AU2001276851A1 - Electroless silver plating - Google Patents

Electroless silver plating

Info

Publication number
AU2001276851A1
AU2001276851A1 AU2001276851A AU7685101A AU2001276851A1 AU 2001276851 A1 AU2001276851 A1 AU 2001276851A1 AU 2001276851 A AU2001276851 A AU 2001276851A AU 7685101 A AU7685101 A AU 7685101A AU 2001276851 A1 AU2001276851 A1 AU 2001276851A1
Authority
AU
Australia
Prior art keywords
silver plating
electroless silver
electroless
plating
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001276851A
Inventor
Alexander S. Kozlov
Dave Narasimhan
Thirumalai Palanisamy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of AU2001276851A1 publication Critical patent/AU2001276851A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AU2001276851A 2000-07-06 2001-07-05 Electroless silver plating Abandoned AU2001276851A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/611,185 US6387542B1 (en) 2000-07-06 2000-07-06 Electroless silver plating
US09/611,185 2000-07-06
PCT/US2001/021037 WO2002004700A2 (en) 2000-07-06 2001-07-05 Electroless silver plating

Publications (1)

Publication Number Publication Date
AU2001276851A1 true AU2001276851A1 (en) 2002-01-21

Family

ID=24447963

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001276851A Abandoned AU2001276851A1 (en) 2000-07-06 2001-07-05 Electroless silver plating

Country Status (6)

Country Link
US (1) US6387542B1 (en)
EP (1) EP1297196A2 (en)
JP (1) JP2004502871A (en)
AU (1) AU2001276851A1 (en)
CA (1) CA2415724A1 (en)
WO (1) WO2002004700A2 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6429120B1 (en) 2000-01-18 2002-08-06 Micron Technology, Inc. Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals
JP2000212763A (en) * 1999-01-19 2000-08-02 Shipley Far East Ltd Silver alloy plating bath and formation of silver alloy coating film using it
US6376370B1 (en) * 2000-01-18 2002-04-23 Micron Technology, Inc. Process for providing seed layers for using aluminum, copper, gold and silver metallurgy process for providing seed layers for using aluminum, copper, gold and silver metallurgy
US7211512B1 (en) * 2000-01-18 2007-05-01 Micron Technology, Inc. Selective electroless-plated copper metallization
US6420262B1 (en) 2000-01-18 2002-07-16 Micron Technology, Inc. Structures and methods to enhance copper metallization
US7262130B1 (en) * 2000-01-18 2007-08-28 Micron Technology, Inc. Methods for making integrated-circuit wiring from copper, silver, gold, and other metals
US6674167B1 (en) * 2000-05-31 2004-01-06 Micron Technology, Inc. Multilevel copper interconnect with double passivation
US6423629B1 (en) * 2000-05-31 2002-07-23 Kie Y. Ahn Multilevel copper interconnects with low-k dielectrics and air gaps
US20030008243A1 (en) * 2001-07-09 2003-01-09 Micron Technology, Inc. Copper electroless deposition technology for ULSI metalization
US7220665B2 (en) * 2003-08-05 2007-05-22 Micron Technology, Inc. H2 plasma treatment
US8349393B2 (en) 2004-07-29 2013-01-08 Enthone Inc. Silver plating in electronics manufacture
SE0403042D0 (en) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Improved stabilization and performance of autocatalytic electroless process
PL1853671T3 (en) * 2005-03-04 2014-01-31 Inktec Co Ltd Conductive inks and manufacturing method thereof
KR100701851B1 (en) * 2006-03-14 2007-03-30 주식회사 잉크테크 Antibacterial Composition Containing Organic Silver Complexes, Antibacterial Treatment Methods Using The Same And Antibacterial Formed Article
KR100727483B1 (en) * 2006-04-29 2007-06-13 주식회사 잉크테크 Compositions for forming reflecting layer having organic silver complexes, and method for preparing reflecting layer using same
KR100853170B1 (en) * 2006-04-29 2008-08-20 주식회사 잉크테크 Aluminum Wheel Having High Gloss
US8282860B2 (en) * 2006-08-07 2012-10-09 Inktec Co., Ltd. Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same
US8764960B2 (en) * 2006-08-07 2014-07-01 Inktec Co., Ltd. Manufacturing methods for metal clad laminates
KR100776180B1 (en) 2006-08-07 2007-11-16 주식회사 잉크테크 Manufacturing methods for metal clad laminates
KR101296404B1 (en) * 2007-02-22 2013-08-14 주식회사 잉크테크 Conductive fibers and a method of manufacturing the same
KR101675493B1 (en) * 2008-03-18 2016-11-14 주식회사 잉크테크 Compositions for Multi-functional Coating
US8337609B2 (en) * 2009-12-01 2012-12-25 Silberline Manufacturing Co., Inc. Black pearlescent pigment with a metal layer
CN102074278B (en) * 2010-12-09 2011-12-28 温州宏丰电工合金股份有限公司 Preparation method of particle-aligned reinforced silver based contact material
US8652576B2 (en) * 2011-07-13 2014-02-18 Vidrio Plano De Mexico, S.A. De C.V. Method and system to form deletion windows on a glass substrate
US8966997B2 (en) 2011-10-12 2015-03-03 Stryker Corporation Pressure sensing mat
KR101483920B1 (en) 2011-12-15 2015-01-16 헨켈 아이피 앤드 홀딩 게엠베하 Electroless plating of silver onto graphite
IL220657A (en) 2012-06-26 2015-09-24 Zdf Ltd Coated optical fibres having improved features
US8997588B2 (en) 2012-09-29 2015-04-07 Stryker Corporation Force detecting mat with multiple sensor types
US8904876B2 (en) 2012-09-29 2014-12-09 Stryker Corporation Flexible piezocapacitive and piezoresistive force and pressure sensors
US9663667B2 (en) 2013-01-22 2017-05-30 Andre Reiss Electroless silvering ink
LT6518B (en) * 2016-09-13 2018-04-25 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Method for formation of electro-conductive traces on polymeric article surface
RU2644462C1 (en) * 2017-06-20 2018-02-12 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д. И. Менделеева (РХТУ им. Д. И. Менделеева) Composition for chemical silvering of ceramic materials
RU2661644C1 (en) * 2017-07-03 2018-07-18 Федеральное государственное бюджетное образовательное учреждение высшего образования "Рязанский государственный радиотехнический университет" Pyrophosphate-ammonium electrolyte of contact silvering

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2367903A (en) * 1943-09-03 1945-01-23 Hobbs Glass Ltd Spray method of making mirrors
US3960564A (en) * 1972-06-21 1976-06-01 U.S. Philips Corporation Physical development process utilizing a physical developer containing a specific reducing agent, a thiol compound
US3995371A (en) * 1974-10-10 1976-12-07 The Curators Of The University Of Missouri Electroless plating method for treating teeth
US4144361A (en) * 1977-07-06 1979-03-13 Nathan Feldstein Methods for applying metallic silver coatings
US4652465A (en) * 1984-05-14 1987-03-24 Nissan Chemical Industries Ltd. Process for the production of a silver coated copper powder and conductive coating composition
JPS6320486A (en) * 1986-07-11 1988-01-28 Sanyo Shikiso Kk Production of silver or copper coated mica
FI95816C (en) * 1989-05-04 1996-03-25 Ad Tech Holdings Ltd Antimicrobial article and method of making the same
KR960005765A (en) * 1994-07-14 1996-02-23 모리시다 요이치 Electroless plating bath and wiring forming method of semiconductor device used for wiring formation of semiconductor device

Also Published As

Publication number Publication date
EP1297196A2 (en) 2003-04-02
WO2002004700A2 (en) 2002-01-17
CA2415724A1 (en) 2002-01-17
WO2002004700A3 (en) 2003-01-09
US6387542B1 (en) 2002-05-14
JP2004502871A (en) 2004-01-29

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