JP4638818B2 - 無電解金めっき液 - Google Patents

無電解金めっき液 Download PDF

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Publication number
JP4638818B2
JP4638818B2 JP2005506873A JP2005506873A JP4638818B2 JP 4638818 B2 JP4638818 B2 JP 4638818B2 JP 2005506873 A JP2005506873 A JP 2005506873A JP 2005506873 A JP2005506873 A JP 2005506873A JP 4638818 B2 JP4638818 B2 JP 4638818B2
Authority
JP
Japan
Prior art keywords
gold plating
plating solution
group
gold
electroless gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005506873A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2004111287A1 (ja
Inventor
徹 伊森
義幸 日角
善久 藤平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority claimed from PCT/JP2004/004656 external-priority patent/WO2004111287A1/ja
Publication of JPWO2004111287A1 publication Critical patent/JPWO2004111287A1/ja
Application granted granted Critical
Publication of JP4638818B2 publication Critical patent/JP4638818B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP2005506873A 2003-06-10 2004-03-31 無電解金めっき液 Expired - Lifetime JP4638818B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2003164807 2003-06-10
JP2003164807 2003-06-10
JP2003416315 2003-12-15
JP2003416315 2003-12-15
PCT/JP2004/004656 WO2004111287A1 (ja) 2003-06-10 2004-03-31 無電解金めっき液

Publications (2)

Publication Number Publication Date
JPWO2004111287A1 JPWO2004111287A1 (ja) 2006-07-20
JP4638818B2 true JP4638818B2 (ja) 2011-02-23

Family

ID=33554380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005506873A Expired - Lifetime JP4638818B2 (ja) 2003-06-10 2004-03-31 無電解金めっき液

Country Status (5)

Country Link
JP (1) JP4638818B2 (zh)
KR (1) KR100749992B1 (zh)
CN (1) CN100510174C (zh)
HK (1) HK1090096A1 (zh)
TW (1) TWI284157B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP4941650B2 (ja) * 2007-01-11 2012-05-30 上村工業株式会社 無電解金めっき浴のめっき能維持管理方法
JP5013077B2 (ja) * 2007-04-16 2012-08-29 上村工業株式会社 無電解金めっき方法及び電子部品
JP6619563B2 (ja) * 2015-04-30 2019-12-11 日本高純度化学株式会社 無電解金めっき液、アルデヒド−アミン付加体補給液及びそれらを用いて形成した金皮膜
CN105543816A (zh) * 2016-02-01 2016-05-04 哈尔滨工业大学（威海） 一种化学镀金液

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3920462B2 (ja) * 1998-07-13 2007-05-30 株式会社大和化成研究所 貴金属を化学的還元析出によって得るための水溶液

Also Published As

Publication number Publication date
TWI284157B (en) 2007-07-21
CN1802452A (zh) 2006-07-12
TW200500496A (en) 2005-01-01
KR100749992B1 (ko) 2007-08-16
WO2004111287A2 (ja) 2004-12-23
KR20060031617A (ko) 2006-04-12
WO2004111287A3 (ja) 2005-03-03
CN100510174C (zh) 2009-07-08
HK1090096A1 (en) 2006-12-15
JPWO2004111287A1 (ja) 2006-07-20

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