JP4632037B2 - 熱圧着装置及び半導体装置の搭載装置 - Google Patents

熱圧着装置及び半導体装置の搭載装置 Download PDF

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Publication number
JP4632037B2
JP4632037B2 JP2005105797A JP2005105797A JP4632037B2 JP 4632037 B2 JP4632037 B2 JP 4632037B2 JP 2005105797 A JP2005105797 A JP 2005105797A JP 2005105797 A JP2005105797 A JP 2005105797A JP 4632037 B2 JP4632037 B2 JP 4632037B2
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Prior art keywords
thermocompression bonding
display panel
unit
thermocompression
semiconductor device
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Expired - Fee Related
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JP2005105797A
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Japanese (ja)
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JP2006287011A (ja
JP2006287011A5 (enExample
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淳 斧城
忠 関
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2005105797A priority Critical patent/JP4632037B2/ja
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Publication of JP2006287011A5 publication Critical patent/JP2006287011A5/ja
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  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2005105797A 2005-04-01 2005-04-01 熱圧着装置及び半導体装置の搭載装置 Expired - Fee Related JP4632037B2 (ja)

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JP2005105797A JP4632037B2 (ja) 2005-04-01 2005-04-01 熱圧着装置及び半導体装置の搭載装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005105797A JP4632037B2 (ja) 2005-04-01 2005-04-01 熱圧着装置及び半導体装置の搭載装置

Publications (3)

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JP2006287011A JP2006287011A (ja) 2006-10-19
JP2006287011A5 JP2006287011A5 (enExample) 2008-04-24
JP4632037B2 true JP4632037B2 (ja) 2011-02-16

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JP2005105797A Expired - Fee Related JP4632037B2 (ja) 2005-04-01 2005-04-01 熱圧着装置及び半導体装置の搭載装置

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JP (1) JP4632037B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101139252B1 (ko) * 2006-11-20 2012-05-14 삼성전자주식회사 본딩장치
JP4392766B2 (ja) * 2007-08-21 2010-01-06 株式会社日立ハイテクノロジーズ Ａｃｆ貼り付け装置
CN101933128B (zh) * 2007-12-04 2012-08-29 松下电器产业株式会社 部件压接装置及方法
JP5479701B2 (ja) * 2008-10-06 2014-04-23 株式会社日立ハイテクノロジーズ 表示パネルモジュール組立装置
JP5356873B2 (ja) * 2009-03-24 2013-12-04 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
KR100945002B1 (ko) * 2009-07-20 2010-03-05 안동규 이방성 도전필름을 이용한 본딩장치
CN111801720A (zh) * 2018-03-12 2020-10-20 堺显示器制品株式会社 热压接装置
CN114566715B (zh) * 2022-03-21 2024-02-09 上海兰钧新能源科技有限公司 热压设备和热压方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3393562B2 (ja) * 1994-05-13 2003-04-07 ソニー株式会社 熱圧着装置
JP2877056B2 (ja) * 1995-12-06 1999-03-31 ソニーケミカル株式会社 熱圧着装置
JP4007031B2 (ja) * 2002-03-27 2007-11-14 松下電器産業株式会社 電子部品のボンディング方法

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JP2006287011A (ja) 2006-10-19

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