AU2001286266A1 - Electroless gold plating solution and method for electroless gold plating - Google Patents

Electroless gold plating solution and method for electroless gold plating

Info

Publication number
AU2001286266A1
AU2001286266A1 AU2001286266A AU8626601A AU2001286266A1 AU 2001286266 A1 AU2001286266 A1 AU 2001286266A1 AU 2001286266 A AU2001286266 A AU 2001286266A AU 8626601 A AU8626601 A AU 8626601A AU 2001286266 A1 AU2001286266 A1 AU 2001286266A1
Authority
AU
Australia
Prior art keywords
gold plating
electroless gold
plating solution
solution
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001286266A
Inventor
Kiyoshi Hasegawa
Kanji Murakami
Sumiko Nakajima
Akio Takahashi
Hiroshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of AU2001286266A1 publication Critical patent/AU2001286266A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AU2001286266A 2000-09-18 2001-09-18 Electroless gold plating solution and method for electroless gold plating Abandoned AU2001286266A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000282108 2000-09-18
JP2000-282108 2000-09-18
PCT/JP2001/008086 WO2002022909A1 (en) 2000-09-18 2001-09-18 Electroless gold plating solution and method for electroless gold plating

Publications (1)

Publication Number Publication Date
AU2001286266A1 true AU2001286266A1 (en) 2002-03-26

Family

ID=18766670

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001286266A Abandoned AU2001286266A1 (en) 2000-09-18 2001-09-18 Electroless gold plating solution and method for electroless gold plating

Country Status (8)

Country Link
US (1) US6811828B2 (en)
EP (1) EP1338675B1 (en)
JP (2) JP4356319B2 (en)
KR (1) KR100529984B1 (en)
CN (1) CN1195891C (en)
AU (1) AU2001286266A1 (en)
TW (1) TW539766B (en)
WO (1) WO2002022909A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3892730B2 (en) * 2002-01-30 2007-03-14 関東化学株式会社 Electroless gold plating solution
JP2005256140A (en) * 2004-03-15 2005-09-22 C Uyemura & Co Ltd Gold plating bath
CN1981347A (en) * 2004-07-15 2007-06-13 积水化学工业株式会社 Conductive microparticle, process for producing the same and anisotropic conductive material
JP4797368B2 (en) * 2004-11-30 2011-10-19 株式会社デンソー Manufacturing method of semiconductor device
KR100766715B1 (en) * 2006-06-12 2007-10-12 재단법인서울대학교산학협력재단 Electroless silver plating using amine
JP4941650B2 (en) * 2007-01-11 2012-05-30 上村工業株式会社 Plating ability maintenance management method of electroless gold plating bath
JP5526463B2 (en) * 2007-04-19 2014-06-18 日立化成株式会社 Electroless gold plating method for electronic parts and electronic parts
KR100892301B1 (en) * 2007-04-23 2009-04-08 한화석유화학 주식회사 Manufacturing Method of Conductive Ball Using Eletroless Plating
JP5371465B2 (en) * 2009-02-09 2013-12-18 メタローテクノロジーズジャパン株式会社 Non-cyan electroless gold plating solution and conductor pattern plating method
JP5428667B2 (en) * 2009-09-07 2014-02-26 日立化成株式会社 Manufacturing method of semiconductor chip mounting substrate
CN103556134B (en) * 2013-11-13 2015-11-25 湖南省化讯应用材料有限公司 The pretreatment process of process for electroless nickel plating
KR101444687B1 (en) * 2014-08-06 2014-09-26 (주)엠케이켐앤텍 Electroless gold plating liquid
CN105745355B (en) * 2014-08-25 2018-03-30 小岛化学药品株式会社 Reduced form chemical gold plating liquid and the electroless gold-plating method using the gold plating liquid
WO2016097083A2 (en) * 2014-12-17 2016-06-23 Atotech Deutschland Gmbh Plating bath composition and method for electroless plating of palladium
KR101678013B1 (en) * 2016-02-15 2016-11-21 주식회사 베프스 A plating solution with concentration-detecting indicators for determing supplement time of metal component and plating method of therewith
KR101661629B1 (en) * 2016-03-11 2016-09-30 주식회사 베프스 Plationg solution of Amorphous PZT and plating method of the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5116664A (en) * 1988-02-09 1992-05-26 Shiseido Company Ltd. Titanium-mica composite material
US4919720A (en) * 1988-06-30 1990-04-24 Learonal, Inc. Electroless gold plating solutions
JP2866676B2 (en) * 1989-09-18 1999-03-08 株式会社日立製作所 Electroless gold plating solution and gold plating method using the same
DE69406701T2 (en) * 1993-03-26 1998-04-02 Uyemura & Co C Chemical gilding bath
JP3152008B2 (en) * 1993-04-23 2001-04-03 日立化成工業株式会社 Electroless gold plating solution
JPH0971871A (en) * 1995-09-06 1997-03-18 Merutetsukusu Kk Electroless gold plating liquid
JPH1112753A (en) * 1997-06-20 1999-01-19 Hitachi Chem Co Ltd Electroless gold plating method
US5935306A (en) * 1998-02-10 1999-08-10 Technic Inc. Electroless gold plating bath

Also Published As

Publication number Publication date
WO2002022909A1 (en) 2002-03-21
EP1338675A4 (en) 2009-04-01
TW539766B (en) 2003-07-01
EP1338675A1 (en) 2003-08-27
US20040028833A1 (en) 2004-02-12
CN1460131A (en) 2003-12-03
CN1195891C (en) 2005-04-06
KR20030045071A (en) 2003-06-09
JPWO2002022909A1 (en) 2004-02-26
KR100529984B1 (en) 2005-11-22
JP2009235577A (en) 2009-10-15
EP1338675B1 (en) 2016-11-09
US6811828B2 (en) 2004-11-02
JP4356319B2 (en) 2009-11-04

Similar Documents

Publication Publication Date Title
EP1335038A4 (en) Device and method for electroless plating
AU2001276851A1 (en) Electroless silver plating
AU2003272455A1 (en) Electroless plating solution and process
EP1418619A4 (en) Semiconductor device and production method therefor, and plating solution
AU2233399A (en) Plating apparatus and method
AU2001286266A1 (en) Electroless gold plating solution and method for electroless gold plating
AU2003243015A1 (en) Electroless plating apparatus and post-electroless plating cleaning method
AU6478201A (en) Mobile plating system and method
AU2003241758A1 (en) Electroless plating apparatus and electroless plating method
NL1015624A1 (en) Electroless plating method and electroless plating solution.
AU2001278794A1 (en) Electroless displacement gold plating solution and additive for preparing said plating solution
EP1113094A3 (en) Plating analysis method
GB2382353B (en) Palladium Plating Solution
AU2002218776A1 (en) Electroless autocatalytic platinum plating
EP1243672A4 (en) Plating device and plating method
AU2003211563A1 (en) Gold plating solution and method for gold plating
AU7319900A (en) Electroless plating method
SG83221A1 (en) Alloy composition and plating method
AU2003241759A1 (en) Method of electroless plating
EP1146147A4 (en) Gold plating liquid and method of plating using the gold plating liquid
AU2003241757A1 (en) Method of electroless plating
AU2001277856A1 (en) Electroless rhodium plating
AU2003296142A1 (en) Method for electroless plating
AU2003301573A1 (en) Substitution type electroless gold plating bath
AU2001249378A1 (en) Anti-scavenging solders for silver metallization and method