the X direction. At least the portion of the sliding groove 761 is formed of a low friction material, so that the sliding portion 760 can easily slide along the X direction guiding portion 751. A sliding barrier portion 753 that regulates the sliding of the sliding portion 760 is provided at each end portion of the X-direction guiding portion 751.
在主動滑動構件76的X方向一端部形成有卡合凹部765,此卡合凹部765會與形成於活塞74的前端部的卡合溝740卡合於X方向,因此主動滑動構件76會連接至汽缸機構71的活塞74,藉此,主動滑動構件76會隨著活塞74的進退動作而滑移於X方向。An engaging recessed portion 765 is formed at one end portion of the active sliding member 76 in the X direction, and the engaging recessed portion 765 is engaged with the engaging groove 740 formed at the front end portion of the piston 74 in the X direction, so that the active sliding member 76 is connected to The piston 74 of the cylinder mechanism 71, whereby the active sliding member 76 slides in the X direction as the piston 74 moves forward and backward.
從動滑動構件77具有延伸於X方向的形狀,在X方向具一間隔設有一對的滑動部770。在滑動部770的底面分別形成有延伸於Y方向的滑動溝771,滑動溝771可滑動地嵌入延伸於Y方向的Y方向引導部752,該Y方向引導部752是形成於比引導構件75的X方向引導部751更靠基板收容部31的Y方向中央,藉此從動滑動構件77會比主動滑動構件76更靠基板收容部31的Y方向中央設置,安裝於可滑移於Y方向的引導構件75。至少滑動構771部份會以低摩擦材料所形成,使滑動部770能夠容易沿著Y方向引導部752滑動。在Y方向引導部752的兩端部分別設有規制滑動部770的滑動之阻擋部753。The driven sliding member 77 has a shape extending in the X direction, and a pair of sliding portions 770 are provided at intervals in the X direction. A sliding groove 771 extending in the Y direction is formed on the bottom surface of the sliding portion 770, and the sliding groove 771 is slidably fitted in the Y-direction guiding portion 752 extending in the Y direction, and the Y-direction guiding portion 752 is formed on the guiding member 75. The X-direction guide portion 751 is further in the center of the Y-direction of the substrate accommodating portion 31, whereby the driven sliding member 77 is disposed closer to the center of the substrate accommodating portion 31 in the Y direction than the active sliding member 76, and is attached to the Y-direction. Guide member 75. At least the sliding portion 771 portion is formed of a low friction material, so that the sliding portion 770 can easily slide along the Y direction guiding portion 752. A sliding portion 753 that regulates the sliding of the sliding portion 770 is provided at each of both end portions of the Y-direction guide portion 752.
主動滑動構件76是在靠基板收容部31的Y方向中央的滑動部760一體設有推壓板部762,該推壓板部762是以能夠和X方向及Y方向大致呈45度的角度之方式往基板收容部31的外側延伸。從動滑動構件77是在上面設有例如往高度方向延伸的圓柱狀的被推壓部772。然後,藉由活塞74的所定衝程(stroke)的進出,主動滑動構件76往X方向靠中央滑移時,推壓板部762會抵接於被推壓部772而推壓被推壓部772,藉此從動滑動構件77會往Y方向靠中央滑動(特別是參照圖7、8)。The active sliding member 76 is integrally provided with a pressing plate portion 762 that is at an angle of substantially 45 degrees with respect to the X direction and the Y direction in the sliding portion 760 at the center of the substrate housing portion 31 in the Y direction. The outer side of the substrate housing portion 31 extends. The driven sliding member 77 is provided with a cylindrical pressing portion 772 extending upward in the height direction, for example. Then, when the active sliding member 76 slides toward the center in the X direction by the predetermined stroke of the piston 74, the pressing plate portion 762 abuts against the pressed portion 772 and pushes the pressed portion 772. Thereby, the driven sliding member 77 slides in the center in the Y direction (see, in particular, FIGS. 7 and 8).
在從動滑動構件77與引導構件75的X方向兩端部分別連接有拉伸線圈彈簧754,從動滑動構件77會藉由拉伸線圈彈簧754來往基板收容部31的Y方向外側作動。藉此,主動滑動構件76藉由活塞74的所定衝程的退避而往基板收容部31的X方向外側滑移時,往基板收容部31的Y方向靠中央滑移的從動滑動構件77會往基板收容部31的Y方向外側滑移。The tension coil spring 754 is connected to each of the both ends of the driven sliding member 77 and the guiding member 75 in the X direction, and the driven sliding member 77 is moved outward in the Y direction of the substrate housing portion 31 by the tension coil spring 754. When the active sliding member 76 is slid outward in the X direction of the substrate accommodating portion 31 by the retraction of the predetermined stroke of the piston 74, the driven sliding member 77 that slides toward the center in the Y direction of the substrate accommodating portion 31 will go to The substrate housing portion 31 slides outward in the Y direction.
一對的連結構件78、79是以一端部的轉動軸能夠並列於X方向的方式,設置於比從動滑動構件77的被推壓部772更靠基板收容部31的X方向中央,一方往另一方彎曲成V字狀而形成平行四邊形狀。在連結構件78設有往基板收容部31的Y方向外側延伸的圓柱或圓筒狀的凸輪部780,凸輪部780會進入形成於主動滑動構件76的X方向另一端部的凸輪孔763。凸輪孔763是具有Y方向剖面為延伸於上下的形狀,一對的連結構件78、79是在主動滑動構件76滑移時,凸輪部780會沿著凸輪孔763而變位於上下,藉此轉動而立起及使連結構件78能夠倒向下側(特別是參照圖6、7)。並且,凸輪孔763是具有Y方向剖面為從上端部往基板收容部31的X方向外側延伸的形狀,當主動滑動構件76及從動滑動構件77分別滑移至X方向及Y方向時,凸輪部780會保持進入凸輪孔763,使立起的一對連結構件78、79也能夠和從動滑動構件77一起移動於Y方向(特別是參照圖7、8)。藉此,可在使一對的連結構件78、79立起的狀態下確實地支持。The pair of connecting members 78 and 79 are provided so as to be parallel to the X direction in the rotation axis of the one end portion, and are provided in the center of the X direction of the substrate housing portion 31 from the pressed portion 772 of the driven sliding member 77. The other side is bent into a V shape to form a parallelogram shape. The connecting member 78 is provided with a cylindrical or cylindrical cam portion 780 extending outward in the Y direction of the substrate housing portion 31, and the cam portion 780 enters the cam hole 763 formed in the other end portion of the active sliding member 76 in the X direction. The cam hole 763 has a shape in which the cross section in the Y direction extends upward and downward, and when the pair of coupling members 78 and 79 are slipped by the active sliding member 76, the cam portion 780 is moved up and down along the cam hole 763, thereby rotating The standing member 78 can be raised and lowered to the lower side (see, in particular, FIGS. 6 and 7). Further, the cam hole 763 has a shape in which the Y-direction cross section extends outward from the upper end portion in the X direction of the board housing portion 31, and when the active sliding member 76 and the driven sliding member 77 are respectively slid to the X direction and the Y direction, the cam hole The portion 780 is held in the cam hole 763, so that the pair of standing members 78 and 79 that stand up can also move in the Y direction together with the driven sliding member 77 (see, in particular, FIGS. 7 and 8). Thereby, it is possible to reliably support the pair of connecting members 78 and 79 in a state where they are raised.
凸輪部780可藉由複數個滾珠軸承(ball bearing)781來旋轉(參照圖9),藉此可順暢地相對變位於凸輪孔763內。另外,亦可將凸輪部設置於連結構件79,而取代設置於連結構件78,或將凸輪部設置於主動滑動構件76,將凸輪孔設置於連結構件78或79。凸輪部780及凸輪孔763是構成凸輪機構,一對的連結構件78、79是在主動滑動構件76滑移時,藉由凸輪機構來轉動而立起及傾倒。The cam portion 780 is rotatable by a plurality of ball bearings 781 (refer to FIG. 9), whereby it can be smoothly displaced relative to the cam hole 763. Further, the cam portion may be provided in the connecting member 79 instead of being provided in the connecting member 78, or the cam portion may be provided in the active sliding member 76, and the cam hole may be provided in the connecting member 78 or 79. The cam portion 780 and the cam hole 763 constitute a cam mechanism, and the pair of coupling members 78 and 79 are erected and tilted by the cam mechanism when the active sliding member 76 slips.
在連結構件79及從動滑動構件77連接有位伸線圈彈簧755,使一對的連結構件78、79能夠藉由拉伸線圈彈簧755而立起。藉此,傾倒後的一對連結構件78、79在主動滑動構件76藉由活塞74的所定衝程的進出來往基板收容部31的X方向靠中央滑移時,會藉由拉伸線圈彈簧755來輔助立起。另外,亦可取代拉伸線圈彈簧755,使用壓縮線圈彈簧,而使能夠藉由壓縮線圈彈簧來輔助立起的一對連結構件78、79傾倒。The positioning coil spring 755 is connected to the coupling member 79 and the driven sliding member 77, so that the pair of coupling members 78 and 79 can be raised by the tension coil spring 755. Thereby, the pair of connecting members 78 and 79 after the tilting of the active sliding member 76 in the X direction of the substrate housing portion 31 by the predetermined stroke of the piston 74 are caused by the tension coil spring 755. Auxiliary stand up. Further, instead of the tension coil spring 755, the compression coil spring may be used to cause the pair of coupling members 78 and 79 that can be raised by the compression coil spring to be tilted.
推壓子70具有:抵接於基板S的端面S1來推壓端面S1的推壓本體700、及可分別轉動地安裝於連結構件78、79的另一端部之轉動板701、及連結推壓本體700及轉動板701之延伸於Y方向的連結部702。推壓子70是在一對的連結構件78、79立起時,位於與緩衝器32上所被載置的基板S大致相等高度(可推壓位置),在一對的連結構件78、79傾倒時,仍舊保持和基板S平行的狀態下,使能夠位於比緩衝器32上所被載置的基板S更下方(退避位置)。The pusher 70 has a pressing body 700 that presses the end surface S1 of the substrate S to press the end surface S1, and a rotating plate 701 that is rotatably attached to the other end of the connecting members 78 and 79, and a connecting push The main body 700 and the rotating plate 701 extend in the Y-direction connecting portion 702. When the pair of connecting members 78 and 79 are raised, the pusher 70 is located at substantially the same height (a pressable position) as the substrate S placed on the damper 32, and the pair of connecting members 78 and 79 At the time of pouring, in a state of being kept parallel to the substrate S, it is possible to be located below the substrate S on which the buffer 32 is placed (retracted position).
推壓本體700是使用不會對抵接的基板S的端面S1產生損傷或破壞,且不易因與基板S接觸而發生微粒子之材質所形成。例如,可使用具有一定的彈性之合成樹脂等的材質者,更合適是可使用聚四氟乙烯(Poly-tetrafluoroethylene)等的氟系樹脂。又,由提高對位的精度之觀點來看,推壓本體700是推壓面為形成圓弧狀,而使在水平方向上能夠點接觸於基板S的端面S1。又,推壓本體700亦可為以高度方向為軸之例如圓柱狀的旋轉體。The pressing body 700 is formed by using a material that does not cause damage or breakage to the end surface S1 of the substrate S that is in contact with the substrate S, and is less likely to be generated by contact with the substrate S. For example, a material such as a synthetic resin having a certain elasticity can be used, and a fluorine-based resin such as poly-tetrafluoroethylene can be preferably used. Moreover, from the viewpoint of improving the accuracy of the alignment, the pressing body 700 has an end surface S1 in which the pressing surface is formed in an arc shape so as to be in point contact with the substrate S in the horizontal direction. Further, the pressing body 700 may be a rotating body that is, for example, a columnar shape with the height direction as an axis.
連結部702是在外筒構件703內插入內筒構件704而止拔,在外筒構件703及內筒構件704內配置有壓縮線圈彈簧705。亦即,連結部702可伸縮,且藉由壓縮線圈彈簧705來彈壓於伸張方向,具有作為緩和推壓本體700在推壓基板S的端面S1時的衝撃之緩衝手段的機能。In the connecting portion 702, the inner tubular member 704 is inserted into the outer tubular member 703 to be stopped, and the compression coil spring 705 is disposed in the outer tubular member 703 and the inner tubular member 704. That is, the connecting portion 702 is expandable and contractible, and is biased in the extending direction by the compression coil spring 705, and has a function as a buffering means for relieving the pressing of the pressing body 700 when pressing the end surface S1 of the substrate S.
又,驅動力變換機構部72亦可例如將引導構件75固定於基板收容部31的上面,而設成上下相反。此情況,推壓子70是在一對的連結構件78、79立起,位於與緩衝器32上所被載置的基板S大致相等的高度(可推壓位置),在一對的連結構件78、79傾倒時,仍舊保持和基板S平行的狀態下,使能夠位於比緩衝器32上所被載置的基板S更上方(退避位置)。Further, the driving force conversion mechanism unit 72 may be fixed to the upper surface of the substrate housing portion 31, for example, and may be vertically opposed. In this case, the pressing member 70 is raised at a pair of connecting members 78 and 79, and is located at a height (a pressable position) substantially equal to the substrate S placed on the damper 32, and a pair of connecting members. When the 78 and 79 are tilted, the substrate S can be placed above the substrate S placed on the buffer 32 (retracted position) while still being parallel to the substrate S.
如圖10~12所示,第2定位器8是藉由電動汽缸機構,亦即汽缸機構81所構成,其係設置於裝載鎖定處理室30的基板收容部31外,更具體而言,具有:以能夠形成和緩衝器32的下端部大致相同高度之方式,從與裝載鎖定處理室30或基板收容部31的X方向正交的側壁來突出設置於裝載鎖定處理室30外之延伸於X方向的汽缸本體83、及可進退地設置於該汽缸本體83的活塞84。並且,推壓子80會被設置於活塞84的前端部。As shown in FIGS. 10 to 12, the second positioner 8 is constituted by an electric cylinder mechanism, that is, a cylinder mechanism 81, which is provided outside the substrate housing portion 31 of the load lock processing chamber 30, and more specifically, has : extending from the side wall orthogonal to the X direction of the load lock processing chamber 30 or the substrate housing portion 31 to the outside of the load lock processing chamber 30 so as to be formed at substantially the same height as the lower end portion of the bumper 32 The cylinder body 83 in the direction and the piston 84 provided in the cylinder body 83 are retractable. Further, the pusher 80 is provided at the front end portion of the piston 84.
又,一對的汽缸機構71的其中一方、及一對的汽缸機構81的其中一方,可取代電動汽缸,分別為空氣壓汽缸等的其他汽缸。又,使推壓子70、80移動的驅動機構,除了汽缸機構71、81以外,只要能夠進退驅動於X方向,且在任意的X方向位置停止即可,不論其作動原理或種類如何,例如可為電磁石馬達、螺線管(solenoid)、壓電元件等。Further, one of the pair of cylinder mechanisms 71 and one of the pair of cylinder mechanisms 81 may be replaced by other cylinders such as air cylinders instead of the electric cylinders. Further, the drive mechanism for moving the pushers 70 and 80 may be driven in the X direction in addition to the cylinder mechanisms 71 and 81, and may be stopped in any X direction regardless of the principle or type of operation, for example. It can be an electromagnet motor, a solenoid, a piezoelectric element, or the like.
推壓子80是與推壓子70的推壓本體700同様地,使用不會對抵接的基板S的端面S2產生損傷或破壞,且不易因與基板S接觸而發生微粒子之材質所形成,且推壓面為形成圓弧狀,而使能夠在水平方向上點接觸於基板S的端面S2。又,推壓子80亦可為以高度方向為軸之例如圓柱狀的旋轉體。又,最好經由連結部702之類的緩衝手段來連結推壓子80與活塞84,而使能夠緩和推壓子80在推壓基板S的端面S2時之衝撃。The pusher 80 is formed in the same manner as the pressing body 700 of the pusher 70, and is formed by using a material that does not cause damage or breakage of the end surface S2 of the substrate S that is in contact with the substrate S, and is not easily caused by contact with the substrate S. Further, the pressing surface is formed in an arc shape so as to be in contact with the end surface S2 of the substrate S in the horizontal direction. Further, the pusher 80 may be a rotating body that is, for example, a columnar shape with the height direction as an axis. Further, it is preferable to connect the pusher 80 and the piston 84 via a cushioning means such as the joint portion 702, and it is possible to alleviate the flushing of the pusher 80 when pressing the end surface S2 of the substrate S.
根據如此的構成,第2定位器8可藉由汽缸機構81的活塞84的進出來使推壓子80移動至靠基板收容部31的X方向中央,藉由汽缸機構81的活塞84的退避來使推壓子80移動至基板收容部31的X方向外側。According to such a configuration, the second positioner 8 can move the pusher 80 to the center of the substrate accommodating portion 31 in the X direction by the movement of the piston 84 of the cylinder mechanism 81, and the piston 84 of the cylinder mechanism 81 can be retracted. The pusher 80 is moved to the outside in the X direction of the substrate housing portion 31.
其次,一邊參照圖10~12一邊說明有關基板對位裝置之基板的對位方法。圖10是用以說明基板對位裝置的作動的第1階段,圖11是用以說明基板對位裝置的作動的第2階段,圖12是用以說明基板對位裝置的作動的第3階段。Next, a method of aligning the substrate of the substrate alignment device will be described with reference to FIGS. 10 to 12. 10 is a first stage for explaining the operation of the substrate alignment device, FIG. 11 is a second stage for explaining the operation of the substrate alignment device, and FIG. 12 is a third stage for explaining the operation of the substrate alignment device. .
首先,在使設置於第1及第2定位器7、8的汽缸機構71、81的活塞74、84完全退避的狀態下,一旦將基板S搬送至基板收容部31內而載置於緩衝器32上,則會分別使汽缸機構71、81的活塞74、84進出(參照圖10)。First, in a state where the pistons 74 and 84 of the cylinder mechanisms 71 and 81 provided in the first and second positioners 7 and 8 are completely retracted, the substrate S is transported to the substrate housing unit 31 and placed in the buffer. At 32, the pistons 74 and 84 of the cylinder mechanisms 71 and 81 are respectively moved in and out (see Fig. 10).
若使汽缸機構71的活塞74以所定衝程進出,則主動滑動構件76會往基板收容部31的X方向靠中央滑移。此刻,凸輪部780會沿著凸輪孔763內來上昇,拉伸線圈彈簧755也會作用,而以一對的連結構件78、79能夠立起之方式轉動,藉由退避位置的推壓子70會上昇至可推壓位置(參照圖11)。When the piston 74 of the cylinder mechanism 71 is moved in and out with a predetermined stroke, the active sliding member 76 is slid toward the center in the X direction of the substrate housing portion 31. At this moment, the cam portion 780 will rise along the inside of the cam hole 763, and the tension coil spring 755 will also act, and the pair of connecting members 78, 79 can be erected to rotate, and the pusher 70 by the retracted position It will rise to the pushable position (refer to Figure 11).
若使汽缸機構71的活塞74更以所定衝程進出,則主動滑動構件76會更往基板收容部31的X方向靠中央滑移。此刻推壓板部762會抵接於被推壓部772而推壓被推壓部772,反抗拉伸線圈彈簧754的彈壓,而使從動滑動構件77往基板收容部31的Y方向靠中央滑移,藉此可推壓位置的推壓子70會往基板收容部31的Y方向靠中央移動,抵接於基板S的端面S1來推壓端面S1(參照圖12)。When the piston 74 of the cylinder mechanism 71 is moved in and out with a predetermined stroke, the active sliding member 76 is further slid toward the center in the X direction of the substrate housing portion 31. At this moment, the pressing plate portion 762 abuts against the pressed portion 772 to press the pressed portion 772, and resists the biasing force of the tension coil spring 754, and slides the driven sliding member 77 toward the center of the substrate housing portion 31 in the Y direction. When the pusher 70 is moved, the pusher 70 that can push the position moves toward the center in the Y direction of the substrate housing portion 31, and abuts against the end surface S1 of the substrate S to press the end surface S1 (see FIG. 12).
另一方面,若使汽缸機構81的活塞84以所定衝程進出,則推壓子80會往基板收容部31的X方向靠中央移動,抵接於基板S的端面S2來推壓端面S2。On the other hand, when the piston 84 of the cylinder mechanism 81 is moved in and out with a predetermined stroke, the pressing member 80 moves toward the center in the X direction of the substrate housing portion 31, and abuts against the end surface S2 of the substrate S to press the end surface S2.
如此,藉由第1及第2定位器7、8來推壓基板S的各端面S1、S2,使基板S在緩衝器32上對位於所定的位置。又,一對汽缸機構71、81的進出驅動可同時進行,或使一對汽缸機構71、81的其中一方的汽缸機構71、81進出驅動後,再使另一方的汽缸機構71、81進出驅動。In this manner, the end faces S1 and S2 of the substrate S are pressed by the first and second positioners 7 and 8, so that the substrate S is positioned at a predetermined position on the buffer 32. Further, the inlet and outlet driving of the pair of cylinder mechanisms 71 and 81 can be simultaneously performed, or the cylinder mechanisms 71 and 81 of one of the pair of cylinder mechanisms 71 and 81 can be driven in and out, and then the other cylinder mechanisms 71 and 81 can be driven in and out. .
一旦基板S的對位終了,則使汽缸機構71、81的活塞74、84分別退避。若使活塞74以所定衝程退避,則主動滑動構件76會往基板收容部31的X方向外側滑移。此刻,被拉伸線圈彈簧754彈壓的從動滑動構件77會往基板收容部31的Y方向外側滑移,藉此抵接於基板S的端面S1之推壓子70會往基板收容部31的Y方向外側移動,與端面S1分離而移動至可推壓位置。Once the alignment of the substrate S is completed, the pistons 74, 84 of the cylinder mechanisms 71, 81 are retracted, respectively. When the piston 74 is retracted by the predetermined stroke, the active sliding member 76 slides outward in the X direction of the substrate housing portion 31. At this point, the driven sliding member 77 that is biased by the tension coil spring 754 slides outward in the Y direction of the substrate housing portion 31, whereby the pressing member 70 that abuts against the end surface S1 of the substrate S passes to the substrate housing portion 31. The Y direction moves outward, and is separated from the end surface S1 and moved to the pushable position.
若使活塞74更以所定衝程、例如完全退避,則主動滑動構件76會更往基板收容部31的X方向外側滑移。此刻,凸輪部780會沿著凸輪孔763內而下降,反抗拉伸線圈彈簧755的彈壓,而以一對的連結構件78、79能夠傾倒之方式轉動,藉此可推壓位置的推壓子70會下降至退避位置。When the piston 74 is further retracted by a predetermined stroke, for example, the active sliding member 76 is further slid outward in the X direction of the substrate housing portion 31. At this moment, the cam portion 780 is lowered along the inside of the cam hole 763, against the biasing force of the tension coil spring 755, and the pair of coupling members 78, 79 can be tilted to rotate, thereby pushing the position of the pusher 70 will fall to the retreat position.
另一方面,若使汽缸機構81的活塞84以所定衝程、例如完全退避,則推壓子80會往基板收容部31的X方向外側移動,而與基板S的端面S2分離。On the other hand, when the piston 84 of the cylinder mechanism 81 is completely retracted for a predetermined stroke, for example, the pusher 80 moves outward in the X direction of the substrate housing portion 31, and is separated from the end surface S2 of the substrate S.
如此,若使推壓子70、80從基板S的搬送路徑上退避,則基板S會被搬送至製程處理室10a、10b、10c的其中之一。藉由第1及第2定位器7、8來對位的基板S是在製程處理室10a、10b、10c內被搬送於正規的處理位置,因此可實現不會發生處理不均等之高精度的製程。As described above, when the pushers 70 and 80 are retracted from the transport path of the substrate S, the substrate S is transported to one of the process chambers 10a, 10b, and 10c. The substrate S aligned by the first and second positioners 7 and 8 is transported to the normal processing position in the processing chambers 10a, 10b, and 10c, so that high precision of processing unevenness can be achieved. Process.
本實施形態中,將第1及第2定位器7、8分別藉由個別設置的汽缸機構71、81的活塞74、84的進出,使推壓子70、80能夠推壓基板S的第1及第2端面S1、S2,針對推壓基板S的搬送路徑的第1端面S1之第1定位器7設置驅動力變換機構部72,其係使推壓子70移動於退避位置與可推壓位置之間,且在可推壓位置使移動於推壓方向,而使推壓子70能夠從基板S的搬送路徑迴避移動,因此可顯著地縮小基板收容部31的對位用構件的設置空間及用以從基板S的搬送路徑迴避移動的空間。因此,可極力縮小基板收容部31的基板S周圍的空間,進而能夠極力使裝載鎖定處理室30小型化。In the present embodiment, the first and second positioners 7 and 8 respectively push the pistons 74 and 84 of the cylinder mechanisms 71 and 81 provided separately, so that the pushers 70 and 80 can press the first of the substrates S. The second end faces S1 and S2 are provided with a driving force conversion mechanism unit 72 for the first positioner 7 that presses the first end face S1 of the transport path of the substrate S, and the pusher 70 is moved to the retracted position and can be pushed. Between the positions, the pushable position is moved in the pressing direction, and the pusher 70 can be prevented from moving from the transport path of the substrate S. Therefore, the installation space of the alignment member of the substrate housing portion 31 can be remarkably reduced. And a space for avoiding movement from the transport path of the substrate S. Therefore, the space around the substrate S of the substrate housing portion 31 can be minimized, and the load lock processing chamber 30 can be miniaturized as much as possible.
又,本實施形態中,由於供以使推壓子70、80移動的汽缸機構71、81會被設置於裝載鎖定處理室30的基板收容部31外,因此可更為縮小基板收容部31之對位用的構件的設置空間。Further, in the present embodiment, since the cylinder mechanisms 71 and 81 for moving the pressing members 70 and 80 are provided outside the substrate housing portion 31 of the load lock processing chamber 30, the substrate housing portion 31 can be further reduced. The setting space of the component for alignment.
又,本實施形態中,於第1定位器7中,驅動力變換機構部72會將汽缸機構71的活塞74之X方向的驅動力變換成Y方向及高度方向的驅動力,而使推壓子70移動於退避位置與可推壓位置之間,且以可推壓位置作為始點及終點使移動於推壓方向及與推壓方向相反的方向,因此可將構成第1及第2定位器7、8的汽缸機構71、81設置於裝載鎖定處理室30的相同側壁,藉此,可有效利用裝載鎖定處理室30的上側及下側的空間。又,驅動力變換機構部72會藉由活塞74的1衝程的進出及退避來使推壓子70移動於退避位置與可推壓位置之間,且以可推壓位置作為始點及終點使移動於推壓方向及與推壓方向相反的方向,因此基板S的對位操作容易。Further, in the first positioner 7, the driving force conversion mechanism unit 72 converts the driving force in the X direction of the piston 74 of the cylinder mechanism 71 into the driving force in the Y direction and the height direction, and pushes the driving force. The sub-70 is moved between the retracted position and the pushable position, and the pushable position is used as the start point and the end point to move in the pressing direction and the direction opposite to the pressing direction, so that the first and second positioning can be configured. The cylinder mechanisms 71, 81 of the devices 7, 8 are disposed on the same side wall of the load lock processing chamber 30, whereby the space on the upper side and the lower side of the load lock processing chamber 30 can be effectively utilized. Further, the driving force conversion mechanism unit 72 moves the pusher 70 between the retracted position and the pushable position by the one-stroke entry and exit of the piston 74, and the pushable position is used as the start point and the end point. Since it moves in the pressing direction and the direction opposite to the pressing direction, the alignment operation of the substrate S is easy.
又,第1及第2定位器7、8之對基板收容部31的配置位置並非限於互相對向的角部附近。如圖13所示(圖13是表示構成基板對位裝置之第1及第2定位器的配置位置的變更例),亦可配置一對的第1定位器7,亦即在基板收容部31的Y方向相鄰的角部附近,彼此對向於Y方向,且配置兩對的第2定位器8,亦即在基板收容部31的各角部附近,彼此對向於X方向。此此情況,例如可取代電動汽缸,藉由空氣壓汽缸來構成一方的第1定位器7的汽缸機構71,且取代電動汽缸,藉由空氣壓汽缸來構成相鄰於設有一對的第1定位器7側的Y方向之第2定位器8的汽缸機構81(81a、81b)。藉此,可減少電動汽缸的個數,因此可謀求裝置的低成本化。在對位基板S時,例如使以空氣壓汽缸構成的汽缸機構71、81的活塞74、84進出後,使以電動汽缸構成的汽缸機構71、81的活塞74、84進出。Further, the positions at which the first and second positioners 7 and 8 are disposed on the substrate accommodating portion 31 are not limited to the vicinity of the corner portions facing each other. As shown in FIG. 13 (FIG. 13 is a modification example showing the arrangement positions of the first and second positioners constituting the substrate alignment device), a pair of first positioners 7 may be disposed, that is, in the substrate housing portion 31. In the vicinity of the corners adjacent to each other in the Y direction, the second positioners 8 that are disposed in the Y direction are arranged in the X direction in the vicinity of the respective corner portions of the substrate housing portion 31. In this case, for example, instead of the electric cylinder, the cylinder mechanism 71 of one of the first positioners 7 may be constituted by the air pressure cylinder, and instead of the electric cylinder, the first cylinder adjacent to the pair may be formed by the air cylinder. The cylinder mechanism 81 (81a, 81b) of the second positioner 8 in the Y direction on the positioner 7 side. Thereby, the number of electric cylinders can be reduced, so that the cost of the apparatus can be reduced. In the case of the registration substrate S, for example, the pistons 74 and 84 of the cylinder mechanisms 71 and 81 formed of the air cylinders are moved in and out, and the pistons 74 and 84 of the cylinder mechanisms 71 and 81 formed of the electric cylinders are moved in and out.
本發明並非限於上述實施形態,可實施各種的變形。收容基板的容器並非限於裝載鎖定處理室30,亦可為製程處理室10a、10b、10c或搬送室20等,基板並非限於FPD用的玻璃基板,亦可為半導體晶圓等的其他基板。又,亦可將基板收容部設置3段以上於容器中。The present invention is not limited to the above embodiment, and various modifications can be made. The container for accommodating the substrate is not limited to the load lock processing chamber 30, and may be the process chambers 10a, 10b, 10c or the transfer chamber 20, etc. The substrate is not limited to the glass substrate for FPD, and may be another substrate such as a semiconductor wafer. Further, the substrate accommodating portion may be provided in three or more stages in the container.
7...第1定位器(第1推壓機構)7. . . First positioner (first pressing mechanism)
8...第2定位器(第2推壓機構)8. . . Second positioner (second pushing mechanism)
30...裝載鎖定處理室(容器)30. . . Load lock processing chamber (container)
31...基板收容部31. . . Substrate housing
32...緩衝器(基板載置部)32. . . Buffer (substrate mounting unit)
33、34...開口33, 34. . . Opening
35...球狀滾子35. . . Spherical roller
70、80...推壓子70, 80. . . Pusher
71、81...汽缸機構(驅動機構)71, 81. . . Cylinder mechanism (drive mechanism)
72...驅動力變換機構部72. . . Driving force conversion mechanism
74、84...活塞74, 84. . . piston
75...引導構件75. . . Guide member
76...主動滑動構件76. . . Active sliding member
77...從動滑動構件77. . . Driven sliding member
78、79...連結構件78, 79. . . Connecting member
S...基板S. . . Substrate
S1...第1端面S1. . . First end face
S2...第2端面S2. . . Second end face
圖1是概略顯示本發明之一實施形態的基板對位裝置適用於裝載鎖定處理室之電漿處理裝置的立體圖。BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view schematically showing a substrate aligning apparatus according to an embodiment of the present invention applied to a plasma processing apparatus for loading a lock processing chamber.
圖2是概略顯示電漿處理裝置的內部的水平剖面圖。Fig. 2 is a horizontal cross-sectional view schematically showing the inside of the plasma processing apparatus.
圖3是表示控制部的概略構成方塊圖。3 is a block diagram showing a schematic configuration of a control unit.
圖4是表示裝載鎖定處理室的一部份切開的立體圖。Figure 4 is a perspective view showing a portion of the load lock processing chamber cut away.
圖5是表示驅動力變換機構部的分解立體圖。Fig. 5 is an exploded perspective view showing a driving force conversion mechanism unit.
圖6是用以說明驅動力變換機構部的作動之第1階段的立體圖。Fig. 6 is a perspective view for explaining a first stage of the operation of the driving force conversion mechanism unit.
圖7是用以說明驅動力變換機構部的作動之第2階段的立體圖。Fig. 7 is a perspective view for explaining a second stage of the operation of the driving force conversion mechanism unit.
圖8是用以說明驅動力變換機構部的作動之第3階段的立體圖。Fig. 8 is a perspective view for explaining a third stage of the operation of the driving force conversion mechanism unit.
圖9是表示驅動力變換機構部的一部份切開的平面圖。Fig. 9 is a partially cutaway plan view showing the driving force conversion mechanism portion.
圖10是用以說明基板對位裝置的作動之第1階段的圖。Fig. 10 is a view for explaining a first stage of the operation of the substrate alignment device.
圖11是用以說明基板對位裝置的作動之第2階段的圖。Fig. 11 is a view for explaining a second stage of the operation of the substrate alignment device.
圖12是用以說明基板對位裝置的作動之第3階段的圖。Fig. 12 is a view for explaining a third stage of the operation of the substrate alignment device.
圖13是表示構成基板對位裝置之第1及第2定位器的配置位置的變更例。FIG. 13 is a view showing a modified example of the arrangement positions of the first and second positioners constituting the substrate registration device.
7...第1定位器(第1推壓機構)7. . . First positioner (first pressing mechanism)
8...第2定位器(第2推壓機構)8. . . Second positioner (second pushing mechanism)
31...基板收容部31. . . Substrate housing
32...緩衝器(基板載置部)32. . . Buffer (substrate mounting unit)
36...支持銷36. . . Support pin
70、80...推壓子70, 80. . . Pusher
71、81...汽缸機構(驅動機構)71, 81. . . Cylinder mechanism (drive mechanism)
72...驅動力變換機構部72. . . Driving force conversion mechanism
73...汽缸本體73. . . Cylinder body
74、84...活塞74, 84. . . piston
75...引導構件75. . . Guide member
76...主動滑動構件76. . . Active sliding member
77...從動滑動構件77. . . Driven sliding member
78、79...連結構件78, 79. . . Connecting member
83...汽缸本體83. . . Cylinder body
700...推壓本體700. . . Push the body
754...拉伸線圈彈簧754. . . Stretch coil spring
755...拉伸線圈彈簧755. . . Stretch coil spring
762...推壓板部762. . . Push plate
763...凸輪孔763. . . Cam hole
772...被推壓部772. . . Pushed part
780...凸輪部780. . . Cam section
S...基板S. . . Substrate
S1...第1端面S1. . . First end face
S2...第2端面S2. . . Second end face
Claims (13)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005257165A JP4642610B2 (en) | 2005-09-05 | 2005-09-05 | Substrate alignment device and substrate accommodation unit |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200721361A TW200721361A (en) | 2007-06-01 |
TWI421969B true TWI421969B (en) | 2014-01-01 |
Family
ID=37859001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095132616A TWI421969B (en) | 2005-09-05 | 2006-09-04 | A substrate alignment device and a substrate storage unit |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4642610B2 (en) |
KR (2) | KR100860143B1 (en) |
CN (1) | CN100446215C (en) |
TW (1) | TWI421969B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5501688B2 (en) * | 2009-07-30 | 2014-05-28 | 東京エレクトロン株式会社 | Substrate alignment mechanism, vacuum prechamber and substrate processing system using the same |
JP5582895B2 (en) * | 2010-07-09 | 2014-09-03 | キヤノンアネルバ株式会社 | Substrate holder stocker apparatus, substrate processing apparatus, and substrate holder moving method using the substrate holder stocker apparatus |
TW201514516A (en) * | 2013-10-03 | 2015-04-16 | Chips Best Technology Co Ltd | Automatic chip inspection system |
TW201514502A (en) * | 2013-10-03 | 2015-04-16 | Chips Best Technology Co Ltd | Chip inspection base |
US9929029B2 (en) * | 2015-10-15 | 2018-03-27 | Applied Materials, Inc. | Substrate carrier system |
CN106773157B (en) * | 2016-12-06 | 2018-08-31 | 友达光电(昆山)有限公司 | Position correction apparatus and method for correcting position |
JP2019102721A (en) * | 2017-12-06 | 2019-06-24 | エスペック株式会社 | Substrate positioning device |
KR102186594B1 (en) * | 2020-04-08 | 2020-12-03 | 백철호 | Automatic alignment device for PCB |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0927536A (en) * | 1995-07-10 | 1997-01-28 | Nissin Electric Co Ltd | Ion implanting device with substrate-aligning mechanism in load-lock room |
TW297911B (en) * | 1995-04-14 | 1997-02-11 | Tokyo Electron Co Ltd | |
JP2000306980A (en) * | 1993-02-26 | 2000-11-02 | Tokyo Electron Ltd | Alignment mechanism of glass substrate for lcd and vacuum treatment apparatus |
JP2001291758A (en) * | 2000-11-27 | 2001-10-19 | Tokyo Electron Ltd | Vacuum processing equipment |
JP2002057205A (en) * | 1991-09-10 | 2002-02-22 | Tokyo Electron Ltd | Alignment mechanism in load lock chamber, processing device, alignment method and transfer method |
TW200424093A (en) * | 2002-11-21 | 2004-11-16 | Hitachi Int Electric Inc | Method for positioning a substrate and inspecting apparatus using same |
JP2005116878A (en) * | 2003-10-09 | 2005-04-28 | Toshiba Corp | Method and device for supporting substrate |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3260427B2 (en) * | 1991-09-10 | 2002-02-25 | 東京エレクトロン株式会社 | Vacuum processing apparatus and substrate transfer method in vacuum processing apparatus |
JPH0751229Y2 (en) * | 1990-09-29 | 1995-11-22 | 大日本スクリーン製造株式会社 | Substrate alignment device |
JP3468430B2 (en) * | 1994-02-15 | 2003-11-17 | 東京エレクトロン株式会社 | Position detection guide device, position detection guide method, and vacuum processing device |
JP4030654B2 (en) * | 1998-06-02 | 2008-01-09 | 大日本スクリーン製造株式会社 | Substrate transfer device |
JP2003086659A (en) * | 2001-09-11 | 2003-03-20 | Hirata Corp | Substrate transfer device |
US20030072639A1 (en) * | 2001-10-17 | 2003-04-17 | Applied Materials, Inc. | Substrate support |
JP2003282684A (en) * | 2002-03-22 | 2003-10-03 | Olympus Optical Co Ltd | Glass board supporting jig |
KR101018909B1 (en) * | 2002-10-25 | 2011-03-02 | 도쿄엘렉트론가부시키가이샤 | Substrate alignment apparatus, substrate processing apparatus and substrate transfer apparatus |
JP4479881B2 (en) * | 2003-09-19 | 2010-06-09 | 株式会社日立ハイテクノロジーズ | Substrate spin processing apparatus and substrate spin processing method |
-
2005
- 2005-09-05 JP JP2005257165A patent/JP4642610B2/en active Active
-
2006
- 2006-09-04 TW TW095132616A patent/TWI421969B/en not_active IP Right Cessation
- 2006-09-05 KR KR1020060085136A patent/KR100860143B1/en active IP Right Grant
- 2006-09-05 CN CNB2006101289635A patent/CN100446215C/en active Active
-
2008
- 2008-05-07 KR KR1020080042242A patent/KR100952524B1/en active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002057205A (en) * | 1991-09-10 | 2002-02-22 | Tokyo Electron Ltd | Alignment mechanism in load lock chamber, processing device, alignment method and transfer method |
JP2000306980A (en) * | 1993-02-26 | 2000-11-02 | Tokyo Electron Ltd | Alignment mechanism of glass substrate for lcd and vacuum treatment apparatus |
TW297911B (en) * | 1995-04-14 | 1997-02-11 | Tokyo Electron Co Ltd | |
JPH0927536A (en) * | 1995-07-10 | 1997-01-28 | Nissin Electric Co Ltd | Ion implanting device with substrate-aligning mechanism in load-lock room |
JP2001291758A (en) * | 2000-11-27 | 2001-10-19 | Tokyo Electron Ltd | Vacuum processing equipment |
TW200424093A (en) * | 2002-11-21 | 2004-11-16 | Hitachi Int Electric Inc | Method for positioning a substrate and inspecting apparatus using same |
JP2005116878A (en) * | 2003-10-09 | 2005-04-28 | Toshiba Corp | Method and device for supporting substrate |
Also Published As
Publication number | Publication date |
---|---|
KR100860143B1 (en) | 2008-09-24 |
KR100952524B1 (en) | 2010-04-12 |
CN100446215C (en) | 2008-12-24 |
CN1929109A (en) | 2007-03-14 |
JP2007073646A (en) | 2007-03-22 |
JP4642610B2 (en) | 2011-03-02 |
KR20070026274A (en) | 2007-03-08 |
KR20080059118A (en) | 2008-06-26 |
TW200721361A (en) | 2007-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI421969B (en) | A substrate alignment device and a substrate storage unit | |
KR100832926B1 (en) | Lifter and transfer | |
TWI417978B (en) | A substrate processing device, a loading lock chamber unit, and a transporting device | |
TWI555681B (en) | A position shift preventing device, a substrate holder including the same, a substrate handling device, and a substrate handling method | |
JP4849825B2 (en) | Processing apparatus, alignment method, control program, and computer storage medium | |
KR101208644B1 (en) | Position deviation preventing device, substrate holding member including the same, substrate transfer apparatus and substrate transfer method | |
TW201117315A (en) | Substrate position alignment mechanism, vacuum prechamber and substrate processing system having same | |
JP4023543B2 (en) | Substrate transfer apparatus, substrate transfer method, and vacuum processing apparatus | |
JP4903027B2 (en) | Substrate transport device and substrate support | |
JP4795893B2 (en) | Substrate detection mechanism and substrate container | |
JP3350234B2 (en) | Object buffer device, processing device using the same, and method of transporting the same | |
JP5926694B2 (en) | Substrate relay device, substrate relay method, substrate processing apparatus | |
KR101020364B1 (en) | Gate valve and substrate processing apparatus using the same | |
KR101688842B1 (en) | Substrate processing apparatus | |
JP3260427B2 (en) | Vacuum processing apparatus and substrate transfer method in vacuum processing apparatus | |
JP2005076845A (en) | Gate valve | |
JPH06252245A (en) | Vacuum processing equipment | |
JP2002261147A (en) | Vacuum device and carrying device | |
TWI549215B (en) | Substrate processing system and substrate transfer method | |
JP2002057205A (en) | Alignment mechanism in load lock chamber, processing device, alignment method and transfer method | |
KR20050076259A (en) | Apparatus for transfer a semiconductor substrate and equipment for manufacturing a semiconductor substrate having the same | |
KR20210077598A (en) | Reduced pressure drying apparatus and reduced pressure drying method | |
JP2014236193A (en) | Substrate transfer apparatus, and substrate transfer method using the same | |
JP2018207129A (en) | Substrate transport apparatus, and substrate transport method using the same | |
JP2005096908A (en) | Substrate processing device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |