HK1090096A1 - Electroless gold plating solution - Google Patents

Electroless gold plating solution

Info

Publication number
HK1090096A1
HK1090096A1 HK06110514.0A HK06110514A HK1090096A1 HK 1090096 A1 HK1090096 A1 HK 1090096A1 HK 06110514 A HK06110514 A HK 06110514A HK 1090096 A1 HK1090096 A1 HK 1090096A1
Authority
HK
Hong Kong
Prior art keywords
plating solution
gold plating
electroless gold
electroless
solution
Prior art date
Application number
HK06110514.0A
Other languages
English (en)
Inventor
Toru Imori
Yoshiyuki Hisumi
Yoshihisa Fujihira
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2004/004656 external-priority patent/WO2004111287A1/ja
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Publication of HK1090096A1 publication Critical patent/HK1090096A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
HK06110514.0A 2003-06-10 2006-09-21 Electroless gold plating solution HK1090096A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003164807 2003-06-10
JP2003416315 2003-12-15
PCT/JP2004/004656 WO2004111287A1 (ja) 2003-06-10 2004-03-31 無電解金めっき液

Publications (1)

Publication Number Publication Date
HK1090096A1 true HK1090096A1 (en) 2006-12-15

Family

ID=33554380

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06110514.0A HK1090096A1 (en) 2003-06-10 2006-09-21 Electroless gold plating solution

Country Status (5)

Country Link
JP (1) JP4638818B2 (zh)
KR (1) KR100749992B1 (zh)
CN (1) CN100510174C (zh)
HK (1) HK1090096A1 (zh)
TW (1) TWI284157B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526459B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
JP4941650B2 (ja) * 2007-01-11 2012-05-30 上村工業株式会社 無電解金めっき浴のめっき能維持管理方法
JP5013077B2 (ja) * 2007-04-16 2012-08-29 上村工業株式会社 無電解金めっき方法及び電子部品
JP6619563B2 (ja) * 2015-04-30 2019-12-11 日本高純度化学株式会社 無電解金めっき液、アルデヒド−アミン付加体補給液及びそれらを用いて形成した金皮膜
CN105543816A (zh) * 2016-02-01 2016-05-04 哈尔滨工业大学（威海） 一种化学镀金液

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3920462B2 (ja) * 1998-07-13 2007-05-30 株式会社大和化成研究所 貴金属を化学的還元析出によって得るための水溶液

Also Published As

Publication number Publication date
JP4638818B2 (ja) 2011-02-23
TWI284157B (en) 2007-07-21
CN1802452A (zh) 2006-07-12
TW200500496A (en) 2005-01-01
KR100749992B1 (ko) 2007-08-16
WO2004111287A2 (ja) 2004-12-23
KR20060031617A (ko) 2006-04-12
WO2004111287A3 (ja) 2005-03-03
CN100510174C (zh) 2009-07-08
JPWO2004111287A1 (ja) 2006-07-20

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20240402