TWI421969B - A substrate alignment device and a substrate storage unit - Google Patents

Description

Substrate alignment device and substrate housing unit

The present invention relates to a substrate alignment device for aligning a substrate such as a glass substrate for a display (FPD), and a substrate storage unit including the substrate alignment device.

In the manufacturing process of the FPD, a vacuum processing apparatus for etching, ashing, or forming a glass substrate in a vacuum state is a vacuum processing apparatus using a so-called multi-processing chamber type, that is, A plurality of vacuum processing chambers that perform the above processing.

In such a vacuum processing apparatus, it is not necessary to return the vacuum processing chamber to normal pressure during loading/unloading of the substrate in the vacuum processing chamber, and the load lock chamber of the preliminary vacuum chamber is connected via the opening and closing opening of the gate valve by the gate valve. To the vacuum processing chamber. The substrate before the above-described processing is transported to the load lock chamber by the transport mechanism such as the transport pick-up device, and is transported to the vacuum processing chamber after being placed in the load lock chamber in a vacuum state in the same manner as the vacuum processing chamber. Therefore, in the load lock chamber, the processing position at which the substrate is transported to the vacuum processing chamber by the transport mechanism can be accurately performed, and the substrate is positioned at a predetermined position.

In the case of a positioning device for aligning such a substrate, for example, it is proposed to provide a pair of positioners for respectively pressing the substrates supported on the buffer in the lock chamber. The corner portion (for example, refer to Patent Document 1). In this technique, each positioner is a pair of rollers and a support for supporting the rollers, moving in a diagonal direction of the substrate, and holding the corners of the substrate by a pair of rollers In the state of the portion, the substrate is pressed, thereby aligning the substrate. Further, each of the positioners can be retracted to the lower side so as not to hinder the conveyance of the substrate.

[Patent Document 1] JP-A-2000-306980

However, recently, the LCD substrate has a tendency to increase in size, and even a large one of them has a size of 2 m. When the processing chamber of a conventional load lock chamber or the like is enlarged in accordance with the increase in the size of the substrate, the device itself is significantly enlarged. In order to compress the space around the substrate in the processing chamber, the processing chamber is miniaturized as a guide. However, in the technique of Patent Document 1, since the positioner is a pair of rollers that are supported by the support, it has to be formed larger, and since it is moved in the diagonal direction and the up and down direction, the part is necessary. The space, the miniaturization of the load lock chamber is limited.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate alignment device capable of performing alignment of a substrate by minimizing a space around a substrate in a container for housing a substrate such as a lock chamber, and A substrate housing unit of the substrate alignment device.

In order to solve the above problems, the substrate alignment device of the present invention is carried in a horizontal direction from an opening provided in a side wall of the container, and a rectangular substrate pair placed on the substrate mounting portion in the container is located on the substrate. The first portion is provided with a pair of first pressing mechanisms for pressing a pair of first end faces orthogonal to the conveying direction of the substrate, and a pair of second pressing mechanisms for pushing The first pressing mechanism and the second pressing mechanism each have a driving mechanism along the pair of second end faces in the conveying direction of the substrate, and the first end face and the second end face are pressed by driving of the driving mechanism At least one of the pair of first pressing mechanisms further includes a driving force conversion mechanism that moves the pusher to a transport path that is retracted to the substrate by driving of the drive mechanism The outer retracted position is between the pushable position of the pushable substrate, and is moved in the pressing direction at the pushable position.

In the substrate alignment device of the present invention, it is preferable that the drive mechanism is provided outside the container. Further, it is preferable that the driving force conversion mechanism is provided above or below the transport path of the substrate, and the pusher moves the upper or lower side of the transport path of the substrate to and from the transport by the drive mechanism. In a state in which the paths are parallel, the retracted retracted position and the pushable position of the pushable substrate are moved, and the pushable position is moved in the pressing direction. Further, it is preferable that at least one of the pair of first pressing mechanisms is horizontal and driven in a direction orthogonal to a conveying direction of the substrate. In this case, it is preferable that at least one of the pair of first pressing mechanisms is a cylinder mechanism having a piston that is horizontal and moves forward and backward in a direction orthogonal to a conveying direction of the substrate, and the driving force conversion mechanism unit When the piston of the cylinder mechanism moves in and out with a predetermined stroke, the pressing force at the retracted position is moved to the pushable position, and when the piston of the cylinder mechanism moves in and out of a predetermined stroke, the pushable position is made The pressing force is moved in the pressing direction, and the first end surface can be pressed. In this state, when the piston of the cylinder mechanism is retracted by a predetermined stroke, the above-mentioned first end surface state is pressed. The pusher moves to the pushable position, and when the piston of the cylinder mechanism is retracted by the predetermined stroke, the pusher at the pushable position is moved to the retracted position. Further, in this case, it is preferable that the driving force conversion mechanism portion includes a guiding member that is fixed in the container, and an active sliding member that is along the guiding member along with the advancement and retreat of the piston of the cylinder mechanism. Sliding in the advancing and retracting direction of the piston; the driven sliding member is horizontally and slid along the guiding member to be orthogonal to the moving direction of the active sliding member along with the slip of the predetermined stroke of the active sliding member And a connecting member rotatably provided at the one end portion of the driven sliding member, and the pressing member is rotatably provided at the other end portion, with the sliding of the predetermined stroke of the active sliding member, The one end portion is pivoted to be tilted and raised, and the connecting member is rotated to be tilted and raised to move the pusher between the retracted position and the pushable position by the driven sliding The member is slid so that the pusher moves in the pressing direction and the direction opposite to the pressing direction by using the pushable position as the start point and the end point.

In the above-described substrate alignment device of the present invention, it is preferable that each of the first pressing mechanism and the second pressing mechanism further has a buffering means for buffering the pressing member to press the first end face and the second pressing portion Punching at the end face.

Moreover, the present invention provides a substrate storage unit including a container having an opening provided in a side wall, and a substrate housing portion for transporting a rectangular substrate in a horizontal direction from the opening; and a substrate mounting portion a substrate accommodating the substrate accommodating portion is placed on the substrate accommodating portion, and a substrate aligning device is disposed on the substrate placing portion on a substrate pair placed on the substrate mounting portion. The substrate alignment device includes a pair of first pressing mechanisms that press a pair of first end faces orthogonal to the conveying direction of the substrate, and a pair of second pressing mechanisms that push the pressing edge a pair of second end faces in the transport direction of the substrate, the first pressing mechanism and the second pressing mechanism each having a drive mechanism and pressing the first end face and the second end face by driving of the drive mechanism At least one of the pair of first pressing mechanisms further includes a driving force conversion mechanism that moves the pressing member to a path that is retracted to the substrate by the driving of the driving mechanism. of Between a retracted position and the pressing position can be pressed against the substrate, and the moving position of the above may be pressed to the pressing direction.

In the substrate housing unit of the present invention, it is preferable that the substrate mounting portion has a rotatable spherical roller that abuts against a back surface of the substrate to be conveyed. Further, it is preferable that the container is a substrate housing portion having two or more stages on the upper and lower sides. Further, it is preferable that the container is a load lock processing chamber in which the openings are openably and closably provided on the opposite side walls, and the vacuum processing chamber is subjected to a predetermined treatment in a vacuum state via the respective openings. The inside of the atmosphere can communicate with the atmosphere. When the substrate is transferred to the atmosphere side, the inside is held near the atmospheric pressure, and when the substrate is transferred to the vacuum processing chamber, the inside is held in a vacuum state.

According to the present invention, since the respective end faces of the substrate are pressed by the pair of first and second pressing mechanisms, the alignment of the substrate can be accurately performed, and the first and second pressing mechanisms can be used. By the driving of the individual drive mechanisms, the pusher can push the end surface of the substrate, and the first push of at least one of the first end faces orthogonal to the transport path of the substrate, that is, the transfer path of the substrate. The mechanism is provided with a driving force conversion mechanism that moves the pusher between the retracted position outside the transport path that is retracted to the substrate and the pushable position of the pushable substrate, and moves to the pushable position at the pushable position. In the pressing direction, the pusher can be prevented from moving from the transport path of the substrate, so that the installation space of the alignment member in the container and the space for avoiding movement from the transport path of the substrate can be remarkably reduced. Therefore, the space around the substrate in the container can be minimized, and the container can be miniaturized as much as possible.

In particular, when the present invention is applied to a load lock processing chamber used in a multi-processing chamber type vacuum processing apparatus, the load lock processing chamber can be miniaturized as much as possible, and the vacuum processing apparatus itself can be prevented from being significantly increased as the substrate is enlarged. Huge.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Here, a description will be given of a load lock device for a multi-chamber type plasma processing apparatus that is configured to perform plasma treatment on a FPD glass substrate (hereinafter simply referred to as "substrate") S by using the substrate alignment device of the present invention. example of. Here, in terms of the FPD, for example, a liquid crystal display (LCD), a light emitting diode (LED) display, an electroluminescence (EL) display, a fluorescent display (VFD), a plasma display Panel (PDP), etc.

1 is a perspective view schematically showing a plasma processing apparatus in which a substrate alignment device according to an embodiment of the present invention is applied to a load lock processing chamber, and FIG. 2 is a horizontal cross-sectional view schematically showing the inside.

In the plasma processing apparatus 1, a transfer chamber 20 and a load lock processing chamber 30 are connected to a central portion thereof. Three process chambers 10a, 10b, and 10c are disposed around the transfer chamber 20.

Openings between the transfer chamber 20 and each of the process chambers 10a, 10b, and 10c, between the transfer chamber 20 and the load lock processing chamber 30, and between the load lock processing chamber 30 and the outside atmosphere are respectively inserted. The airtight seal is provided between the two, and the gate valve 22 is opened and closed (here, only between the transfer chamber 20 and each of the process chambers 10a, 10b, and 10c, and between the transfer chamber 20 and the load lock processing chamber 30) .

Two cassette indexers 41 are provided on the outer side of the load lock processing chamber 30, and cassettes 40 for accommodating the substrate S are respectively provided thereon. For example, one of the cassettes 40 accommodates an unprocessed substrate, and the other substrate can accommodate the processed substrate.

Between the two cassettes 40, a transfer mechanism 43 is provided on the support table 44. The transfer mechanism 43 includes pickers 45 and 45 provided in two stages, and enables the pickers 45 and 45. The base 47 that is advanced and retracted individually and can be rotated and lifted together.

The process chambers 10a, 10b, and 10c have their internal spaces maintained in a predetermined reduced pressure environment, and are subjected to plasma treatment, for example, etching treatment or ashing treatment. Since there are three processing chambers, for example, two of the processing chambers can be used as an etching processing chamber, and the remaining one processing chamber can be used as an ashing processing chamber, or three processing chambers are all used for the same processing. Etching the processing chamber or the ashing chamber. Further, the number of process chambers is not limited to three, and may be four or more.

The transfer chamber 20 can be held in a predetermined reduced pressure environment in the same manner as the vacuum processing chamber. As shown in Fig. 2, a transfer device 50 is disposed. Then, the substrate S is transferred between the load lock processing chamber 30 and the three process chambers 10a, 10b, and 10c by the transport device 50. The transport mechanism 50 includes pickers 51 and 51 (only the upper stage is shown in FIG. 2) provided in the upper and lower stages, and a base that allows the pickers 51 and 51 to advance and retreat individually and can be rotated and lifted together. Block 52.

The load lock processing chamber 30 can be held in a predetermined reduced pressure environment in the same manner as each of the processing chamber 10 and the transfer chamber 20. Further, the load lock processing chamber 30 is for accepting the substrate S between the cassette 40 in the atmospheric environment and the processing chambers 10a, 10b, and 10c in the decompression environment, based on the relationship between the repeated atmospheric environment and the decompression environment. The content of the product will be composed as small as possible.

In the load lock processing chamber 30, the substrate accommodating portion 31 is provided in two stages (only the upper stage is shown in FIG. 2), and each of the board accommodating portions 31 is provided with a plurality of buffers (substrate mounting portions) for supporting the substrate S. ) 32. An escape groove 32a of the pickups 45, 51 when the substrate S is conveyed is formed between the buffers 32. In addition, the first and second positioners that are aligned in the vicinity of the corner portions of the rectangular substrate S that face each other are provided in the load lock processing chamber 30 so as to be able to correspond to the respective substrate housing portions 31 (first And the second pressing mechanism 7 and 8. The load lock processing chamber 30 and the first and second positioners 7 and 8 will be described in detail later.

Each component of the plasma processing apparatus 1 is configured to be connected to the control unit 60 and controlled (not shown in FIG. 1). FIG. 3 is an outline showing the control unit 60. The control unit 60 has a process controller 61 including a CPU, and the process controller 61 is connected to a user interface 62 composed of a keyboard or a display for instructing the project manager to manage the plasma processing apparatus 1. In the input operation or the like, the display is displayed by visualizing the operation state of the plasma processing apparatus 1.

Further, the control unit 60 has a storage unit 63 that stores a control program (software) or processing condition data that is executed by the process controller 61 to perform various processes performed by the plasma processing device 1. This memory portion 63 is connected to the process controller 61.

Then, in response to an instruction from the user interface 62, an arbitrary method is called from the memory unit 63, and is executed in the process controller 61 to perform plasma under the control of the process controller 61. The desired processing of the processing device 1.

The above-mentioned control program or processing condition data (recipe) may be stored in a computer-readable memory medium such as a CD-ROM, a hard disk, a floppy disk, a flash memory, or the like, or from another device. For example, it is transmitted at any time via a dedicated line to connect users.

Next, the substrate alignment device of the present embodiment and the load lock processing chamber 30 including the substrate alignment device will be described in detail.

4 is a perspective view showing a portion of the load lock processing chamber 30 cut away.

Each of the substrate accommodating portions 31 of the load lock processing chamber 30 has an opening 33 that can communicate with the transfer chamber 20 via the gate valve 22, and an atmosphere surrounding the outside, in the side wall facing the substrate S in the transport direction (Y direction). The communicating opening 34, at least when the opening 34 is closed, can be internally decompressed to a predetermined reduced pressure environment, for example, can be depressurized to a vacuum state. In each of the substrate accommodating portions 31, the substrate S that is transported to the horizontal or substantially horizontal by the transport mechanism 43 or 50 is accommodated in each of the substrate accommodating portions 31 via the openings 34 or 33 so as to be able to span the plurality of buffers 32. The method is placed.

In the plurality of dampers 32, for example, the upper end portion of the damper 32 provided at the center portion in the horizontal direction (X direction) orthogonal to the transport direction of the substrate is in contact with the back surface of the substrate S to be transported. The spherical rollers 35 are provided at a predetermined interval, for example, at the upper end portion of the buffer 32 on the outer side in the X direction, and the support pin 36 abutting on the back surface of the corner portion of the substrate S to be conveyed is set. At both ends of the Y direction. Thereby, the substrate placed on the plurality of buffers 32 can be moved on the buffer 32 by the rotation of the spherical roller 35, and can be stationary at the buffer 32 by friction with the support pin 36. on.

The first positioner 7 is for pressing the end surface S1 orthogonal to or substantially perpendicular to the Y direction of the substrate S accommodated in the substrate housing portion 31, and includes a pressing member 70 for pressing the end surface S1, and The cylinder mechanism (drive mechanism) 71 that moves the pusher 70 and the driving force that is transmitted between the pusher 70 and the cylinder mechanism 71 to change the driving force of the cylinder mechanism 71 to the pusher 70 Mechanism unit 72. The second positioner 8 is for pressing the end surface S2 orthogonal to or substantially orthogonal to the X direction of the substrate S accommodated in the substrate housing portion 31, and includes a pressing member 80 for pressing the end surface S2, and A cylinder mechanism (drive mechanism) 81 that moves the pusher 80. The first positioner 7 and the second positioner 8 are provided in the vicinity of the opposite corner portions of the substrate accommodating portion 31, and are provided in the vicinity of the corner portions of the upper and lower substrate accommodating portions 31 and 31. The first and second positioners 7 and 8 constitute a substrate aligning device, and the load lock processing chamber 30, the damper 32 provided in the substrate accommodating portion 31 in the load lock processing chamber 30, and the substrate aligning device constitute a substrate accommodating device. unit.

The cylinder mechanism 71 is placed outside the substrate housing portion 31 of the load lock processing chamber 30, and more specifically, from the load lock processing chamber so as to be substantially at the same height as the substrate S placed on the buffer 32. 30 or an electric cylinder in which the side wall of the substrate accommodating portion 31 orthogonal to the X direction protrudes to the outside of the load lock processing chamber 30 and is provided with a cylinder main body 73 extending in the X direction and a piston 74 retractable from the cylinder main body 73. (See also FIGS. 5-8, 10-12), the electric energy is converted into mechanical energy by a stepping motor, and the piston 74 is allowed to advance or retreat to the cylinder body 73.

5 to 9 (Fig. 5 is an exploded perspective view showing the driving force conversion mechanism unit 72, Fig. 6 is a perspective view for explaining the first stage of the actuation of the driving force conversion mechanism unit 72, and Fig. 7 is a view for explaining the driving. FIG. 8 is a perspective view for explaining the third stage of the actuation of the driving force conversion mechanism unit 72, and FIG. 9 is a partial cut showing the driving force conversion mechanism unit 72. FIG. In the plan view, the driving force conversion mechanism unit 72 includes a plate-shaped guide member 75 fixed to the bottom surface of the substrate housing portion 31, and an active sliding member 76 that is slidably attached to the guiding member 75 in the X direction, and The driven sliding member 77 that is attached to the guiding member 75 in the Y direction and one end portion are rotatably provided to the driven sliding member 77 in the Y direction as a shaft, and the pusher 70 is rotatably provided at the other end portion. Pair of connecting members 78, 79.

The active sliding member 76 has a shape extending in the X direction, and a sliding portion 760 having a pair in the Y direction is provided in the intermediate portion in the X direction. A sliding groove 761 (only one of which is shown) extending in the X direction is formed on the bottom surface of the sliding portion 760, and the sliding groove 761 is slidably fitted into the X-direction guiding portion 751 formed in the guiding direction of the guiding member 75 in the X direction. The sliding member 76 is attached to the guiding member 75 that is slidable in the X direction. At least the portion of the sliding groove 761 is formed of a low friction material, so that the sliding portion 760 can easily slide along the X direction guiding portion 751. A sliding barrier portion 753 that regulates the sliding of the sliding portion 760 is provided at each end portion of the X-direction guiding portion 751.

An engaging recessed portion 765 is formed at one end portion of the active sliding member 76 in the X direction, and the engaging recessed portion 765 is engaged with the engaging groove 740 formed at the front end portion of the piston 74 in the X direction, so that the active sliding member 76 is connected to The piston 74 of the cylinder mechanism 71, whereby the active sliding member 76 slides in the X direction as the piston 74 moves forward and backward.

The driven sliding member 77 has a shape extending in the X direction, and a pair of sliding portions 770 are provided at intervals in the X direction. A sliding groove 771 extending in the Y direction is formed on the bottom surface of the sliding portion 770, and the sliding groove 771 is slidably fitted in the Y-direction guiding portion 752 extending in the Y direction, and the Y-direction guiding portion 752 is formed on the guiding member 75. The X-direction guide portion 751 is further in the center of the Y-direction of the substrate accommodating portion 31, whereby the driven sliding member 77 is disposed closer to the center of the substrate accommodating portion 31 in the Y direction than the active sliding member 76, and is attached to the Y-direction. Guide member 75. At least the sliding portion 771 portion is formed of a low friction material, so that the sliding portion 770 can easily slide along the Y direction guiding portion 752. A sliding portion 753 that regulates the sliding of the sliding portion 770 is provided at each of both end portions of the Y-direction guide portion 752.

The active sliding member 76 is integrally provided with a pressing plate portion 762 that is at an angle of substantially 45 degrees with respect to the X direction and the Y direction in the sliding portion 760 at the center of the substrate housing portion 31 in the Y direction. The outer side of the substrate housing portion 31 extends. The driven sliding member 77 is provided with a cylindrical pressing portion 772 extending upward in the height direction, for example. Then, when the active sliding member 76 slides toward the center in the X direction by the predetermined stroke of the piston 74, the pressing plate portion 762 abuts against the pressed portion 772 and pushes the pressed portion 772. Thereby, the driven sliding member 77 slides in the center in the Y direction (see, in particular, FIGS. 7 and 8).

The tension coil spring 754 is connected to each of the both ends of the driven sliding member 77 and the guiding member 75 in the X direction, and the driven sliding member 77 is moved outward in the Y direction of the substrate housing portion 31 by the tension coil spring 754. When the active sliding member 76 is slid outward in the X direction of the substrate accommodating portion 31 by the retraction of the predetermined stroke of the piston 74, the driven sliding member 77 that slides toward the center in the Y direction of the substrate accommodating portion 31 will go to The substrate housing portion 31 slides outward in the Y direction.

The pair of connecting members 78 and 79 are provided so as to be parallel to the X direction in the rotation axis of the one end portion, and are provided in the center of the X direction of the substrate housing portion 31 from the pressed portion 772 of the driven sliding member 77. The other side is bent into a V shape to form a parallelogram shape. The connecting member 78 is provided with a cylindrical or cylindrical cam portion 780 extending outward in the Y direction of the substrate housing portion 31, and the cam portion 780 enters the cam hole 763 formed in the other end portion of the active sliding member 76 in the X direction. The cam hole 763 has a shape in which the cross section in the Y direction extends upward and downward, and when the pair of coupling members 78 and 79 are slipped by the active sliding member 76, the cam portion 780 is moved up and down along the cam hole 763, thereby rotating The standing member 78 can be raised and lowered to the lower side (see, in particular, FIGS. 6 and 7). Further, the cam hole 763 has a shape in which the Y-direction cross section extends outward from the upper end portion in the X direction of the board housing portion 31, and when the active sliding member 76 and the driven sliding member 77 are respectively slid to the X direction and the Y direction, the cam hole The portion 780 is held in the cam hole 763, so that the pair of standing members 78 and 79 that stand up can also move in the Y direction together with the driven sliding member 77 (see, in particular, FIGS. 7 and 8). Thereby, it is possible to reliably support the pair of connecting members 78 and 79 in a state where they are raised.

The cam portion 780 is rotatable by a plurality of ball bearings 781 (refer to FIG. 9), whereby it can be smoothly displaced relative to the cam hole 763. Further, the cam portion may be provided in the connecting member 79 instead of being provided in the connecting member 78, or the cam portion may be provided in the active sliding member 76, and the cam hole may be provided in the connecting member 78 or 79. The cam portion 780 and the cam hole 763 constitute a cam mechanism, and the pair of coupling members 78 and 79 are erected and tilted by the cam mechanism when the active sliding member 76 slips.

The positioning coil spring 755 is connected to the coupling member 79 and the driven sliding member 77, so that the pair of coupling members 78 and 79 can be raised by the tension coil spring 755. Thereby, the pair of connecting members 78 and 79 after the tilting of the active sliding member 76 in the X direction of the substrate housing portion 31 by the predetermined stroke of the piston 74 are caused by the tension coil spring 755. Auxiliary stand up. Further, instead of the tension coil spring 755, the compression coil spring may be used to cause the pair of coupling members 78 and 79 that can be raised by the compression coil spring to be tilted.

The pusher 70 has a pressing body 700 that presses the end surface S1 of the substrate S to press the end surface S1, and a rotating plate 701 that is rotatably attached to the other end of the connecting members 78 and 79, and a connecting push The main body 700 and the rotating plate 701 extend in the Y-direction connecting portion 702. When the pair of connecting members 78 and 79 are raised, the pusher 70 is located at substantially the same height (a pressable position) as the substrate S placed on the damper 32, and the pair of connecting members 78 and 79 At the time of pouring, in a state of being kept parallel to the substrate S, it is possible to be located below the substrate S on which the buffer 32 is placed (retracted position).

The pressing body 700 is formed by using a material that does not cause damage or breakage to the end surface S1 of the substrate S that is in contact with the substrate S, and is less likely to be generated by contact with the substrate S. For example, a material such as a synthetic resin having a certain elasticity can be used, and a fluorine-based resin such as poly-tetrafluoroethylene can be preferably used. Moreover, from the viewpoint of improving the accuracy of the alignment, the pressing body 700 has an end surface S1 in which the pressing surface is formed in an arc shape so as to be in point contact with the substrate S in the horizontal direction. Further, the pressing body 700 may be a rotating body that is, for example, a columnar shape with the height direction as an axis.

In the connecting portion 702, the inner tubular member 704 is inserted into the outer tubular member 703 to be stopped, and the compression coil spring 705 is disposed in the outer tubular member 703 and the inner tubular member 704. That is, the connecting portion 702 is expandable and contractible, and is biased in the extending direction by the compression coil spring 705, and has a function as a buffering means for relieving the pressing of the pressing body 700 when pressing the end surface S1 of the substrate S.

Further, the driving force conversion mechanism unit 72 may be fixed to the upper surface of the substrate housing portion 31, for example, and may be vertically opposed. In this case, the pressing member 70 is raised at a pair of connecting members 78 and 79, and is located at a height (a pressable position) substantially equal to the substrate S placed on the damper 32, and a pair of connecting members. When the 78 and 79 are tilted, the substrate S can be placed above the substrate S placed on the buffer 32 (retracted position) while still being parallel to the substrate S.

As shown in FIGS. 10 to 12, the second positioner 8 is constituted by an electric cylinder mechanism, that is, a cylinder mechanism 81, which is provided outside the substrate housing portion 31 of the load lock processing chamber 30, and more specifically, has : extending from the side wall orthogonal to the X direction of the load lock processing chamber 30 or the substrate housing portion 31 to the outside of the load lock processing chamber 30 so as to be formed at substantially the same height as the lower end portion of the bumper 32 The cylinder body 83 in the direction and the piston 84 provided in the cylinder body 83 are retractable. Further, the pusher 80 is provided at the front end portion of the piston 84.

Further, one of the pair of cylinder mechanisms 71 and one of the pair of cylinder mechanisms 81 may be replaced by other cylinders such as air cylinders instead of the electric cylinders. Further, the drive mechanism for moving the pushers 70 and 80 may be driven in the X direction in addition to the cylinder mechanisms 71 and 81, and may be stopped in any X direction regardless of the principle or type of operation, for example. It can be an electromagnet motor, a solenoid, a piezoelectric element, or the like.

The pusher 80 is formed in the same manner as the pressing body 700 of the pusher 70, and is formed by using a material that does not cause damage or breakage of the end surface S2 of the substrate S that is in contact with the substrate S, and is not easily caused by contact with the substrate S. Further, the pressing surface is formed in an arc shape so as to be in contact with the end surface S2 of the substrate S in the horizontal direction. Further, the pusher 80 may be a rotating body that is, for example, a columnar shape with the height direction as an axis. Further, it is preferable to connect the pusher 80 and the piston 84 via a cushioning means such as the joint portion 702, and it is possible to alleviate the flushing of the pusher 80 when pressing the end surface S2 of the substrate S.

According to such a configuration, the second positioner 8 can move the pusher 80 to the center of the substrate accommodating portion 31 in the X direction by the movement of the piston 84 of the cylinder mechanism 81, and the piston 84 of the cylinder mechanism 81 can be retracted. The pusher 80 is moved to the outside in the X direction of the substrate housing portion 31.

Next, a method of aligning the substrate of the substrate alignment device will be described with reference to FIGS. 10 to 12. 10 is a first stage for explaining the operation of the substrate alignment device, FIG. 11 is a second stage for explaining the operation of the substrate alignment device, and FIG. 12 is a third stage for explaining the operation of the substrate alignment device. .

First, in a state where the pistons 74 and 84 of the cylinder mechanisms 71 and 81 provided in the first and second positioners 7 and 8 are completely retracted, the substrate S is transported to the substrate housing unit 31 and placed in the buffer. At 32, the pistons 74 and 84 of the cylinder mechanisms 71 and 81 are respectively moved in and out (see Fig. 10).

When the piston 74 of the cylinder mechanism 71 is moved in and out with a predetermined stroke, the active sliding member 76 is slid toward the center in the X direction of the substrate housing portion 31. At this moment, the cam portion 780 will rise along the inside of the cam hole 763, and the tension coil spring 755 will also act, and the pair of connecting members 78, 79 can be erected to rotate, and the pusher 70 by the retracted position It will rise to the pushable position (refer to Figure 11).

When the piston 74 of the cylinder mechanism 71 is moved in and out with a predetermined stroke, the active sliding member 76 is further slid toward the center in the X direction of the substrate housing portion 31. At this moment, the pressing plate portion 762 abuts against the pressed portion 772 to press the pressed portion 772, and resists the biasing force of the tension coil spring 754, and slides the driven sliding member 77 toward the center of the substrate housing portion 31 in the Y direction. When the pusher 70 is moved, the pusher 70 that can push the position moves toward the center in the Y direction of the substrate housing portion 31, and abuts against the end surface S1 of the substrate S to press the end surface S1 (see FIG. 12).

On the other hand, when the piston 84 of the cylinder mechanism 81 is moved in and out with a predetermined stroke, the pressing member 80 moves toward the center in the X direction of the substrate housing portion 31, and abuts against the end surface S2 of the substrate S to press the end surface S2.

In this manner, the end faces S1 and S2 of the substrate S are pressed by the first and second positioners 7 and 8, so that the substrate S is positioned at a predetermined position on the buffer 32. Further, the inlet and outlet driving of the pair of cylinder mechanisms 71 and 81 can be simultaneously performed, or the cylinder mechanisms 71 and 81 of one of the pair of cylinder mechanisms 71 and 81 can be driven in and out, and then the other cylinder mechanisms 71 and 81 can be driven in and out. .

Once the alignment of the substrate S is completed, the pistons 74, 84 of the cylinder mechanisms 71, 81 are retracted, respectively. When the piston 74 is retracted by the predetermined stroke, the active sliding member 76 slides outward in the X direction of the substrate housing portion 31. At this point, the driven sliding member 77 that is biased by the tension coil spring 754 slides outward in the Y direction of the substrate housing portion 31, whereby the pressing member 70 that abuts against the end surface S1 of the substrate S passes to the substrate housing portion 31. The Y direction moves outward, and is separated from the end surface S1 and moved to the pushable position.

When the piston 74 is further retracted by a predetermined stroke, for example, the active sliding member 76 is further slid outward in the X direction of the substrate housing portion 31. At this moment, the cam portion 780 is lowered along the inside of the cam hole 763, against the biasing force of the tension coil spring 755, and the pair of coupling members 78, 79 can be tilted to rotate, thereby pushing the position of the pusher 70 will fall to the retreat position.

On the other hand, when the piston 84 of the cylinder mechanism 81 is completely retracted for a predetermined stroke, for example, the pusher 80 moves outward in the X direction of the substrate housing portion 31, and is separated from the end surface S2 of the substrate S.

As described above, when the pushers 70 and 80 are retracted from the transport path of the substrate S, the substrate S is transported to one of the process chambers 10a, 10b, and 10c. The substrate S aligned by the first and second positioners 7 and 8 is transported to the normal processing position in the processing chambers 10a, 10b, and 10c, so that high precision of processing unevenness can be achieved. Process.

In the present embodiment, the first and second positioners 7 and 8 respectively push the pistons 74 and 84 of the cylinder mechanisms 71 and 81 provided separately, so that the pushers 70 and 80 can press the first of the substrates S. The second end faces S1 and S2 are provided with a driving force conversion mechanism unit 72 for the first positioner 7 that presses the first end face S1 of the transport path of the substrate S, and the pusher 70 is moved to the retracted position and can be pushed. Between the positions, the pushable position is moved in the pressing direction, and the pusher 70 can be prevented from moving from the transport path of the substrate S. Therefore, the installation space of the alignment member of the substrate housing portion 31 can be remarkably reduced. And a space for avoiding movement from the transport path of the substrate S. Therefore, the space around the substrate S of the substrate housing portion 31 can be minimized, and the load lock processing chamber 30 can be miniaturized as much as possible.

Further, in the present embodiment, since the cylinder mechanisms 71 and 81 for moving the pressing members 70 and 80 are provided outside the substrate housing portion 31 of the load lock processing chamber 30, the substrate housing portion 31 can be further reduced. The setting space of the component for alignment.

Further, in the first positioner 7, the driving force conversion mechanism unit 72 converts the driving force in the X direction of the piston 74 of the cylinder mechanism 71 into the driving force in the Y direction and the height direction, and pushes the driving force. The sub-70 is moved between the retracted position and the pushable position, and the pushable position is used as the start point and the end point to move in the pressing direction and the direction opposite to the pressing direction, so that the first and second positioning can be configured. The cylinder mechanisms 71, 81 of the devices 7, 8 are disposed on the same side wall of the load lock processing chamber 30, whereby the space on the upper side and the lower side of the load lock processing chamber 30 can be effectively utilized. Further, the driving force conversion mechanism unit 72 moves the pusher 70 between the retracted position and the pushable position by the one-stroke entry and exit of the piston 74, and the pushable position is used as the start point and the end point. Since it moves in the pressing direction and the direction opposite to the pressing direction, the alignment operation of the substrate S is easy.

Further, the positions at which the first and second positioners 7 and 8 are disposed on the substrate accommodating portion 31 are not limited to the vicinity of the corner portions facing each other. As shown in FIG. 13 (FIG. 13 is a modification example showing the arrangement positions of the first and second positioners constituting the substrate alignment device), a pair of first positioners 7 may be disposed, that is, in the substrate housing portion 31. In the vicinity of the corners adjacent to each other in the Y direction, the second positioners 8 that are disposed in the Y direction are arranged in the X direction in the vicinity of the respective corner portions of the substrate housing portion 31. In this case, for example, instead of the electric cylinder, the cylinder mechanism 71 of one of the first positioners 7 may be constituted by the air pressure cylinder, and instead of the electric cylinder, the first cylinder adjacent to the pair may be formed by the air cylinder. The cylinder mechanism 81 (81a, 81b) of the second positioner 8 in the Y direction on the positioner 7 side. Thereby, the number of electric cylinders can be reduced, so that the cost of the apparatus can be reduced. In the case of the registration substrate S, for example, the pistons 74 and 84 of the cylinder mechanisms 71 and 81 formed of the air cylinders are moved in and out, and the pistons 74 and 84 of the cylinder mechanisms 71 and 81 formed of the electric cylinders are moved in and out.

The present invention is not limited to the above embodiment, and various modifications can be made. The container for accommodating the substrate is not limited to the load lock processing chamber 30, and may be the process chambers 10a, 10b, 10c or the transfer chamber 20, etc. The substrate is not limited to the glass substrate for FPD, and may be another substrate such as a semiconductor wafer. Further, the substrate accommodating portion may be provided in three or more stages in the container.

7. . . First positioner (first pressing mechanism)

8. . . Second positioner (second pushing mechanism)

30. . . Load lock processing chamber (container)

31. . . Substrate housing

32. . . Buffer (substrate mounting unit)

33, 34. . . Opening

35. . . Spherical roller

70, 80. . . Pusher

71, 81. . . Cylinder mechanism (drive mechanism)

72. . . Driving force conversion mechanism

74, 84. . . piston

75. . . Guide member

76. . . Active sliding member

77. . . Driven sliding member

78, 79. . . Connecting member

S. . . Substrate

S1. . . First end face

S2. . . Second end face

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view schematically showing a substrate aligning apparatus according to an embodiment of the present invention applied to a plasma processing apparatus for loading a lock processing chamber.

Fig. 2 is a horizontal cross-sectional view schematically showing the inside of the plasma processing apparatus.

3 is a block diagram showing a schematic configuration of a control unit.

Figure 4 is a perspective view showing a portion of the load lock processing chamber cut away.

Fig. 5 is an exploded perspective view showing a driving force conversion mechanism unit.

Fig. 6 is a perspective view for explaining a first stage of the operation of the driving force conversion mechanism unit.

Fig. 7 is a perspective view for explaining a second stage of the operation of the driving force conversion mechanism unit.

Fig. 8 is a perspective view for explaining a third stage of the operation of the driving force conversion mechanism unit.

Fig. 9 is a partially cutaway plan view showing the driving force conversion mechanism portion.

Fig. 10 is a view for explaining a first stage of the operation of the substrate alignment device.

Fig. 11 is a view for explaining a second stage of the operation of the substrate alignment device.

Fig. 12 is a view for explaining a third stage of the operation of the substrate alignment device.

FIG. 13 is a view showing a modified example of the arrangement positions of the first and second positioners constituting the substrate registration device.

7. . . First positioner (first pressing mechanism)

8. . . Second positioner (second pushing mechanism)

31. . . Substrate housing

32. . . Buffer (substrate mounting unit)

36. . . Support pin

70, 80. . . Pusher

71, 81. . . Cylinder mechanism (drive mechanism)

72. . . Driving force conversion mechanism

73. . . Cylinder body

74, 84. . . piston

75. . . Guide member

76. . . Active sliding member

77. . . Driven sliding member

78, 79. . . Connecting member

83. . . Cylinder body

700. . . Push the body

754. . . Stretch coil spring

755. . . Stretch coil spring

762. . . Push plate

763. . . Cam hole

772. . . Pushed part

780. . . Cam section

S. . . Substrate

S1. . . First end face

S2. . . Second end face

Claims (13)

A substrate alignment device that transports an opening provided in a side wall of a container in a horizontal direction, and a rectangular substrate placed on the substrate mounting portion in the container is placed on the substrate mounting portion, and is characterized in that A pair of first pressing mechanisms for pressing a pair of first end faces of the substrate orthogonal to the conveying direction, and a pair of second pressing mechanisms for pressing the substrates along the conveying direction a pair of second end faces, each of the first pressing mechanism and the second pressing mechanism having a driving mechanism and a pressing member that presses the first end surface and the second end surface by driving of the driving mechanism, the one At least one of the pair of first pressing mechanisms further includes a driving force conversion mechanism unit that is a cylinder mechanism having a piston that is horizontal and moves forward and backward in a direction orthogonal to the conveying direction of the substrate, and the driving mechanism is provided by the driving mechanism The driving of the first pressing mechanism is moved between a retracted position that is retracted outside the transport path of the substrate and a pushable position of the pushable substrate, and is moved at the pushable position. Pushing direction The driving force conversion mechanism unit moves the pusher at the retracted position to the pushable position when the piston of the cylinder mechanism moves in and out of a predetermined stroke, and if the piston of the cylinder mechanism enters and exits with a predetermined stroke And moving the pressing member at the pressing position to the pressing direction, and pressing the first end surface, and in a state where the first end surface is pressed, if the piston of the cylinder mechanism is Fixed stroke And the pressing member that presses the first end surface state is moved to the pushable position, and when the piston of the cylinder mechanism is retracted by the predetermined stroke, the pusher movement at the pushable position is moved To the above retreat position. The substrate alignment device of claim 1, wherein the drive mechanism is disposed outside the container. The substrate alignment device according to claim 1 or 2, wherein the driving force conversion mechanism unit is provided above or below a conveyance path of the substrate, and the first pressing mechanism is driven by the drive mechanism The pusher moves between the retracted position of the retracted and the pushable position of the pushable substrate in a state parallel to the transport path, above and below the transport path of the substrate, and at the pushable position Move in the pushing direction. The substrate alignment device of claim 1, wherein the driving force conversion mechanism portion has a guiding member fixed in the container, and an active sliding member coupled to the piston of the cylinder mechanism Advancing and retreating together along the guiding member to slide in the advancing and retracting direction of the piston; the driven sliding member is horizontally and slidably and actively along the guiding member along with the sliding of the predetermined stroke of the active sliding member a direction in which the moving direction of the sliding member is orthogonal; and a connecting member rotatably provided at the one end portion of the driven sliding member, and the pressing member is rotatably provided at the other end portion, along with the active sliding member The slip of the specified stroke, centered on the one end Rotating to tilt and stand up, the connecting member is rotated to be tilted and raised, and the pressing member is moved between the retracted position and the pushable position, and the driven sliding member is slid The pusher moves in the pressing direction and the direction opposite to the pressing direction by using the pushable position as the start point and the end point. The substrate alignment device according to the first or second aspect of the invention, wherein the first pressing mechanism and the second pressing mechanism each have a buffering means for buffering the pressing member to press the first end surface And the punch at the second end face. A substrate accommodating unit includes a container having an opening in a side wall, and a substrate accommodating portion that is transported to a horizontal rectangular substrate from the opening, and a substrate mounting portion that is provided in the substrate accommodating portion. a substrate that is housed in the substrate housing portion; and a substrate alignment device that positions the substrate placed on the substrate mounting portion on the substrate mounting portion, wherein the substrate alignment device is A pair of first pressing mechanisms for pressing a pair of first end faces of the substrate orthogonal to the conveying direction, and a pair of second pressing mechanisms for pressing the substrates along the conveying direction a pair of second end faces, wherein the first pressing mechanism and the second pressing mechanism respectively have a driving mechanism and the first end face and the second end are pressed by driving of the driving mechanism At least one of the pair of first pressing means further includes a driving force conversion mechanism portion that is a piston that has a horizontal direction and moves forward and backward in a direction orthogonal to the conveying direction of the substrate. In the cylinder mechanism, the pusher of the first pressing mechanism is moved between the retracted position outside the transport path retracted to the substrate and the pushable position of the pushable substrate by driving of the drive mechanism. And the driving force conversion mechanism unit moves the pusher of the retracted position to the pushable position when the piston of the cylinder mechanism moves in and out of the predetermined stroke at the pushable position. When the piston of the cylinder mechanism moves in and out of the predetermined stroke, the pressing member at the pressing position is moved in the pressing direction, and the first end surface can be pressed and pushed on the first end surface. In the pressed state, when the piston of the cylinder mechanism is retracted by a predetermined stroke, the pressing member that presses the first end surface state is moved to the pushable position, and The more the piston cylinder mechanism at a predetermined retracting stroke, so that the above-described pressing position can be pressed against the child moves to the retracted position. The substrate storage unit according to claim 6, wherein the drive mechanism is provided outside the substrate housing portion of the container. The substrate storage unit according to claim 6 or 7, wherein the driving force conversion mechanism unit is provided above or below a conveyance path of the substrate, and the first pressing mechanism is driven by the driving mechanism. The pusher moves above or below the transport path of the substrate. In a state parallel to the transport path, the retracted retracted position and the pushable position of the pushable substrate are moved, and the pushable position is moved in the pressing direction. The substrate housing unit according to the sixth aspect of the invention, wherein the driving force conversion mechanism unit includes: a guiding member fixed to the substrate housing portion; and an active sliding member coupled to the piston of the cylinder mechanism Advancing and retreating together along the guiding member to slide in the advancing and retracting direction of the piston; the driven sliding member is horizontally and slidably and actively along the guiding member along with the sliding of the predetermined stroke of the active sliding member a direction in which the moving direction of the sliding member is orthogonal; and a connecting member rotatably provided at the one end portion of the driven sliding member, and the pressing member is rotatably provided at the other end portion, along with the active sliding member The slip of the predetermined stroke is rotated to be tilted and raised around the one end portion, and the pressing member is rotated to be tilted and raised to move the pusher to the retracted position and the pushable position. By sliding the driven sliding member, the pressing member moves in the pressing direction with the pushable position as a starting point and an ending point, and Push in the opposite direction. The substrate storage unit according to claim 6 or 7, wherein each of the first pressing mechanism and the second pressing mechanism further has a buffering means for buffering the pressing member to press the first end surface and The punch at the second end face. A substrate storage unit according to claim 6 or 7 of the patent application, The substrate mounting portion has a rotatable spherical roller that abuts against the back surface of the substrate to be conveyed. The substrate storage unit according to claim 6 or 7, wherein the container has the substrate storage portion of two or more stages. The substrate storage unit according to claim 6 or 7, wherein the container is a load lock processing chamber, wherein the openings are openably and closably provided on opposite side walls, and each of the openings is in a vacuum state. The vacuum processing chamber in which the predetermined treatment is applied to the substrate can be internally communicated with the atmosphere side, and when the substrate is transferred to the atmosphere side, the inside is held near the atmospheric pressure, and when the substrate is transferred to the vacuum processing chamber. The interior will be kept under vacuum.