AU2001277856A1 - Electroless rhodium plating - Google Patents

Electroless rhodium plating

Info

Publication number
AU2001277856A1
AU2001277856A1 AU2001277856A AU7785601A AU2001277856A1 AU 2001277856 A1 AU2001277856 A1 AU 2001277856A1 AU 2001277856 A AU2001277856 A AU 2001277856A AU 7785601 A AU7785601 A AU 7785601A AU 2001277856 A1 AU2001277856 A1 AU 2001277856A1
Authority
AU
Australia
Prior art keywords
rhodium plating
electroless rhodium
electroless
plating
rhodium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001277856A
Inventor
Alexander S. Kozlov
Dave Narasinham
Thirumalai Palanisamy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of AU2001277856A1 publication Critical patent/AU2001277856A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12875—Platinum group metal-base component
AU2001277856A 2000-07-06 2001-07-05 Electroless rhodium plating Abandoned AU2001277856A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/611,184 US6455175B1 (en) 2000-07-06 2000-07-06 Electroless rhodium plating
US09611184 2000-07-06
US09/611,184 2000-07-06
PCT/US2001/021258 WO2002004703A2 (en) 2000-07-06 2001-07-05 Electroless rhodium plating

Publications (1)

Publication Number Publication Date
AU2001277856A1 true AU2001277856A1 (en) 2002-01-21

Family

ID=24447960

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001277856A Abandoned AU2001277856A1 (en) 2000-07-06 2001-07-05 Electroless rhodium plating

Country Status (6)

Country Link
US (1) US6455175B1 (en)
EP (1) EP1337685A2 (en)
JP (1) JP2004502874A (en)
AU (1) AU2001277856A1 (en)
CA (1) CA2415781A1 (en)
WO (1) WO2002004703A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6645567B2 (en) * 2001-12-19 2003-11-11 Intel Corporation Electroless plating bath composition and method of using
CN1726431A (en) * 2002-10-21 2006-01-25 纳米墨水公司 Nanometer-scale engineered structures, methods and apparatus for fabrication thereof, and applications to mask repair, enhancement, and fabrications
US7164134B2 (en) * 2003-08-01 2007-01-16 General Electric Company High performance CT reflector for a scintillator array and method for making same
US20070012575A1 (en) * 2005-07-12 2007-01-18 Morrissey Ronald J Bright rhodium electrodeposition
JP5081830B2 (en) 2005-10-13 2012-11-28 ヴェロシス インコーポレイテッド Electroless plating in microchannels
US20100055422A1 (en) * 2008-08-28 2010-03-04 Bob Kong Electroless Deposition of Platinum on Copper
JP6046039B2 (en) 2010-08-30 2016-12-14 シュティヒティン・エネルギーオンデルツォイク・セントラム・ネーデルランド A new seeding method for the deposition of selective thin film layers.

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3486928A (en) * 1965-10-21 1969-12-30 Int Nickel Co Bath and process for platinum and platinum alloys
US3562911A (en) 1968-12-03 1971-02-16 Dentsply Int Inc Method and composition for platinum plating and articles plated therewith
CH606475A5 (en) 1976-02-05 1978-10-31 Bbc Brown Boveri & Cie
US4285784A (en) 1980-07-10 1981-08-25 The United States Of America As Represented By The Secretary Of The Interior Process of electroplating a platinum-rhodium alloy coating
JPS5751276A (en) 1980-09-13 1982-03-26 Agency Of Ind Science & Technol Manufacture of anode for electrolyzing water
SU1212954A1 (en) * 1983-06-14 1986-02-23 Ордена Трудового Красного Знамени Институт Химии И Химической Технологии Ан Литсср Method of producing trinitrotriamminrhodium
US5980345A (en) * 1998-07-13 1999-11-09 Alliedsignal Inc. Spark plug electrode having iridium based sphere and method for manufacturing same

Also Published As

Publication number Publication date
WO2002004703A3 (en) 2002-07-18
JP2004502874A (en) 2004-01-29
CA2415781A1 (en) 2002-01-17
US6455175B1 (en) 2002-09-24
WO2002004703A2 (en) 2002-01-17
EP1337685A2 (en) 2003-08-27

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